Monitoring the Thermal Grease Degradation Based on the IGBT Junction Temperature Cooling Curves

2018 ◽  
Author(s):  
Shuai Zheng ◽  
Xiong Du ◽  
Jun Zhang ◽  
Yaoyi Yu ◽  
Quanming Luo ◽  
...  
Keyword(s):  
Junction Temperature ◽  
Cooling Curves ◽  
Thermal Grease ◽  
Grease Degradation

Thermal Analysis of High-Power LED Tube Lamp

2011 ◽  
Vol 308-310 ◽  
pp. 346-350 ◽  
Author(s):  
Xiang Jun Ma ◽  
Li Gang Wu ◽  
Shi Xun Dai ◽  
Bo You Zhou ◽  
Kun Bai ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Junction Temperature ◽  
Key Technology ◽  
High Power Led ◽  
Detailed Simulation ◽  
Simulation Results ◽  
Thermal Grease

Heat dissipation of high-power LED lamps has become a key technology to LED package due to the improvement of the LED output power. A detailed simulation of temperature distribution of three chips high-power LED tube lamp was made by finite element method. Based on the consistency of the LED lamp experimental and simulation results, the analyses of the effect of thermal conductivities of PCB, thermal grease, heat sink, convection coefficients and the length of the lamp on the junction temperature were made, which provide an effective reference for the thermal design.

Thermal Parameter Monitoring of IGBT Module Using Junction Temperature Cooling Curves

2019 ◽  
Vol 66 (10) ◽  
pp. 8148-8160 ◽  
Author(s):  
Jun Zhang ◽  
Xiong Du ◽  
Yaoyi Yu ◽  
Shuai Zheng ◽  
Pengju Sun ◽  
...  
Keyword(s):  
Thermal Parameter ◽  
Junction Temperature ◽  
Cooling Curves ◽  
Igbt Module ◽  
Parameter Monitoring

Design of Solar-Powered LED Road Lighting System

2019 ◽  
pp. 75-85
Author(s):  
Canan Perdahci ◽  
Hamdi Ozkan
Keyword(s):  
High Pressure ◽  
Renewable Energy Sources ◽  
Junction Temperature ◽  
Mercury Vapour ◽  
Light Sources ◽  
Street Lighting ◽  
Led Light ◽  
Road Lighting ◽  
Lighting Systems ◽  
High Pressure Sodium Lamp

Turkey is rich in terms of renewable energy sources and, therefore, is now encouraging the use of sustainable clean lighting systems in road applications. High pressure sodium lamp is the most widely used type in main roads, but other types of lamps such as mercury vapour lamps or metal halide lamps can be utilized for street lighting. Since it enables energy and money saving, LED light technology has replaced high pressure sodium lamps nowadays. Once solar power system (PV) is integrated with LED lamp for street lighting, the amount of saving and local impact might be enriched. LEDs used as light sources in road lighting luminaires with rising lumen values, decreasing junction temperature, higher colour rendering efficiency, longer lifetime have become more efficient than many light sources with the latest developments. Since the structure of the luminaires in which the LED light sources are used differs from that of the conventional light sources, the optical, thermal and electrical design of the LED luminaires must be considered differently. Thus, this study concentrates upon design considerations and the operating principle of solarpowered LED road lighting luminaire in details. Also, a simple solar panel system was designed and the economical values obtained at the end of 20 years were compared when using the ongrid system and the off-grid system.

Spray Cooling for Time Resolved Emission Measurements of ICs

2004 ◽  
Author(s):  
Rama R. Goruganthu ◽  
David Bethke ◽  
Shawn McBride ◽  
Tom Crawford ◽  
Jonathan Frank ◽  
...  
Keyword(s):  
Heat Flux ◽  
Thermal Performance ◽  
Flip Chip ◽  
Cooling System ◽  
Spray Cooling ◽  
Junction Temperature ◽  
Maximum Temperature ◽  
Uniform Heat Flux ◽  
High Heat Flux ◽  
Time Resolved

Abstract Spray cooling is implemented on an engineering tool for Time Resolved Emission measurements using a silicon solid immersion lens to achieve high spatial resolution and for probing high heat flux devices. Thermal performance is characterized using a thermal test vehicle consisting of a 4x3 array of cells each with a heater element and a thermal diode to monitor the temperature within the cell. The flip-chip packaged TTV is operated to achieve uniform heat flux across the die. The temperature distribution across the die is measured on the 4x3 grid of the die for various heat loads up to 180 W with corresponding heat flux of 204 W/cm2. Using water as coolant the maximum temperature differential across the die was about 30 °C while keeping the maximum junction temperature below 95 °C and at a heat flux of 200 W/cm2. Details of the thermal performance of spray cooling system as a function of flow rate, coolant

