An Integral Heat Sink for Cooling Microelectronic Components

1993 ◽  
Vol 115 (3) ◽  
pp. 284-291 ◽  
Author(s):  
S. H. Bhavnani ◽  
C.-P. Tsai ◽  
R. C. Jaeger ◽  
D. L. Eison
Keyword(s):  
Heat Sink ◽  
Silicon Surface ◽  
Numerical Study ◽  
High Heat ◽  
Heat Fluxes ◽  
Silicon Surfaces ◽  
Source Surface ◽  
Mouth Size ◽  
Severe Constraint ◽  
Boiling Incipience

Liquid immersion cooling is rapidly becoming the mechanism of choice for the newest generation of supercomputers. Miniaturization at both the chip and module level places a severe constraint on the size of the heat sink employed to dissipate the high heat fluxes generated. A study was conducted to develop a surface that could augment boiling heat transfer from silicon surfaces under these constraints. The surface created consists of reversed pyramidal features etched directly on to the silicon surface. Experiments were conducted in a saturated pool of refrigerant-113 at atmospheric pressure. The inexpensive crystallographic etching techniques used to create the enhanced features are described in the paper. The main characteristics of interest in the present study were the incipient boiling superheat and the magnitude of the temperature overshoot at boiling incipience. Results were obtained for test sections with various cavity densities, and compared with data for the smooth untreated surface. It was found that incipient boiling superheat was reduced from a range of 27.0–53.0° C for the untreated silicon surface, to a range of 2.5–15.0° C for the enhanced surfaces. The overshoot also decreased considerably; from about 12.0–18.0° C for two classes of untreated surfaces, to a range of 1.5–5.3° C for the enhanced surfaces. The values of the incipient boiling superheat, and those of the overshoot decreased with a decrease in cavity mouth size. Two ratios of heat source surface area to the area of the enhanced surface were studied. The overshoot values obtained for these surfaces were compared with those observed for some commonly used enhanced surfaces. An elementary numerical study was conducted to estimate the magnitude of heat spreading.

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

2015 ◽  
Vol 137 (4) ◽  
Author(s):  
Craig Green ◽  
Peter Kottke ◽  
Xuefei Han ◽  
Casey Woodrum ◽  
Thomas Sarvey ◽  
...  
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Three Dimensional ◽  
High Heat ◽  
Heat Fluxes ◽  
Thermal Design ◽  
High Heat Flux ◽  
Two Phase ◽  
Forced Cooling ◽  
Fluidic Routing

Three-dimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking exacerbates an already difficult thermal problem. Localized hotspots within individual tiers can provide an additional challenge when the high heat flux region is buried within the stack. Numerous investigations have been launched in the previous decade seeking to develop cooling solutions that can be integrated within the 3D stack, allowing the cooling to scale with the number of tiers in the system. Two-phase cooling is of particular interest, because the associated reduced flow rates may allow reduction in pumping power, and the saturated temperature condition of the coolant may offer enhanced device temperature uniformity. This paper presents a review of the advances in two-phase forced cooling in the past decade, with a focus on the challenges of integrating the technology in high heat flux 3D systems. A holistic approach is applied, considering not only the thermal performance of standalone cooling strategies but also coolant selection, fluidic routing, packaging, and system reliability. Finally, a cohesive approach to thermal design of an evaporative cooling based heat sink developed by the authors is presented, taking into account all of the integration considerations discussed previously. The thermal design seeks to achieve the dissipation of very large (in excess of 500 W/cm2) background heat fluxes over a large 1 cm × 1 cm chip area, as well as extreme (in excess of 2 kW/cm2) hotspot heat fluxes over small 200 μm × 200 μm areas, employing a hybrid design strategy that combines a micropin–fin heat sink for background cooling as well as localized, ultrathin microgaps for hotspot cooling.

scholarly journals Optimal design of subcooled triangular microchannel heat sink exchangers with variable heat loads for high performance cooling

