Integrating an Electronics Component Database Into a Thermal Design Tool

2009 ◽  
Author(s):  
Patrick Loney
Keyword(s):  
Human Error ◽  
Thermal Characteristics ◽  
Design Tool ◽  
Thermal Design ◽  
Junction Temperature ◽  
Analysis Tool ◽  
Resistance Performance ◽  
Business Sectors ◽  
Component Database ◽  
Pin Configuration

When developing a thermal model of a highly populated electronics board, a significant amount of time and effort is needed to track the thermal characteristics of all the dissipating components. In business sectors where multiple boards are thermally designed and analyzed each year, developing a components database and integrating it into the analysis tool will save time and ensure that consistent values are used in every design. With an “in tool” component database, multiple advantages are achieved. Once a component is entered into the database, the component information can be accessed in subsequent designs that employ the component. All engineers doing thermal design have access to the database. Once the thermal characteristics of a component are agreed upon, consistency across all boards is maintained. Additionally, values for each component in the database can be automatically brought into the analysis tool. By making a computer program develop the model of the component, human error is removed. The database tracks all major thermal aspects of a component. This includes the maximum junction temperature, Theta JC (case to junction resistance), leg/pin configuration (size, length, number, conductivity), and board to case gap thickness. Optional values can include top side cooling resistance, performance temperature limits, manufacturer, datasheet web address, and even an entry to identify the configuring engineer.

Impacts of Solder Voids on Power Devices' Thermal Characteristics

2014 ◽  
Vol 509 ◽  
pp. 70-74
Author(s):  
Xiao Zhang ◽  
Su Juan Zhang
Keyword(s):  
Active Region ◽  
Thermal Performance ◽  
Computer Software ◽  
Thermal Characteristics ◽  
Thermal Design ◽  
Analysis Tool ◽  
Simulation And Modeling ◽  
Power Devices ◽  
Reliability Characteristics

Thermal performance is very important to power devices. Solder voids are detrimental to power devices thermal and reliability characteristics. According to above-mentioned problem, using computer software as an analysis tool, making some simulation and modeling on the influence of different solder voids distribution to power devices thermal characteristics. Focus on the solder voids around active region of power devices. Computing results show that solder voids under active region are the most evidently factor to power devices thermal characteristics and provide some suggests on the process of power devices thermal design.

Turbine Blade Thermal Design Process Enhancements for Increased Firing Temperatures and Reduced Coolant Flow

2007 ◽  
Author(s):  
J. Kru¨ckels ◽  
T. Arzel ◽  
T. R. Kingston ◽  
M. Schnieder
Keyword(s):  
Turbine Blade ◽  
Design Process ◽  
New Technology ◽  
Three Dimensional ◽  
Element Model ◽  
Design Tool ◽  
Thermal Design ◽  
Successful Implementation ◽  
Analysis Tool ◽  
Turbine Blade Cooling

A successful implementation of a cooled turbine blade design for a heavy duty gas turbine engine is a technology challenge that requires a stringent engineering approach. The increased spread of hot gas versus metal temperature, the flatter temperature profiles for reduced emissions and the aerodynamic 3D-profile shape requirement and all at a reduced cooling air consumption place the specification of a new turbine blade, that is put forward to the aerothermal engineers, as a technical challenge. It is also desired to reduce the available development time to be able to introduce new technology features faster into the market. The paper aims to demonstrate turbine blade cooling and heat transfer design process enhancements that allow: increased thermal predictability, increased capturing of three dimensional effects and reduced engineering development cycle time from initial design to full engine validation. Selected items will be shown for demonstration. One example is the use of symmetry and parameterization to move CFD from an analysis tool into an available design tool to capture effects as rotation or three-dimensionality. Another example is the use of heat sinks within a finite element model to represent individual cooling holes instead of hole geometry.

PCB thermal reliability characteristics analysis under ambient temperature

2020 ◽  
Vol 20 (3) ◽  
pp. 853-858
Author(s):  
Hailong Huang ◽  
Yi Wan ◽  
Kai Zhou
Keyword(s):  
Flow Analysis ◽  
Thermal Characteristics ◽  
Thermal Design ◽  
Junction Temperature ◽  
Electrical Transmission ◽  
Thermal Reliability ◽  
Ambient Temperatures ◽  
Reliability Characteristics ◽  
Characteristics Analysis ◽  
Volume Method

PCB is an important component for electronic devices – Mechanical connections and electrical transmission, thermal failure is its main failure mode, the heat flow analysis and thermal design is the basis and premise to improve thermal characteristics of PCBs. In this paper, based on the principles of fluid mechanics, using the finite volume method, the thermal characteristics of the PCB is modeled, and we obtain the maximum junction temperature of the PCB, PCB’s thermal distribution and effect of different ambient temperatures on the PCB thermal characteristics. The study provides a theoretical basis for the PCB thermal design.

