CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles

2020 ◽  
Author(s):  
Pardeep Shahi ◽  
Sarthak Agarwal ◽  
Satyam Saini ◽  
Amirreza Niazmand ◽  
Pratik Bansode ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Copper Nanoparticles ◽  
High Performance ◽  
Data Centers ◽  
Heat Dissipation ◽  
Great Promise ◽  
Thermal Mass ◽  
Air Cooling ◽  
Cold Plate ◽  
Cfd Analysis

Abstract In today’s world, most data centers have multiple racks with numerous servers in each of them. The high amount of heat dissipation has become the largest server-level cooling problem for the data centers. The higher dissipation required, the higher is the total energy required to run the data center. Although still the most widely used cooling methodology, air cooling has reached its cooling capabilities especially for High-Performance Computing data centers. Liquid-cooled servers have several advantages over their air-cooled counterparts, primarily of which are high thermal mass, lower maintenance. Nano-fluids have been used in the past for improving the thermal efficiency of traditional dielectric coolants in the power electronics and automotive industry. Nanofluids have shown great promise in improving the convective heat transfer properties of the coolants due to a proven increase in thermal conductivity and specific heat capacity. The present research investigates the thermal enhancement of the performance of de-ionized water-based dielectric coolant with Copper nanoparticles for a higher heat transfer from the server cold plates. Detailed 3-D modeling of a commercial cold plate is completed and the CFD analysis is done in a commercially available CFD code ANSYS CFX. The obtained results compare the improvement in heat transfer due to improvement in coolant properties with data available in the literature.

CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles

2021 ◽  
Author(s):  
Pardeep Shahi ◽  
Sarthak Agarwal ◽  
Satyam Saini ◽  
Pratik Bansode ◽  
Amirreza Niazmand ◽  
...  
Keyword(s):  
Copper Nanoparticles ◽  
Cold Plate ◽  
Cfd Analysis

Convective Cooling of Compact Electronic Devices via Liquid Metals with Low Melting Points

2021 ◽  
Author(s):  
Guilin Liu ◽  
Jing Liu
Keyword(s):  
Heat Transfer ◽  
Melting Point ◽  
Liquid Metal ◽  
High Performance ◽  
Flow Resistance ◽  
Heat Dissipation ◽  
Liquid Metals ◽  
Electronic Devices ◽  
Convective Cooling ◽  
Heat Exchanger Design

Abstract The increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. Among the currently available thermal management schemes, the convective liquid metal cooling provides considerably high performance due to their unique thermal properties. This paper firstly reviews the studies on convective cooling using low-melting-point metals published in the past few decades. A group of equations for the thermophysical properties of In-Ga-Sn eutectic alloy is then documented by rigorous literature examination, following by a section of correlations for the heat transfer and flow resistance calculation to partially facilitate the designing work at the current stage. The urgent need to investigate the heat transfer and flow resistance of forced convection of low-melting-point metals in small/mini-channels, typical in compact electronic devices, is carefully argued. Some special aspects pertaining to the practical application of this cooling technique, including the entrance effect, mixed convection, and compact liquid metal heat exchanger design, are also discussed. Finally, future challenges and prospects are outlined.

Effect of Film-Cooling Hole Location on Turbulator Heat Transfer Enhancement in Turbine Blade Internal Air-Cooling Circuits

1999 ◽  
Author(s):  
J. M. McDonough ◽  
V. E. Garzón ◽  
D. E. Schulte
Keyword(s):  
Heat Transfer ◽  
Film Cooling ◽  
High Performance ◽  
Turbulence Modeling ◽  
Pressure Coefficient ◽  
Turbine Blades ◽  
Air Cooling ◽  
Eddy Simulation ◽  
Cooling Hole ◽  
Cooling Air

Numerical results demonstrating the effect of film-cooling hole placement on turbulator heat transfer effectiveness in internal convective cooling air circuits of turbine blades in high-performance gas turbine engines is presented for a two-dimensional model problem. Of particular interest will be the performance of a new turbulence modeling formalism similar to large-eddy simulation (LES) but employing subgrid-scale models constructed from nonlinear discrete dynamical systems, and not requiring filtering of the resolved-scale governing equations. Computed results for temperature distribution, flow streamlines, pressure coefficient and heat transfer Stanton number are compared for three different cooling hole/turbulator configurations, and turbulence kinetic energy is compared with results from a standard k-ε model.