2021 ◽  
Vol 2116 (1) ◽  
pp. 012052
Author(s):  
David Olugbenga Ariyo ◽  
Tunde Bello-Ochende
Keyword(s):  
Heat Sink ◽  
High Performance ◽  
Flow Boiling ◽  
High Heat ◽  
Geometric Optimization ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Subcooled Flow Boiling ◽  
Subcooled Flow ◽  
Microchannel Heat Sinks

Abstract Deionized water at a temperature of 25 °C was used as the cooling fluid and aluminium as the heat sink material in the geometric optimization and parameter modelling of subcooled flow boiling in horizontal equilateral triangular microchannel heat sinks. The thermal resistances of the microchannels were minimized subject to fixed volume constraints of the heat sinks and microchannels. A computational fluid dynamics (CFD) ANSYS code used for both the simulations and the optimizations was validated by the available experimental data in the literature and the agreement was good. Fixed heat fluxes between 100 and 500 W/cm2 and velocities between 0.1 and 7.0 m/s were used in the study. Despite the relatively high heat fluxes in this study, the base temperatures of the optimal microchannel heat sinks were within the acceptable operating range for modern electronics. The pumping power requirements for the optimal microchannels are low, indicating that they can be used in the cooling of electronic devices.

Conjugated Numerical Study on the Performance of Microchannel Heat Sink Using Al2O3/H2O Nanofluid

2014 ◽  
Author(s):  
J. M. Wu ◽  
J. Y. Zhao
Keyword(s):  
Heat Flux ◽  
Integrated Circuit ◽  
Heat Sink ◽  
Nuclear Reactor ◽  
Numerical Study ◽  
Substrate Surface ◽  
High Heat ◽  
High Heat Flux ◽  
Microchannel Heat Sink ◽  
Size Dependent

High power electronics are widely used in many different areas such as integrated circuit (IC) boards in nuclear reactor control system. Thermal management of electronic devices has been a topic of great interest among many researchers over the last few decades. Microchannel is one of several high-heat-flux removal techniques. Nanofluids with enhanced thermal conductivity and strong temperature- and size-dependent thermal properties are expected to be utilized in microchannels as coolants, which leads to a promising future for such high-heat-flux systems as cooling systems. The performance of the microchannel heat sink (MCHS) using water and Al2O3/water nanofluids, with consideration of different substrate materials, is numerically investigated and compared in the present paper to identify the combined effects of working fluids and substrate materials on the thermal resistance, pumping power and temperature distribution on the substrate surface of a heat sink.

Performance Investigation on Porous Micro Heat Sink for Cooling of High Power LEDs

2011 ◽  
Vol 204-210 ◽  
pp. 1481-1484
Author(s):  
Zhong Min Wan ◽  
Zheng Kai Tu ◽  
Jing Liu
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
High Power ◽  
Heat Sink ◽  
Heated Surface ◽  
High Heat ◽  
Heat Fluxes ◽  
Local Thermal Equilibrium ◽  
Micro Pump

A novel porous micro heat sink system is presented for thermal management of high power LEDs, which has high heat transport capability. Numerical model for the micro heat sink is developed to describe liquid flow and heat transfer based on the local thermal equilibrium of porous media, and it is solved with SIMPLE algorithm. The numerical results show that the heated surface temperature of porous micro heat sink is low at high heat fluxes and is much less than the bearable temperature level of LED chips. The heat transfer coefficient of heat sink is very high, and increasing the liquid velocity can enhance the average heat transfer coefficient. The overall pressure loss of heat sink system increases with the increasing the inlet velocity, but the overall pressure drop is much less than the pumping pressure provided by micro pump.