scholarly journals Inspection planning by defect prediction models and inspection strategy maps

2021 ◽  
Author(s):  
Elisa Verna ◽  
Gianfranco Genta ◽  
Maurizio Galetto ◽  
Fiorenzo Franceschini
Keyword(s):  
Probabilistic Models ◽  
Prediction Models ◽  
Design Tool ◽  
General Interest ◽  
Manufacturing Processes ◽  
Analysis Tool ◽  
Manufacturing Companies ◽  
Inspection Planning ◽  
Inspection Strategy ◽  
Defect Prediction Models

AbstractDesigning appropriate quality-inspections in manufacturing processes has always been a challenge to maintain competitiveness in the market. Recent studies have been focused on the design of appropriate in-process inspection strategies for assembly processes based on probabilistic models. Despite this general interest, a practical tool allowing for the assessment of the adequacy of alternative inspection strategies is still lacking. This paper proposes a general framework to assess the effectiveness and cost of inspection strategies. In detail, defect probabilities obtained by prediction models and inspection variables are combined to define a pair of indicators for developing an inspection strategy map. Such a map acts as an analysis tool, enabling positioning assessment and benchmarking of the strategies adopted by manufacturing companies, but also as a design tool to achieve the desired targets. The approach can assist designers of manufacturing processes, and particularly low-volume productions, in the early stages of inspection planning.

scholarly journals Numerical Simulation on Electrical-Thermal Properties of Gallium-Nitride-Based Light-Emitting Diodes Embedded in Board

2012 ◽  
Vol 2012 ◽  
pp. 1-6 ◽  
Author(s):  
Xing-ming Long ◽  
Rui-jin Liao ◽  
Jing Zhou
Keyword(s):  
Finite Element ◽  
Gallium Nitride ◽  
Indium Tin Oxide ◽  
Light Emitting Diodes ◽  
Thermal Characteristics ◽  
Junction Temperature ◽  
Current Crowding ◽  
Total Thermal Resistance ◽  
Light Emitting ◽  
Packaging Structure

The electrical-thermal characteristics of gallium-nitride- (GaN-) based light-emitting diodes (LED), packaged by chips embedded in board (EIB) technology, were investigated using a multiphysics and multiscale finite element code, COMSOL. Three-dimensional (3D) finite element model for packaging structure has been developed and optimized with forward-voltage-based junction temperatures of a 9-chip EIB sample. The sensitivity analysis of the simulation model has been conducted to estimate the current and temperature distribution changes in EIB LED as the blue LED chip (substrate, indium tin oxide (ITO)), packaging structure (bonding wire and chip numbers), and system condition (injection current) changed. This method proved the reliability of simulated results in advance and useful material parameters. Furthermore, the method suggests that the parameter match on Shockley's equation parameters, Rs, nideal, and Is, is a potential method to reduce the current crowding effect for the EIB LED. Junction temperature decreases by approximately 3 K to 10 K can be achieved by substrate thinning, ITO, and wire bonding. The nonlinear-decreasing characteristics of total thermal resistance that decrease with an increase in chip numbers are likely to improve the thermal performance of EIB LED modules.

Thermal Design of a Satellite Borne FPGA

2011 ◽  
Vol 52-54 ◽  
pp. 1411-1414 ◽  
Author(s):  
Bo Chen
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Heat Sink ◽  
Thermal Design ◽  
Junction Temperature ◽  
Element Analysis

Thermal design and analysis of a satellite borne FPGA is described in this paper. Thermal-conductive glue, vias and an aluminum bar were used to the FPGA and the PCB under the FPGA in order to help conduct the heat of the FPGA to heat sink. The results of finite element analysis showed that the case temperature of the FPGA decreased from 132.5°C to 55.4°C and the junction temperature decreased from 136.1°C to59.0 °C after the thermal design, which matches the requirements of thermal design.

