New Alternative Metal Coated Silver Bonding Wire for Gas Free Bonding & High Reliability Performance

2018 ◽  
Author(s):  
SangYeob Kim ◽  
SungMin Jeon ◽  
ChongMin Park ◽  
BuyngHoon Jung ◽  
SeungHyoun Kim ◽  
...  
Keyword(s):  
High Reliability ◽  
Bonding Wire ◽  
Reliability Performance

Process and Evaluation of High Reliability Reworkable Edge Bond Adhesives for Large Area BGA Applications

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 002018-002053
Author(s):  
Swapan Bhattacharya ◽  
Fei Xie ◽  
Daniel F. Baldwin ◽  
Han Wu ◽  
Kelley Hodge ◽  
...  
Keyword(s):  
High Performance ◽  
Printed Circuit Boards ◽  
Process Development ◽  
High Reliability ◽  
Optimum Process ◽  
Process Conditions ◽  
Harsh Environment ◽  
Mechanical Shock ◽  
Large Area ◽  
Reliability Performance

Reworkable underfills and edge bond adhesives are finding increasing utility in high reliability and harsh environment applications. The ASICs and FPGAs often used in these systems typically require designs incorporating large BGAs and ceramic BGAs. For these high reliability and harsh environment applications, these packages typically require underfill or edge bond materials to achieve the needed thermal cycle, mechanical shock and vibration reliability. Moreover, these applications often incorporate high dollar value printed circuit boards (on the order of thousands or tens of thousands of dollars per PCB) hence the need to rework these assemblies and maintain the integrity of the PCB and high dollar value BGAs. This further complicates the underfill requirements with a reworkability component. Reworkable underfills introduce a number of process issues that can result in significant variability in reliability performance. In contrast, edge bond adhesives provide a high reliability solution with substantial benefits over underfills. One interesting question for the large area BGA applications of reworkable underfills and edge bond materials is the comparison of their reliability performance. This paper presents a study of reliability comparison between two robust selected reworkable underfill and edge bond adhesive in a test vehicle including 11mm, 13mm, and 27mm large area BGAs. Process development for those large area BGA applications was also conducted on the underfill process and edge bond process to determine optimum process conditions. For underfill processing, establishing an underfill process that minimizing/eliminates underfill voids is critical. For edge bond processing, establishing an edge bond that maximizes bond area without encapsulating the solder balls is key to achieving high reliability. In addition, this paper also presents a study of new high performance reworkable edge bond materials designed to improve the reliability of large area BGAs and ceramic BGAs assemblies while maintaining good reworkablity. Four edge bond materials (commercially available) were studied and compared for a test vehicles with 12mm BGAs. The reliability testing protocol included board level thermal cycling (−40 to 125°C), mechanical drop testing (2900 G), and random vibration testing (3 G, 10 – 1000 Hz).

Critical Barriers Associated with Copper Wire

2015 ◽  
Vol 2015 (1) ◽  
pp. 000394-000398
Author(s):  
William G. Crockett
Keyword(s):  
High Reliability ◽  
Copper Wire ◽  
Automotive Electronics ◽  
Bonding Wire ◽  
Cu Alloy ◽  
Bonding Wires ◽  
Reducing Costs ◽  
Cu Bonding ◽  
Bonding Characteristics ◽  
Bare Copper

Since around 2008, the shift from Gold (Au) bonding wire to Copper (Cu) bonding wire has been taking place, full scale, with the aim of reducing costs. When compared with Au, Cu wire presents challenges in reliability and repeatable bonding characteristics in terms of chemical stability, which is required in high reliability applications. Therefore Cu wire adoption in automotive and industrial semiconductors has been limited. Conventionally the market for Cu bonding wires has been divided into two types: bare Cu wires (high purity) and Palladium coated copper (PCC) bonding wires. These wires have yet to satisfy the required characteristics for high reliability products such as industrial and automotive electronics. A new breed of alternative bonding wires has been developed to offer performance advantages for high reliability applications compared to bare copper wire and PCC wire. Cu alloy wire and Ag alloy wires continue their market introduction for advanced bonding applications, where bare Cu and PCC wires have known limitations.

Shared Situation Awareness as a Contributor to High Reliability Performance in Railroad Operations

2006 ◽  
Vol 27 (7) ◽  
pp. 967-987 ◽  
Author(s):  
Emilie M. Roth ◽  
Jordan Multer ◽  
Thomas Raslear
Keyword(s):  
Situation Awareness ◽  
High Reliability ◽  
Digital Technologies ◽  
Railroad Workers ◽  
Cooperative Strategies ◽  
Location Finding ◽  
Overall Efficiency ◽  
Reliability Performance ◽  
Work Domain ◽  
Shared Situation Awareness

Cooperative strategies of individuals within a distributed organization can contribute to increased efficiency of operations and safety. We examine these processes in the context of a particular work domain: railroad operations. Analyses revealed a variety of informal cooperative strategies that railroad workers have developed that span across multiple railroad crafts including roadway workers, train crews, and railroad dispatchers. These informal, proactive communications foster shared situation awareness across the distributed organization, facilitate work, and contribute to the overall efficiency, safety, and resilience to error of railroad operations. We discuss design implications for leveraging new digital technologies and location-finding systems to more effectively support these informal strategies, enhance shared situation awareness, and promote high reliability performance.