Experimental and Numerical Study of Transient Electronic Chip Cooling by Liquid Flow in Microchannel Heat Sink

2010 ◽  
Author(s):  
Jingru Zhang ◽  
Tiantian Zhang ◽  
Yogesh Jaluria
Keyword(s):  
Liquid Flow ◽  
Heat Sink ◽  
Single Channel ◽  
Numerical Study ◽  
Numerical Models ◽  
Heat Removal ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Chip Cooling ◽  
Microchannel Heat Sinks

Cooling of electronic chips has become a critical aspect in the development of electronic devices. Overheating may cause the malfunction or damage of electronics and the time needed for heat removal is important. In this paper, an experimental setup and numerical model was developed to test the effects of different parameters and their influence on the transient electronic chip cooling by liquid flow in microchannel heat sinks. The temperature change with time of the system for different heat fluxes at different flow was determined, from which the response time can be obtained. Three different configurations of multi-microchannel heat sinks were tested during the experiment. Numerical models were then developed to simulate the transient cooling for two of the configurations. A good agreement between the experimental data and numerical results showed that single-channel models are capable of simulating the thermal behavior of the entire heat sink by applying appropriate assumptions and boundary conditions.

Heat Transfer and Hydraulic Characteristics of Cooling Water in a Flat Plate Heat Sink for High Heat Flux IGBT

2016 ◽  
Author(s):  
Chang-Nian Chen ◽  
Ji-Tian Han ◽  
Wei-Ping Gong ◽  
Tien-Chien Jen
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flat Plate ◽  
Heat Sink ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Hydraulic Characteristics ◽  
Flow Rates ◽  
Plate Heat

High heat flux is very dangerous for electronic heat transfer, such as IGBT (Insulated Gate Bipolar Transistor) cooling. In order to explore and master the heat transfer and hydraulic characteristics for IGBT cooling, experiments have been carried out to study the situation mentioned above in a flat plate heat sink, which was designed for high heat flux IGBT cooling. The geometrical parameters of the test section are as follows: outline dimension 229 mm × 124 mm × 30 mm; flow channels of 229 mm × 3 mm × 4 mm in total of 20. The experiments performed at atmospheric pressure and with inlet temperatures of 25–35°C, heat fluxes of 3.5–18.9 kW/m2. The influence of temperatures, heat fluxes on IGBT surface temperature and the cooling effect of the liquid cold plate have been investigated under a range of flow rates of 280–2300 kg/m2s. It was found that the heat transfer enhancement was very obvious using this kind of small sized channel for IGBT cooling, which was tens of times of the effect than air cooling or triple of the effect than that in normal sized channels. And the heat transfer enhancement increases with increasing heat fluxes and flow rates, while it decreases with increasing inlet temperatures. Most of the experimental results show good cooling effect as expected. However, it is dangerous for the cooling system under high heat fluxes when the system starts or stops suddenly, when the Respond Time (RT) is less than 5 seconds to cut off heated power. Also, the cooling performance is bad when the heat fluxes increased greatly, which is considered as abnormal situation in operating. The effect on IGBT surface temperature of heat flux is more obvious when the average Nusselt Number is smaller. For hydraulic characteristics observed, it was found that the flow friction increased with flow rates increasing, but the pressure drops of heated flow channels ahead were slightly larger than those back, especially under large flow rates conditions. That is because the temperatures of flow heated in channels ahead are lower than those back, which causes the fluid viscosity to be higher. At last, this paper suggested a series of method for enhancing heat transfer in flat plate heat sink, and also gave some ways to avoid heat transfer dangerous situations for IGBT cooling, which can provide a basis for thermodynamic and hydraulic calculation of flat plate heat sink design and lectotype.