Approximate Analytical Model for a First Level Package With Non-Uniformly Powered Die

2006 ◽  
Author(s):  
Abhijit Kaisare ◽  
Dereje Agonafer ◽  
A. Haji-Sheikh ◽  
Greg Chrysler ◽  
Ravi Mahajan
Keyword(s):  
Thermal Resistance ◽  
Analytical Model ◽  
Functional Integration ◽  
Thermal Design ◽  
Junction Temperature ◽  
Direct Result ◽  
Design Guideline ◽  
Functional Blocks ◽  
Distribution Of Power ◽  
Functional Components

Microprocessors continue to grow in capabilities, complexity and performance. Microprocessors typically integrate functional components such as logic and level two (L2) cache memory in their architecture. This functional integration of logic and memory results in improved performance of the microprocessor as the clock speed increases and the instruction execution time has decreased. However, the integration also introduces a layer of complexity to the thermal design and management of microprocessors. As a direct result of function integration, the power map on a microprocessor is typically highly non-uniform and the assumption of a uniform heat flux across the chip surface is not valid. The active side of the die is divided into several functional blocks with distinct power assigned to each functional block. Previous work [1,2] has been done to minimize the thermal resistance of the package by optimizing the distribution of the non-uniform powered functional blocks with different power matrices. This study further gives design guideline and key pointers to minimized thermal resistance for any number of functional blocks for a given non-uniformly powered microprocessor. In this paper, initially (Part I) temperature distribution of a typical package consisting of a uniformly powered die, heat spreader, TIM 1 & 2 and the base of the heat sink is calculated using an approximate analytical model. The results are then compared with a detailed numerical model and the agreement is within 5%. This study follows (Part II) with a thermal investigation of non-uniform powered functional blocks with a different power matrices with focus on distribution of power over die surface with an application of maximum, minimum and average uniform junction temperature over a given die area. This will help to predict the trend of the calculated distribution of power that will lead to the least thermal gradient over a given die area. This trend will further help to come up with design correlations for minimizing thermal resistance for any number of functional blocks for a given non-uniformly powered microprocessor numerically as well as analytically. The commercial finite element code ANSYS® is used for this analysis as a numerical tool.

Generalized External Optimization

2005 ◽  
pp. 41-60 ◽  
Author(s):  
Fabiano Luis de Sousa ◽  
Fernando Manuel Ramos ◽  
Roberto Luiz Galski ◽  
Issamu Muraoka
Keyword(s):  
Optimization Problems ◽  
Evolutionary Model ◽  
Design Tool ◽  
Thermal Design ◽  
Extremal Optimization ◽  
Integer Variables ◽  
Constrained Problems ◽  
Self Organized ◽  
Complex Design ◽  
Self Organized Criticality

In this chapter a recently proposed meta-heuristic devised to be used in complex optimization problems is presented. Called Generalized Extremal Optimization (GEO), it was inspired by a simple co-evolutionary model, developed to show the emergence of self-organized criticality in ecosystems. The algorithm is of easy implementation, does not make use of derivatives and can be applied to unconstrained or constrained problems, non-convex or even disjoint design spaces, with any combination of continuous, discrete or integer variables. It is a global search meta-heuristic, like the Genetic Algorithm (GA) and the Simulated Annealing (SA), but with the advantage of having only one free parameter to adjust. The GEO has been shown to be competitive to the GA and the SA in tackling complex design spaces and a useful tool in real design problems. Here the algorithm is described, including a step-by-step implementation to a simple numerical example, its main characteristics highlighted, and its efficacy as a design tool illustrated with an application to satellite thermal design.

An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature

2005 ◽  
Vol 127 (1) ◽  
pp. 67-75 ◽  
Author(s):  
Peter Rodgers ◽  
Vale´rie Eveloy ◽  
M. S. J. Hashmi
Keyword(s):  
Thermal Analysis ◽  
Reynolds Number ◽  
Eddy Viscosity ◽  
Predictive Accuracy ◽  
Low Reynolds Number ◽  
Turbulence Models ◽  
Thermal Design ◽  
Junction Temperature ◽  
Temperature Prediction ◽  
Low Reynolds

The flow modeling approaches employed in computational fluid dynamics (CFD) codes dedicated to the thermal analysis of electronic equipment are generally not specific for the analysis of forced airflows over populated electronic boards. This limitation has been previously highlighted (Eveloy, V. et al., 2004, IEEE Trans. Compon., Packag., Technol. 27, pp. 268–282), with component junction temperature prediction errors of up to 35% reported. This study evaluates the potential of three candidate low-Reynolds number eddy viscosity turbulence models to improve predictive accuracy. An array of fifteen board-mounted PQFPs is analyzed in a 4 m/s airflow. Using the shear stress transport k-ω model, significant improvements in component junction temperature prediction accuracy are obtained relative to the standard high-Reynolds number k-ε model, which are attributed to better prediction of both board leading edge heat transfer and component thermal interaction. Such improvements would enable parametric analysis of product thermal performance to be undertaken with greater confidence in the thermal design process, and the generation of more accurate temperature boundary conditions for use in Physics-of-Failure based reliability prediction methods. The case is made for vendors of CFD codes dedicated to the thermal analysis of electronics to consider the adoption of eddy viscosity turbulence models more suited to board-level analysis.

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