Understanding the True Total Cost of Ownership of Water Cooling for Data Centers

2015 ◽  
Author(s):  
Dustin W. Demetriou ◽  
Vinod Kamath ◽  
Howard Mahaney
Keyword(s):  
Data Center ◽  
Data Centers ◽  
Heat Dissipation ◽  
Cost Effective ◽  
Electric Utility ◽  
Air Cooling ◽  
Water Cooling ◽  
Total Cost Of Ownership ◽  
Total Cost ◽  
Cost Of Ownership

The generation-to-generation IT performance and density demands continue to drive innovation in data center cooling technologies. For many applications, the ability to efficiently deliver cooling via traditional chilled air cooling approaches has become inadequate. Water cooling has been used in data centers for more than 50 years to improve heat dissipation, boost performance and increase efficiency. While water cooling can undoubtedly have a higher initial capital cost, water cooling can be very cost effective when looking at the true lifecycle cost of a water cooled data center. This study aims at addressing how one should evaluate the true total cost of ownership for water cooled data centers by considering the combined capital and operational cost for both the IT systems and the data center facility. It compares several metrics, including return-on-investment for three cooling technologies: traditional air cooling, rack-level cooling using rear door heat exchangers and direct water cooling via cold plates. The results highlight several important variables, namely, IT power, data center location, site electric utility cost, and construction costs and how each of these influence the total cost of ownership of water cooling. The study further looks at implementing water cooling as part of a new data center construction project versus a retrofit or upgrade into an existing data center facility.

Numerical Investigation of Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling

2012 ◽  
Author(s):  
Gongnan Xie ◽  
Yanquan Liu ◽  
Bengt Sunden ◽  
Weihong Zhang ◽  
Jun Zhao
Keyword(s):  
Heat Transfer ◽  
Double Layer ◽  
Pressure Loss ◽  
Heat Dissipation ◽  
Thermal Characteristics ◽  
Parallel Flow ◽  
Air Cooling ◽  
Pumping Power ◽  
Liquid Cooling ◽  
Counter Flow

The problem involved in the increase of the chip output power of high-performance integrated electronic devices is the failure of reliability because of excessive thermal loads. This requires advanced cooling methods to manage the increase of the dissipated heat. The traditional air-cooling may not meet the requirements, and therefore a new generation of liquid cooling technology becomes necessary. Various microchannels are widely used to cool the electronic chips by a gas or liquid, but these microchannels are often designed to be single-layer channels. In this paper, the laminar heat transfer and pressure loss in a kind of double-layer microchannel have been investigated numerically. The layouts of parallel-flow and counter-flow for inlet/outlet flow directions are designed and then several sets of inlet flowrates are considered. The simulations show that such a double-layer microchannel can not only reduce the pressure drop effectively but also exhibits better thermal characteristics, and the parallel-flow layout is found to be better for heat dissipation when the pumping power is limited, while the counter-flow layout is better when a high pumping power is provided.

scholarly journals Cooling Caramel in Ethyl Alcohol: Constructing a Mathematical Model

2020 ◽  
Vol 50 (3) ◽  
pp. 425-438
Author(s):  
Anatoly Khvostov ◽  
Gazibeg Magomedov ◽  
Viktor Ryazhskikh ◽  
Inessa Plotnikova ◽  
Aleksey Zhuravlev ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Mathematical Model ◽  
High Performance ◽  
Experimental Studies ◽  
Transient Heat Conduction ◽  
Flow Speed ◽  
Model Parameters ◽  
Air Cooling ◽  
Radial Temperature ◽  
Cooling Period

