A Study on Reliability of High-Temperature Joint in Packaging Structure

2011 ◽  
Author(s):  
Takayuki Ishikawa ◽  
Toshikazu Oshidari ◽  
Hiromi Sugihara ◽  
Qiang Yu
Keyword(s):  
High Temperature ◽  
Cooling System ◽  
High Reliability ◽  
Pure Aluminum ◽  
Bending Test ◽  
Temperature Cycle ◽  
Element Analysis ◽  
Operative Temperature ◽  
Temperature Cycle Test ◽  
Packaging Structure

In recent years, the research and development of hybrid cars and electrical vehicles become one of the top targets. High electric power is necessary for those cars to run in motor drive, and power devices such as inverter are employed for the control. Since operative temperature of Si power device is from −40 to 150°C level, a big cooling system is needed to control the temperature lower than 150°C. Recently the SiC chip had been developed to downsize the cooling system and reduce the loss of energy, because the operative temperature of SiC chip can be increased to over 300°C. However mounting method that can be used at high temperature environment is not established yet. The author’s group has proposed a new mounting method using Ag-Nano material to mount the SiC chip on a metal board. In existing mounting method, stress was relieved by transformation of comparatively soft solder region. Thus, in the new method, the junction Ag-Nano is too hard to relax the stress. So stress relaxation facility is given to the pure aluminum substrate side. In addition, jointing Ag-Nano on aluminum board is not possible, enabled by Ag and Ni plating on substrate. And these films prevent aluminum board from oxidizing. This mounting method achieves low temperature mounting and high reliability in thermal cycle. In this study, reliability of Ni plating was investigated because it was brought out that Ni plating becomes as a new weak point during high temperature cycle test ranged from −40 to 300°C. Mechanical properties of Ni plating were investigated first. Test specimens with plating and without plating for four point bending test were prepared to compare the difference. And stress-strain relation of plating was evaluated. In addition, fatigue strength was investigated by cyclic bending test. With these material properties, fatigue life of Ni plating in packaging structure was evaluated by finite-element-analysis. And optimum dimension of the structure was studied.

TCT Reliability of Organic Passivation Layer for WLCSP

2015 ◽  
Vol 2015 (1) ◽  
pp. 000505-000509 ◽  
Author(s):  
Mitsuru Fujita ◽  
Atsushi Fujii ◽  
Shuji Shimoda ◽  
Yoshiharu Kariya
Keyword(s):  
Passivation Layer ◽  
Fatigue Properties ◽  
Temperature Cycle ◽  
Wafer Level ◽  
Element Analysis ◽  
Joint Reliability ◽  
Solder Bumps ◽  
Temperature Cycle Test ◽  
Board Level ◽  
Interconnect Technology

Wafer level chip scale packages (WLCSP) have been increasingly used in portable electronic products such as mobile phones. Solder bumps with redistribution layer (RDL) are typical interconnect technology for WLCSP applications. One of the major concerns in joint reliability is the failure by temperature cyclic stresses. In addition, in terms of heat tolerance or device yields, process temperature of RDL dielectric is limited around 200deg.C in some packaging applications. According to our board level reliability test for temperature cycle test (TCT), photosensitive polyimide (PI) which is 200deg.C curable material has lower fail rate than polybenzoxazole (PBO) by TCT. In this study, we compared the actual board level test and Finite Element Analysis (FEA) during temperature cycle test, and correlated the mechanical and fatigue properties of passivation layer material with TCT reliability.

Power cycle reliability of SiC devices with metal-sinter die-attach and thermostable molding

2017 ◽  
Vol 2017 (1) ◽  
pp. 000008-000012 ◽  
Author(s):  
Shijo Nagao ◽  
Hirofumi Fujita ◽  
Akio Shimoyama ◽  
Shinya Seki ◽  
Hao Zhang ◽  
...  
Keyword(s):  
High Temperature ◽  
Cooling System ◽  
High Reliability ◽  
Life Time ◽  
Industrial Applications ◽  
Junction Temperature ◽  
Power Devices ◽  
Thermal Reliability ◽  
Device Structure ◽  
Die Attach

Abstract Metal paste sintering die-attach is recently attracting much attention as an alternative to Pb containing high temperature solders, particularly required for power device packaging with post-Si wide band-gap semiconductors. For high voltage and high power devices, which are used in electric vehicles, railway trains, or power grid systems, SiC MSOFET/SBD devices are emerging replacing Si IGBT devices. These SiC devices have two prominent advantages to traditional Si based devices: fast switching and high maximum junction temperature TJ. The excellent characteristics serve for miniaturization of the device module; the former allows to use smaller capacitor and reactors because of the high frequency, and the latter excludes cooling system without affecting the device life time. However, the thermal reliability should be critically tested before used in industrial applications. We have hence conducted comprehensive reliability tests using several types of metal sintering die-attach including Ag and Cu. High temperature storage tests at 250°C certify that the device structure is truly thermostable, and thermal cycling between −50°C and 250°C indicates that the thermomechanical stress caused by device package design is the key for high reliability of power devices. Power cycling demonstrates the usefulness for effective acceleration tests to estimate the device life time. Our results conclude that present metal paste die-attach is ready for use in the product instead of high temperature solders.