Development of a Digitally-Controlled Servo Amplifier for Robots

1994 ◽  
Vol 6 (2) ◽  
pp. 155-161
Author(s):  
Yuji Shindo ◽  
◽  
Takao Wada
Keyword(s):  
Digital Signal Processor ◽  
High Reliability ◽  
Digital Signal ◽  
Current Position ◽  
Power Transistors ◽  
Digitally Controlled ◽  
Reliability Performance ◽  
Signal Processor

Kawasaki Heavy Industries, Ltd. has developed a digitally-controlled servo amplifier for robot servo motors. The motor's armature current, position and velocity are controlled by the software in a digital signal processor. The servo is designed for high reliability, performance, flexibility and compactness. To achieve these objectives, we developed an ASIC which controls PWM signals for power transistors and encoder signals. The servo amplifier is currently used in the new Kawasaki AD series of robot controllers.

High Reliability and Thermal Performance FCBGA Package

2007 ◽  
Author(s):  
Gino Hung ◽  
Ho-Yi Tsai ◽  
Chun An Huang ◽  
Steve Chiu ◽  
C. S. Hsiao
Keyword(s):  
Thermal Performance ◽  
High Performance ◽  
Flip Chip ◽  
Dielectric Material ◽  
High Reliability ◽  
Lead Free ◽  
Molding Process ◽  
Molding Compound ◽  
Reliability Performance ◽  
Low K

A high reliability and high thermal performance molding flip chip ball grid arrays structure which was improved from Terminator FCBGA®. (The structure are shown as Fig. 1) It has many advantages, like better coplanarity, high through put (multi pes for each shut of molding process), low stress, and high thermal performance. In conventional flip chip structure, underfill dispenses and cure processes are a bottleneck due to low through put (dispensing unit by unit). For the high performance demand, large package/die size with more integrated functions needs to meet reliability criteria. Low k dielectric material, lead free bump especially and the package coplanarity are also challenges for package development. Besides, thermal performance is also a key concern with high power device. From simulation and reliability data, this new structure can provide strong bump protection and reach high reliability performance and can be applied for low-K chip and all kind of bump composition such as tin-lead, high lead, and lead free. Comparing to original Terminator FCBGA®, this structure has better thermal performance because the thermal adhesive was added between die and heat spreader instead of epoxy molding compound (EMC). The thermal adhesive has much better thermal conductivity than EMC. Furthermore, this paper also describes the process and reliability validation result.

scholarly journals A pursuit to reliability – Toward a structural based reliability framework (FSR)

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Ahmad Ghaith ◽  
Huimin Ma ◽  
Ashraf W. Labib
Keyword(s):  
Literature Review ◽  
Southern China ◽  
High Reliability ◽  
Central China ◽  
Institutional Setting ◽  
High Reliability Organizations ◽  
Content Type ◽  
High Hazard ◽  
Organizational Framework ◽  
Reliability Performance

PurposeHigh-reliability performance and high-hazard are intertwined in High-Reliability Organizations (HROs) operations; these organizations are highly safe, highly hazardous and highly significant for the modern society, not only for the valuable resources they have, but also the indispensable services they provide. This research intend to understand how HROs could produce high quality performance despite their challenging and demanding contexts. The research followed an emic approach to develop an organizational framework that reflects the contribution of the seeming traits of the organizations to the operations safety based on the workers point of views about the safety of workstations.Design/methodology/approachThis research adopted mixed methods of in-depth interviews and literature review to identify the structural characteristics of high-reliability organizations (HROs) embedded in the organizations studies and developed a theoretical based structural framework for HROs. Furthermore, a systemic literature review was adopted to find the evidence from the organizations literature for the identified characteristics from the interviews from the first stage. The setting for this study is six Chinese power stations, four stations in Hubei province central China and two stations in the southern China Guangdong province.FindingsThe organizational framework is a key determinant to achieve high-reliability performance; however, solely it cannot explain how HROs manage the risks of hazard events and operate safely in high-hazard environments. High-reliability performance is attributed to the interaction between two sets of determinants of safety and hazard. The findings of this research indicate that HROs systems would be described as reliable or hazardous depending on the tightly coupled setting, complexity, bureaucracy involvement and dynamicity within the systems from one hand, and safety orientation, failure intolerance, systemwide processing, the institutional setting and the employment of redundant systems on other hand.Originality/valueThe authors developed an organizational framework of organizing the safety work in HROs. The applied method of interviewing and literature review was not adopted in any other researches.

scholarly journals Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

Sensors ◽  
2020 ◽  
Vol 20 (15) ◽  
pp. 4077
Author(s):  
Tianshen Zhou ◽  
Shuying Ma ◽  
Daquan Yu ◽  
Ming Li ◽  
Tao Hang
Keyword(s):  
High Performance ◽  
Dynamic Range ◽  
High Reliability ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Automotive Application ◽  
Market Demand ◽  
Wafer Level ◽  
Reliability Performance ◽  
Silicon Vias

To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip scale packaging (WLCSP) technology using through silicon vias (TSV) needs to be developed to replace current chip on board (COB) packages. In this paper, a WLCSP with the size of 5.82 mm × 5.22 mm and thickness of 850 μm was developed for the backside illumination (BSI) CIS chip using a 65 nm node with a size of 5.8 mm × 5.2 mm. The packaged product has 1392 × 976 pixels and a resolution of up to 60 frames per second with more than 120 dB dynamic range. The structure of the 3D package was designed and the key fabrication processes on a 12” inch wafer were investigated. More than 98% yield and excellent optical performance of the CIS package was achieved after process optimization. The final packages were qualified by AEC-Q100 Grade 2.

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