Introduction. The process of air-cooling caramel remains one of the most complicated issues of contemporary food industry, since it is time-consuming and requires multi-level cooling units. Therefore, the development of an innovative method of cooling caramel in “cold” potable ethanol is an urgent task the modern food science has to solve. The method op-timizes and intensifies the technological process, as it reduces production areas by eliminating some technological stages and complex units of metal-intensive and energyintensive equipment. It gives caramel antiseptic properties and a perfectly smooth, shiny, and dry surface. Study objects and methods. The research objective was to develop a fundamentally new and promising caramel technology. The experimental studies on the production and cooling were performed in a mixing and forming multi-unit with a high-performance cooling chamber. The chamber had functions of automatic measurements and control of the main parameters of the cooling process. The research used “cold” potable ethanol. Results and discussion. The paper introduces a mathematical model of the process of cooling caramel in ethanol. It includes heat transfer processes in alcohol, in the caramel mass, and on their border. The model was based on equations of transient heat conduction in a sphere. The process of heat exchange with the environment, i.e. alcohol, was characterized by the coefficient of heat transfer from the sphere. The model parameters included dynamic viscosity, density, thermal conductivity coefficient, and specific heat capacity. Based on the experimental data, the parameters were ap-proximated as a function of temperature by a cubic polynomial. Conclusion. The developed mathematical model made it possible to estimate the radial temperature distribution of caramel in the form of a sphere during its convective cooling in ethanol. The model also predicted the change in the average volume temperature of the caramel and energy costs depending on the cooling period, the flow speed of the ethanol, the thermophysical properties of the caramel and the cooling agent. The proposed mathematical model can be used to calculate the required consumption of ethanol for cooling and backwater of the caramel production line.

Heat Transfer Characteristics of a Train of Droplets Impinging Over a Hot Surface: From Film Evaporation to Leidenfrost Point

2019 ◽  
Author(s):  
Ganesh Guggilla ◽  
Arvind Pattamatta ◽  
Ramesh Narayanaswamy
Keyword(s):  
Heat Transfer ◽  
High Performance ◽  
Heated Surface ◽  
Electronics Cooling ◽  
Spray Cooling ◽  
High Heat ◽  
Heat Fluxes ◽  
Air Cooling ◽  
Heat Transfer Characteristics ◽  
Transfer Characteristics

Abstract Due to the advancements in computing services such as machine learning and artificial intelligence, high-performance computing systems are needed. Consequently, the increase in electron chip density results in high heat fluxes and required sufficient thermal management to maintain the servers. In recent times, the liquid cooling techniques become prominent over air cooling as it has significant advantages. Spray cooling is one such efficient cooling process which can be implemented in electronics cooling. To enhance the knowledge of the process, detailed studies of fundamental mechanisms involved in spray cooling such as single droplet and multiple droplet interactions are required. The present work focuses on the study of a train of droplets impinging over a heated surface using FC-72 liquid. The surface temperature is chosen as a parameter, and the Dynamic Leidenfrost point (DLP) for the present impact conditions is identified. Spread hydrodynamics and heat transfer characteristics of these consecutively impinging droplets till the Leidenfrost temperature, are studied and compared.

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

2021 ◽  
Vol 143 (3) ◽  
Author(s):  
Yuanchen Hu ◽  
Md Obaidul Hossen ◽  
Zhimin Wan ◽  
Muhannad S. Bakir ◽  
Yogendra Joshi
Keyword(s):  
Heat Transfer ◽  
Integrated Circuit ◽  
High Performance ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Heat Removal ◽  
Power Estimation ◽  
Leakage Power ◽  
Pin Fin ◽  
Pin Fins