ALUMINUM 1100

Alloy Digest ◽  
1974 ◽  
Vol 23 (2) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Shear Strength ◽  
High Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
Pure Aluminum ◽  
Heat Treating ◽  
Industrial Applications ◽  
Temperature Performance ◽  
Commercially Pure

Abstract ALUMINUM 1100 is commercially pure aluminum and is characterized by its excellent ability to be drawn, spun, stamped or forged. It has good weldability, excellent resistance to corrosion and many home, architectural and industrial applications. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and shear strength as well as fatigue. It also includes information on low and high temperature performance, and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Al-44. Producer or source: Various aluminum companies. Originally published October 1956, revised February 1974.

KYNAL P10

Alloy Digest ◽  
1957 ◽  
Vol 6 (10) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Shear Strength ◽  
High Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
Pure Aluminum ◽  
Heat Treating ◽  
High Corrosion Resistance ◽  
Temperature Performance ◽  
Commercially Pure

Abstract KYNAL P10 is a grade of commercially pure aluminum having high corrosion resistance and fabricating qualities. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and shear strength as well as fatigue. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Al-57. Producer or source: Imperial Chemical Industries Inc..

Low-Temperature Post-Oxidation Annealing Using Atomic Hydrogen Radicals Generated by High-Temperature Catalyzer for Improvement in Reliability of Thermal Oxides on 4H-SiC

2006 ◽  
Vol 527-529 ◽  
pp. 999-1002
Author(s):  
Junji Senzaki ◽  
Atsushi Shimozato ◽  
Kenji Fukuda
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Atomic Hydrogen ◽  
High Reliability ◽  
Hydrogen Atmosphere ◽  
Exposed Sample ◽  
New Apparatus ◽  
Hydrogen Radical ◽  
Hydrogen Radicals ◽  
Sic Wafer

Low-temperature post-oxidation annealing (POA) process of high-reliability thermal oxides grown on 4H-SiC using new apparatus that generates atomic hydrogen radicals by high-temperature catalyzer has been investigated. Atomic hydrogen radicals were generated by thermal decomposition of H2 gas at the catalyzer surface heated at high temperature of 1800°C, and then exposed to the sample at 500°C in reactor pressure of 20 Pa. The mode and maximum values of field-to-breakdown are 11.0 and 11.2 MV/cm, respectively, for the atomic hydrogen radical exposed sample. In addition, the charge-to-breakdown at 63% cumulative failure of the thermal oxides for atomic hydrogen radical exposed sample was 0.51 C/cm2, which was higher than that annealed at 800°C in hydrogen atmosphere (0.39 C/cm2). Consequently, the atomic hydrogen radical exposure at 500°C has remarkably improved the reliability of thermal oxides on 4H-SiC wafer, and is the same effect with high-temperature hydrogen POA at 800°C.

scholarly journals Evaluation on the Bond Capacity of the Fire-Protected FRP Bonded to Concrete Under High Temperature

2021 ◽  
Vol 15 (1) ◽  
Author(s):  
Soo-yeon Seo ◽  
Jong-wook Lim ◽  
Su-hyun Jeong
Keyword(s):  
High Temperature ◽  
Critical Temperature ◽  
Temperature Variation ◽  
Fire Resistance ◽  
Fire Protection ◽  
Element Analysis ◽  
External Temperature ◽  
Near Surface ◽  
Board Type ◽  
The Face

AbstractTo figure out the change in the reinforcing effect of FRP system used for the retrofit of RC beam when it is exposed to high temperature, it is required to evaluate not only the behavior of the entire beam, but also the bond performance at anchorage zone through a bond test according to the increase of external temperature. Moreover, the study to find various fire-protection methods is necessary to prevent the epoxy from reaching the critical temperature during an exposure to high temperature. In this manner, the fire-resistance performances of externally bonded (EB) FRP and near-surface-mounted (NSM) FRP to concrete block were evaluated by high-temperature exposure tests after performing a fire-protection on the surface in this paper. Board-type insulation with mortar was considered for the fire-protection of FRP system. After the fire-protection of the FRPs bonded to concrete blocks, an increasing exposure temperature was applied to the specimens with keeping a constant shear bond stress between concrete and the FRP. Based on the result, the temperature when the bond strength of the FRP disappears was evaluated. In addition, a finite element analysis was performed to find a proper method for predicting the temperature variation of the epoxy which is fire-protected with board-type insulation during the increase of external temperature. As a result of the test, despite the same fire-protection, NSM specimens were able to resist 1.54–2.08 times higher temperature than EB specimens. In the design of fire-protection of FRP system with the board-type insulation, it is necessary to consider the transfer from sides as well as the face with FRP. If there is no insulation of FP boards on the sides, the epoxy easily reaches its critical temperature by the heat penetrated to the sides, and increasing the thickness of the FP board alone for the face with FRP does not increase the fire-resistance capacity. As a result of the FE analysis, the temperature variation at epoxy can be predicted using the analytical approach with the proper thermal properties of FP mortar and board.

