Three-Dimensional Multiphysics Analyses of a CPU Integrated Thermal Heat Sink

2010 ◽  
Author(s):  
Maher Al-Dojayli ◽  
Ellen Chan ◽  
Sunny Leung ◽  
Hani Naguib ◽  
Francis Dawson ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Heat Sink ◽  
Conjugate Heat Transfer ◽  
Structural Integrity ◽  
Natural Frequencies ◽  
Thermal Analyses ◽  
Three Dimensional ◽  
Flow Speed ◽  
Wall Structure ◽  
Heat Generation Rate

Recent advances in electronic packaging have led to small, lightweight and highly efficient heat sink designs. Some of these attempts are aiming to integrate the heat sink with the packaging wall structure. In this paper, a three-dimensional multiphysics numerical model is developed for the integrated heat sink to carry out CFD and thermal analyses, stress analyses due to thermal expansion and modal analyses. Finite volumes were used to model the conjugate heat transfer (CHT) for the coupled fluid-structure fields representing the air and heat sink fin walls and base, respectively. In this analysis, both natural and forced convection analyses were considered. The predicted temperature distribution was then used to calculate the mechanical stresses due to thermal expansion, using finite elements. Lastly, modal analyses were conducted to calculate the natural frequencies of the model. The effect of varying the source heat generation rate, air flow speed, and some geometry features such as number of fins and fin’s height on the performance and structural integrity of the assembly have been studied.

Thermostructural Analyses Supporting the Design of the HYPROB Heat Sink Subscale Breadboard

2014 ◽  
Author(s):  
M. Ferraiuolo ◽  
A. Martucci ◽  
F. Battista ◽  
D. Ricci
Keyword(s):  
Heat Sink ◽  
Structural Integrity ◽  
Specific Impulse ◽  
Thermal Analyses ◽  
High Energy ◽  
Life Cycles ◽  
Heat Fluxes ◽  
Point Of View ◽  
Rocket Engines ◽  
Combustion Enthalpy

Today’s rocket engines regeneratively cooled using high energy cryogenic propellants (e.g. LOX and LH2, LOX and LCH4) play a major role due to the high combustion enthalpy (10–13.4 kJ/kg) and the high specific impulse of these propellants. In the frame of the HYPROB/Bread project, whose main goal is to design build and test a 30 kN regeneratively cooled thrust chamber, a breadboard has been conceived in order to: • investigate the behavior of the injector that will be employed in the full scale final demonstrator, • to obtain a first estimate of the heat flux on the combustion chamber for models validation, • to implement a “battleship” chamber for a first verification of the stability of the combustion The breadboard is called HS (Heat Sink) and it is made of CuCrZr (Copper Chromium Zirconium alloy), Inconel 718 and TZM (Titanium Zirconium Molybdenum alloy). The aim of the present paper is to illustrate the thermostructural design conducted on the breadboard by means of a Finite Element Method code taking into account the viscoplastic behavior of the adopted materials. An optimization process has been carried out in order to keep the structural integrity of the breadboard maximizing the life cycles of the component. Heat fluxes generated by combustion gases have been evaluated by means of CFD quick analyses, while convection and radiation with the external environment have not been considered in order to be as conservative as possible from a thermostructural point of view. Transient thermal analyses and static structural analyses have been performed by means of ANSYS code adopting an axisymmetric model of the chamber. These analyses have demonstrated that the Breadboard can withstand the design goal of 3 thermo-mechanical cycles with a safety factor equal to 4 considering a firing time equal to 3 seconds.

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

1999 ◽  
Author(s):  
Andrei G. Fedorov ◽  
Raymond Viskanta
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Conjugate Heat Transfer ◽  
Stokes Equations ◽  
Equations Of Motion ◽  
Three Dimensional ◽  
Solid Substrate ◽  
Microchannel Heat Sink ◽  
Three Dimensional Model ◽  
Wide Range

Abstract A three-dimensional model is developed to investigate flow and conjugate heat transfer in the microchannel-based heat sink for electronic packaging applications. The incompressible laminar flow Navier-Stokes equations of motion as well as the energy conservation equations for the fluid and solid are employed as the governing model equations which are numerically solved using the generalized single-equation framework for solving conjugate problems. First, the theoretical model developed is validated by comparing the model predictions of the thermal resistance and the friction coefficient with available experimental data for a wide range of Reynolds numbers. Then, the parametric calculations are performed to investigate the effects of different working fluids, solid substrate materials and channel geometry on conjugate heat transfer in the microchannel heat sink. The bulk and wall temperature and heat flux distributions as well as the average heat transfer characteristics are reported and discussed. Important practical design recommendations are also provided regarding the cooling efficiency of the microchannel heat sink.

Effect of Inter-Connector on Thermo-Hydraulic Characteristics of Parallel and Counter Flow Mini-Channel Heat Sink

2018 ◽  
Author(s):  
Amitav Tikadar ◽  
Saad K. Oudah ◽  
Azzam S. Salman ◽  
A. K. M. M. Morshed ◽  
Titan C. Paul ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Conjugate Heat Transfer ◽  
Single Phase ◽  
Three Dimensional ◽  
Cross Flow ◽  
Constant Heat Flux ◽  
Hydraulic Characteristics ◽  
Counter Flow ◽  
Flow And Heat Transfer

A numerical investigation of three-dimensional conjugate heat transfer was performed to quantify the thermal and hydraulic performance of an inter-connected parallel and counter flow mini-channel heat sink under laminar flow condition and within the single-phase regime. The aspect ratio (height/width) and the hydraulic diameter of the mini-channel were 0.33 and 750μm respectively. Three different widths of the inter-connector were selected to analyze the effect of cross flow for Reynolds number ranging from 150 to 1044, at a constant heat flux (20 W/cm2). To understand the fluid flow and heat transfer mechanism inside the inter-connector and their effects on overall thermal performance of the heat sink, Nusselt number (Nu), friction factor, pumping power, and overall thermal resistance were analyzed. Results show that the inter-connector has significantly higher effect on counter flow mini-channel heat sink than parallel flow mini-channel heat sink.

