On-Line Hardness Characterization of Novel 2-mil Copper Bonding Wires

In order to eliminate the chip cratering for copper wire applications in IC packaging, it is worthwhile to develop new Cu wire chemistries to obtain a soft copper wire with a soft free-air ball (FAB). The conventional hardness characterization of a new bonding wire is a labour intensive, time-consuming work. Therefore an on-line hardness characterization method is presented that enables the hardness comparison of a larger number of different wires within a shorter time. The influences of capillary change, bonding substrate metallization and temperature on this method is quantified. It is found these influences need to be held constant during a hardness comparison study. With this method, the wire and FAB hardness comparison of nine novel 2-mil copper bonding wires, Cu 1 to Cu 9, and one 2-mil Au wire are performed. The wire hardness (wireside) and FAB hardness are characterized. It is found that the Cu 4 and Cu 5 have the softest wireside hardness and FAB hardness.

Download Full-text

Critical Barriers Associated with Copper Wire

International Symposium on Microelectronics ◽

10.4071/isom-2015-wp31 ◽

2015 ◽

Vol 2015 (1) ◽

pp. 000394-000398

Author(s):

William G. Crockett

Keyword(s):

High Reliability ◽

Copper Wire ◽

Automotive Electronics ◽

Bonding Wire ◽

Cu Alloy ◽

Bonding Wires ◽

Reducing Costs ◽

Cu Bonding ◽

Bonding Characteristics ◽

Bare Copper

Since around 2008, the shift from Gold (Au) bonding wire to Copper (Cu) bonding wire has been taking place, full scale, with the aim of reducing costs. When compared with Au, Cu wire presents challenges in reliability and repeatable bonding characteristics in terms of chemical stability, which is required in high reliability applications. Therefore Cu wire adoption in automotive and industrial semiconductors has been limited. Conventionally the market for Cu bonding wires has been divided into two types: bare Cu wires (high purity) and Palladium coated copper (PCC) bonding wires. These wires have yet to satisfy the required characteristics for high reliability products such as industrial and automotive electronics. A new breed of alternative bonding wires has been developed to offer performance advantages for high reliability applications compared to bare copper wire and PCC wire. Cu alloy wire and Ag alloy wires continue their market introduction for advanced bonding applications, where bare Cu and PCC wires have known limitations.

Download Full-text

Size characterization of airborne SiO2 nanoparticles with on-line and off-line measurement techniques: an interlaboratory comparison study

Journal of Nanoparticle Research ◽

10.1007/s11051-013-1919-4 ◽

2013 ◽

Vol 15 (10) ◽

Cited By ~ 26

Author(s):

C. Motzkus ◽

T. Macé ◽

F. Gaie-Levrel ◽

S. Ducourtieux ◽

A. Delvallee ◽

...

Keyword(s):

Interlaboratory Comparison ◽

Measurement Techniques ◽

Sio2 Nanoparticles ◽

Comparison Study ◽

Line Measurement ◽

On Line ◽

Size Characterization ◽

Interlaboratory Comparison Study

Download Full-text

Generic monitoring tools for water characteristics assessment

Water Science & Technology Water Supply ◽

10.2166/ws.2003.0124 ◽

2003 ◽

Vol 3 (1-2) ◽

pp. 351-357

Author(s):

S. Le Bonté ◽

M.-N. Pons ◽

O. Potier ◽

S. Chanel ◽

M. Baklouti

Keyword(s):

Municipal Wastewater ◽

Principal Component ◽

Toxic Substances ◽

Capacity Curves ◽

Water Characteristics ◽

Monitoring Tools ◽

Visible Spectra ◽

On Line ◽

Mining Procedure

An adaptive principal component analysis applied to sets of data provided by global analytical methods (UV-visible spectra, buffer capacity curves, respirometric tests) is proposed as a generic procedure for on-line and fast characterization of wastewater. The data-mining procedure is able to deal with a large amount of information, takes into account the normal variations of wastewater composition related to human activity, and enables a rapid detection of abnormal situations such as the presence of toxic substances by comparison of the actual wastewater state with a continuously updated reference. The procedure has been validated on municipal wastewater.

Download Full-text

ON-LINE CHARACTERIZATION OF MAGNETIC NANO PARTICLES - SIMULATION VERSUS EXPERIMENT

Journal of Aerosol Science ◽

10.1016/s0021-8502(21)00177-4 ◽

2001 ◽

Vol 32 ◽

pp. 385-386

Author(s):

TH. KAUFFELDT ◽

E. KAUFFELDT ◽

T. ZARUTSKAYA ◽

M. SHAPIRO ◽

A. SCHMIDT-OTT

Keyword(s):

Nano Particles ◽

On Line ◽

Magnetic Nano Particles

Download Full-text

Enhanced electrical conductivity and mechanical properties in thermally stable fine-grained copper wire

Communications Materials ◽

10.1038/s43246-021-00150-1 ◽

2021 ◽

Vol 2 (1) ◽

Author(s):

Qingzhong Mao ◽

Yusheng Zhang ◽

Yazhou Guo ◽

Yonghao Zhao

Keyword(s):

Mechanical Properties ◽

Thermal Stability ◽

Electrical Conductivity ◽

Yield Strength ◽

High Speed ◽

Copper Wire ◽

Rapid Development ◽

Dislocation Slip ◽

Ultrafine Grains ◽

The Wire

AbstractThe rapid development of high-speed rail requires copper contact wire that simultaneously possesses excellent electrical conductivity, thermal stability and mechanical properties. Unfortunately, these are generally mutually exclusive properties. Here, we demonstrate directional optimization of microstructure and overcome the strength-conductivity tradeoff in copper wire. We use rotary swaging to prepare copper wire with a fiber texture and long ultrafine grains aligned along the wire axis. The wire exhibits a high electrical conductivity of 97% of the international annealed copper standard (IACS), a yield strength of over 450 MPa, high impact and wear resistances, and thermal stability of up to 573 K for 1 h. Subsequent annealing enhances the conductivity to 103 % of IACS while maintaining a yield strength above 380 MPa. The long grains provide a channel for free electrons, while the low-angle grain boundaries between ultrafine grains block dislocation slip and crack propagation, and lower the ability for boundary migration.

Download Full-text