scholarly journals Mechanical Properties of Spruce Wood Extracted from GLT Beams Loaded by Fire

2021 ◽  
Vol 13 (10) ◽  
pp. 5494
Author(s):  
Lucie Kucíková ◽  
Michal Šejnoha ◽  
Tomáš Janda ◽  
Jan Sýkora ◽  
Pavel Padevět ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Cross Section ◽  
Negative Impact ◽  
Tensile Tests ◽  
Thermal Recovery ◽  
Bending Test ◽  
Small Scale ◽  
Spruce Wood ◽  
The Impact

Heating wood to high temperature changes either temporarily or permanently its physical properties. This issue is addressed in the present contribution by examining the effect of high temperature on residual mechanical properties of spruce wood, grounding on the results of full-scale fire tests performed on GLT beams. Given these tests, a computational model was developed to provide through-thickness temperature profiles allowing for the estimation of a charring depth on the one hand and on the other hand assigning a particular temperature to each specimen used subsequently in small-scale tensile tests. The measured Young’s moduli and tensile strengths were accompanied by the results from three-point bending test carried out on two groups of beams exposed to fire of a variable duration and differing in the width of the cross-section, b=100 mm (Group 1) and b=160 mm (Group 2). As expected, increasing the fire duration and reducing the initial beam cross-section reduces the residual bending strength. A negative impact of high temperature on residual strength has also been observed from simple tensile tests, although limited to a very narrow layer adjacent to the charring front not even exceeding a typically adopted value of the zero-strength layer d0=7 mm. On the contrary, the impact on stiffness is relatively mild supporting the thermal recovery property of wood.

scholarly journals The Performance of Filava-Polysiloxane, Silres® H62C Composite in High Temperature Application

2021 ◽  
Vol 5 (6) ◽  
pp. 144
Author(s):  
Klaudio Bari ◽  
Thozhuvur Govindaraman Loganathan
Keyword(s):  
High Temperature ◽  
Flexural Strength ◽  
Flexural Modulus ◽  
Fire Retardant ◽  
Bending Test ◽  
Ongoing Research ◽  
Flexural Testing ◽  
Temperature Application ◽  
High Temperature Tensile ◽  
In Fire

The research aim is to investigate the performance of novel enriched mineral fibres (Filava) in polysiloxane SLIRES H62 resin. Specimens were manufactured using a vacuum bagging process and oven cured at 250 °C. Specimens were prepared for flexural testing according to BS EN ISO 14125:1998 to obtain flexural strength, modulus, and elongation. The mechanical strength was compared to similar composites, with the aim of determining composite performance index. The flexural modulus (9.7 GPa), flexural strength (83 MPa), and flexural strain (2.9%) were obtained from a three-point bending test. In addition, the study investigates the thermal properties of the composite using a state-of-art Zwick Roell high temperature tensile rig. The results showed Filava/Polysiloxane Composites had an ultimate tensile strength 400 MPa, Young’s modulus 16 GPa and strain 2.5% at 1000 °C, and no smoke and ash were observed during pyrolysis. Ongoing research is currently taking place to use Filava-H62 in fire-retardant enclosure for lithium-ferro-phosphate Batteries used in electric trucks.

Creep Modeling of Welded Joints Using the Theta Projection Concept and Finite Element Analysis

1999 ◽  
Vol 122 (1) ◽  
pp. 22-26 ◽  
Author(s):  
M. Law ◽  
W. Payten ◽  
K. Snowden
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
High Temperature ◽  
Welded Joints ◽  
Creep Model ◽  
Projection Data ◽  
Predictive Capability ◽  
Element Analysis ◽  
High Temperature And Pressure ◽  
Temperature And Pressure

Modeling of welded joints under creep conditions with finite element analysis was undertaken using the theta projection method. The results were compared to modeling based on a simple Norton law. Theta projection data extends the accuracy and predictive capability of finite element modeling of critical structures operating at high temperature and pressure. In some cases analyzed, it was found that the results diverged from those gained using a Norton law creep model. [S0094-9930(00)00601-6]

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