Exploration of cell wall architecture with the rapid-freeze deep-etch technique

1993 ◽  
Vol 51 ◽  
pp. 128-129
Author(s):  
Béatrice Satiat-Jeunemaitre ◽  
Chris Hawes
Keyword(s):  
Plant Cell ◽  
Cell Walls ◽  
Cell Biology ◽  
Molecular Model ◽  
Three Dimensional ◽  
Secretory Activity ◽  
Wall Structure ◽  
Specimen Preparation ◽  
Molecular Architecture ◽  
Plant Cell Walls

The comprehension of the molecular architecture of plant cell walls is one of the best examples in cell biology which illustrates how developments in microscopy have extended the frontiers of a topic. Indeed from the first electron microscope observation of cell walls it has become apparent that our understanding of wall structure has advanced hand in hand with improvements in the technology of specimen preparation for electron microscopy. Cell walls are sub-cellular compartments outside the peripheral plasma membrane, the construction of which depends on a complex cellular biosynthetic and secretory activity (1). They are composed of interwoven polymers, synthesised independently, which together perform a number of varied functions. Biochemical studies have provided us with much data on the varied molecular composition of plant cell walls. However, the detailed intermolecular relationships and the three dimensional arrangement of the polymers in situ remains a mystery. The difficulty in establishing a general molecular model for plant cell walls is also complicated by the vast diversity in wall composition among plant species.

scholarly journals Computational and experimental mechanical performance of a new everolimus-eluting stent purpose-built for left main interventions

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Saurabhi Samant ◽  
Wei Wu ◽  
Shijia Zhao ◽  
Behram Khan ◽  
Mohammadali Sharzehee ◽  
...  
Keyword(s):  
Structural Integrity ◽  
Mechanical Performance ◽  
Experimental Studies ◽  
Patient Specific ◽  
Wall Structure ◽  
Left Main ◽  
Element Analysis ◽  
Stent Expansion ◽  
Radial Strength ◽  
Different Diameters

AbstractLeft main (LM) coronary artery bifurcation stenting is a challenging topic due to the distinct anatomy and wall structure of LM. In this work, we investigated computationally and experimentally the mechanical performance of a novel everolimus-eluting stent (SYNERGY MEGATRON) purpose-built for interventions to large proximal coronary segments, including LM. MEGATRON stent has been purposefully designed to sustain its structural integrity at higher expansion diameters and to provide optimal lumen coverage. Four patient-specific LM geometries were 3D reconstructed and stented computationally with finite element analysis in a well-validated computational stent simulation platform under different homogeneous and heterogeneous plaque conditions. Four different everolimus-eluting stent designs (9-peak prototype MEGATRON, 10-peak prototype MEGATRON, 12-peak MEGATRON, and SYNERGY) were deployed computationally in all bifurcation geometries at three different diameters (i.e., 3.5, 4.5, and 5.0 mm). The stent designs were also expanded experimentally from 3.5 to 5.0 mm (blind analysis). Stent morphometric and biomechanical indices were calculated in the computational and experimental studies. In the computational studies the 12-peak MEGATRON exhibited significantly greater expansion, better scaffolding, smaller vessel prolapse, and greater radial strength (expressed as normalized hoop force) than the 9-peak MEGATRON, 10-peak MEGATRON, or SYNERGY (p < 0.05). Larger stent expansion diameters had significantly better radial strength and worse scaffolding than smaller stent diameters (p < 0.001). Computational stenting showed comparable scaffolding and radial strength with experimental stenting. 12-peak MEGATRON exhibited better mechanical performance than the 9-peak MEGATRON, 10-peak MEGATRON, or SYNERGY. Patient-specific computational LM stenting simulations can accurately reproduce experimental stent testing, providing an attractive framework for cost- and time-effective stent research and development.

scholarly journals Study of Mini Channel Heat Sink with Different Internal Configuration

2020 ◽  
Vol 319 ◽  
pp. 02004
Author(s):  
Muhammad Akif Rahman ◽  
Md Badrath Tamam ◽  
Md Sadman Faruque ◽  
A.K.M. Monjur Morshed
Keyword(s):  
Nusselt Number ◽  
Thermal Performance ◽  
Heat Sink ◽  
Rectangular Channel ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Rectangular Channels ◽  
Flow Through ◽  
Internal Configuration

In this paper a numerical analysis of three-dimensional laminar flow through rectangular channel heat sinks of different geometric configuration is presented and a comparison of thermal performance among the heat sinks is discussed. Liquid water was used as coolant in the aluminum made heat sink with a glass cover above it. The aspect ratio (section height to width) of rectangular channels of the mini-channel heat sink was 0.33. A heat flux of 20 W/cm2 was continuously applied at the bottom of the channel with different inlet velocity for Reynold’s number ranging from 150 to 1044. Interconnectors and obstacles at different positions and numbers inside the channel were introduced in order to enhance the thermal performance. These modifications cause secondary flow between the parallel channels and the obstacles disrupt the boundary layer formation of the flow inside the channel which leads to the increase in heat transfer rate. Finally, Nusselt number, overall thermal resistance and maximum temperature of the heat sink were calculated to compare the performances of the modified heat sinks with the conventional mini channel heat sink and it was observed that the heat sink with both interconnectors and obstacles enhanced the thermal performance more significantly than other configurations. A maximum of 36% increase in Nusselt number was observed (for Re =1044).

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