Abstract Three-dimensional (3D) stacked integrated circuit (SIC) chips are one of the most promising technologies to achieve compact, high-performance, and energy-efficient architectures. However, they face a heat dissipation bottleneck due to the increased volumetric heat generation and reduced surface area. Previous work demonstrated that pin-fin enhanced microgap cooling, which provides fluidic cooling between layers could potentially address the heat dissipation challenge. In this paper, a compact multitier pin-fin single-phase liquid cooling model has been established for both steady-state and transient conditions. The model considers heat transfer between layers via pin-fins, as well as the convective heat removal in each tier. Spatially and temporally varying heat flux distribution, or power map, in each tier can be modeled. The cooling fluid can have different pumping power and directions for each tier. The model predictions are compared with detailed simulations using computational fluid dynamics/heat transfer (CFD/HT). The compact model is found to run 120–600 times faster than the CFD/HT model, while providing acceptable accuracy. Actual leakage power estimation is performed in this codesign model, which is an important contribution for codesign of 3D-SICs. For the simulated cases, temperatures could decrease 3% when leakage power estimation is adopted. This model could be used as electrical-thermal codesign tool to optimize thermal management and reduce leakage power.

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

2015 ◽  
Author(s):  
Kourosh Nemati ◽  
Husam A. Alissa ◽  
Bruce T. Murray ◽  
Bahgat Sammakia ◽  
Mark Seymour
Keyword(s):  
Data Centers ◽  
Heat Dissipation ◽  
Cooling System ◽  
Air Flow ◽  
Sensitivity Study ◽  
Average Error ◽  
Air Cooling ◽  
Cfd Validation ◽  
Air Cooling System ◽  
Good Agreement

Because of the rapid growth in the number of data centers combined with the high density heat dissipation in the IT and telecommunications equipment, energy efficient thermal management of data centers has become a key research focus in the electronics packaging community. Traditional legacy data centers still rely largely on chilled air flow delivered to the IT equipment racks through perforated tiles from the raised floor plenum. When there is large variation in the amount of heat dissipated by the racks in a given aisle, the standard air cooling approach requires over-provisioning. Localized hybrid air-water cooling is one approach to more effectively control the cooling when there is wide variation in the amount of dissipation in neighboring racks. In a closed hybrid air-water cooled server cabinet, the generated heat is removed by a self-contained system that does not interact with the room level air cooling system. In this study, a comprehensive procedure for CFD validation in a close coupled hybrid cooled enclosed cabinet is described. The commercial enclosure has been characterized experimentally in an earlier study, where the effectiveness values were applied as boundary conditions to the compact heat exchanger model. Here, the previously obtained experimental data are used to validate the results from computational modeling. Two cases with different air flow rates are compared. Very good agreement is achieved, with the maximum overall average error less than 4%. Due to relatively high pressure inside the cabinet, it is possible that air leakage from the cabinet may be responsible for the discrepancy between the model and experimental results. A sensitivity study was applied to the validated model to investigate the effect leakage had on the cabinet’s performance.

Thermal Performance Maps for Forced Air Cooling of Ruggedized Electronics Enclosures

2007 ◽  
Author(s):  
Jesse VanEngelenhoven ◽  
Gary L. Solbrekken ◽  
Karl J. L. Geisler
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Heat Dissipation ◽  
Side Wall ◽  
Form Factors ◽  
Air Cooling ◽  
Heat Transfer Capacity ◽  
Flow Pressure ◽  
Forced Air ◽  
Analytic Models

Based on standard commercial form factors, this study explores chassis-level air cooling limits for ruggedized military electronics enclosures constrained by pressure drop requirements and fin manufacturing capabilities. Numeric and analytic models are developed and used to define a methodology for optimizing the geometry of longitudinal plate fins included in side wall ducts to maximize the amount of heat that can be dissipated from an air-cooled chassis. The results of these analyses are presented in the form of a performance map facilitate the identification of particular fin manufacturing process well-suited for a specified set of mass flow, pressure drop, and heat transfer requirements. Analysis results demonstrate that if isothermal boundaries can be achieved, the heat transfer capacity of the chassis will increase relative to isoflux boundary condition assumptions. As a means to this end, the incorporation of heat pipes into the chassis wall is explored to enhance heat spreading and approach the isothermal limits of heat dissipation in the airflow ducts.

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