Experimental and Computational Characterization of a Heat Sink Tester

2007 ◽  
Author(s):  
Aalok Trivedi ◽  
Nikhil Lakhkar ◽  
Madhusudhan Iyengar ◽  
Michael Ellsworth ◽  
Roger Schmidt ◽  
...  
Keyword(s):  
Heat Sink ◽  
Accurate Determination ◽  
Thermal Characterization ◽  
High Heat ◽  
Heat Fluxes ◽  
Thermal Design ◽  
Heat Sinks ◽  
Junction Temperature ◽  
Air Cooling

With the continuing industry trends towards smaller, faster and higher power devices, thermal management continues to be extremely important in the development of electronics. In this era of high heat fluxes, air cooling still remains the primary cooling solution in desktops mainly due to its cost. The primary goal of a good thermal design is to ensure that the chip can function at its rated frequency or speed while maintaining the junction temperature within the specified limit. The first and foremost step in measurement of thermal resistance and hence thermal characterization is accurate determination of junction temperature. Use of heat sinks as a thermal solution is well documented in the literature. Previously, the liquid cooled cold plate tester was studied using a different approach and it was concluded that the uncertainty in heat transfer coefficient was within 8% with errors in appropriate parameters, this result was supported by detailed uncertainty analysis based on Monte-Carlo simulations. However, in that study the tester was tested computationally. In this paper, testing and characterization of a heat sink tester is presented. Heat sinks were tested according to JEDEC JESD 16.1 standard for forced convection. It was observed that the error between computational and experimental values of thermal resistances was 10% for the cases considered.

Investigation of Cooling Performance of a Swirl Microchannel Heat Sink by Numerical Simulation

2011 ◽  
Author(s):  
Yanfeng Fan ◽  
Ibrahim Hassan
Keyword(s):  
Numerical Simulation ◽  
Heat Flux ◽  
Heat Sink ◽  
High Heat ◽  
Heat Fluxes ◽  
Maximum Temperature ◽  
Microchannel Heat Sink ◽  
Irreversible Damage ◽  
Cooling Performance ◽  
Large Heat

High heat fluxes have been created by the semiconductor devices due to the high power generation and shrank size. The large heat flux causes the circuit to exceed its allowable temperature and may experience both working efficiency loss and irreversible damage due to excess in their temperatures. In this paper, a swirl microchannel heat sink is designed to dissipate the large heat flux from the devices. The numerical simulation is carried out to investigate the cooling performance. Uniform heating boundary condition is applied and single phase water is selected as coolant. The present micro heat sink applies multiple swirl microchannels positioned in a circular flat plate to enhance the heat convection by creating the secondary flow at high Reynolds numbers. Copper is selected as the material of heat sink. The channel depth and width are fixed as 0.5 mm and 0.4 mm, respectively. The heat is injected into the system from the bottom of heat sink at the heat fluxes from 10 to 60 W/cm2. Flow is supplied from the top of micro heat sink through a jet hole with a diameter of 2 mm and enters swirl microchannels at the volume flow rates varying from 47 to 188 ml/min. The cooling performances of swirl microchannel heat sinks with different curvatures and channel numbers are evaluated based on the targets of low maximum temperature, temperature gradient and pressure drop.

An Experimental Investigation of a High Flux Heat Pipe Heat Sink

2004 ◽  
Author(s):  
H. B. Ma ◽  
K. P. Lofgreen ◽  
G. P. Peterson
Keyword(s):  
Heat Transfer ◽  
Experimental Investigation ◽  
Heat Pipe ◽  
Heat Sink ◽  
Temperature Drop ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Forced Air ◽  
Pipe Heat

An experimental investigation on a highly efficient heat pipe heat sink was investigated, in which the interline region was optimized using sintered particles. The effects of condenser size, sintered particles, and forced air flow on the heat transfer performance were investigated experimentally. The experimental results indicated that the thin film evaporation could significantly increase the evaporating heat transfer coefficient and remove heat fluxes up to 800 kW/m2. In addition, a theoretical model capable of predicting the temperature drop occurring in the device was developed. The predicted performance was in good agreement with the experimental data. The resulting model can be used to assist in the design of high heat flux, heat pipe heat sinks for applications to both ground based and spacecraft applications.

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