IR Thermography for Temperature Measurements and Fault Location on AlGaN/GaN HEMTs and MMICs

2015 ◽  
Author(s):  
Lény Baczkowski ◽  
Franck Vouzelaud ◽  
Dominique Carisetti ◽  
Nicolas Sarazin ◽  
Jean-Claude Clément ◽  
...  
Keyword(s):  
Fault Location ◽  
Hot Spot ◽  
Life Time ◽  
High Electron Mobility Transistors ◽  
Junction Temperature ◽  
High Electron ◽  
Ir Thermography ◽  
Operating Life ◽  
Gan Hemt ◽  
Electron Mobility Transistors

Abstract This paper shows a specific approach based on infrared (IR) thermography to face the challenging aspects of thermal measurement, mapping, and failure analysis on AlGaN/GaN high electron-mobility transistors (HEMTs) and MMICs. In the first part of this paper, IR thermography is used for the temperature measurement. Results are compared with 3D thermal simulations (ANSYS) to validate the thermal model of an 8x125pm AIGaN/GaN HEMT on SiC substrate. Measurements at different baseplate temperature are also performed to highlight the non-linearity of the thermal properties of materials. Then, correlations between the junction temperature and the life time are also discussed. In the second part, IR thermography is used for hot spot detection. The interest of the system for defect localization on AIGaN/GaN HEMT technology is presented through two case studies: a high temperature operating life test and a temperature humidity bias test.

scholarly journals A Fusion Algorithm for Online Reliability Evaluation of Microgrid Inverter IGBT

Electronics ◽  
2020 ◽  
Vol 9 (8) ◽  
pp. 1294 ◽  
Author(s):  
Chuankun Wang ◽  
Yigang He ◽  
Chenyuan Wang ◽  
Xiaoxin Wu ◽  
Lie Li
Keyword(s):  
Aging Process ◽  
Short Term Memory ◽  
Coupling Model ◽  
Reliability Evaluation ◽  
Junction Temperature ◽  
Stable Operation ◽  
Practical Case ◽  
Fusion Algorithm ◽  
Insulated Gate Bipolar Transistor ◽  
Damage Degree

Due to the diversity of distributed generation sources, microgrid inverters work under complex and changeable conditions. The core device of inverters, an insulated gate bipolar transistor (IGBT), bears a large amount of thermal stress impact, so its reliability is related to the stable operation of the microgrid. The effect of the IGBT aging process cannot be considered adequately with the existing reliability evaluation methods, which have not yet reached the requirements of online evaluation. This paper proposes a fusion algorithm for online reliability evaluation of microgrid inverter IGBT, which combines condition monitoring and reliability evaluation. Firstly, based on the microgrid inverter topology and IGBT characteristics, an electrothermal coupling model is established to obtain junction temperature data. Secondly, the segmented long short-term memory (LSTM) algorithm is studied, which can accurately predict the aging process of the IGBT and judge the aging state via the limited monitoring data. Then, the parameters of the electrothermal coupling model are corrected according to the aging process. Besides, the fusion algorithm is applied to the practical case. Finally, the data comparison verifies the feasibility of the fusion algorithm, whose cumulative damage degree and estimated life error are 5.10% and 5.83%, respectively.

scholarly journals Influence of a Thermal Pad on Selected Parameters of Power LEDs

Energies ◽  
2020 ◽  
Vol 13 (14) ◽  
pp. 3732
Author(s):  
Krzysztof Górecki ◽  
Przemysław Ptak ◽  
Tomasz Torzewicz ◽  
Marcin Janicki
Keyword(s):  
Optical Properties ◽  
Thermal Resistance ◽  
Optical Power ◽  
Junction Temperature ◽  
Operating Parameters ◽  
Cold Plate ◽  
Optical Efficiency ◽  
Forward Current ◽  
Measurement Results ◽  
Set Up

This paper is devoted to the analysis of the influence of thermal pads on electric, optical, and thermal parameters of power LEDs. Measurements of parameters, such as thermal resistance, optical efficiency, and optical power, were performed for selected types of power LEDs operating with a thermal pad and without it at different values of the diode forward current and temperature of the cold plate. First, the measurement set-up used in the paper is described in detail. Then, the measurement results obtained for both considered manners of power LED assembly are compared. Some characteristics that illustrate the influence of forward current and temperature of the cold plate on electric, thermal, and optical properties of the tested devices are presented and discussed. It is shown that the use of the thermal pad makes it possible to achieve more advantageous values of operating parameters of the considered semiconductor devices at lower values of their junction temperature, which guarantees an increase in their lifetime.

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