A New Technique for Designing Low-Power High-Speed Domino Logic Circuits in FinFET Technology

2019 ◽  
Vol 28 (10) ◽  
pp. 1950165 ◽  
Author(s):  
Sandeep Garg ◽  
Tarun K. Gupta
Keyword(s):  
Low Power ◽  
High Speed ◽  
Supply Voltage ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Power Reduction ◽  
Maximum Power ◽  
Oxide Semiconductor ◽  
Domino Logic ◽  
Maximum Delay

In this paper, a fin field-effect transistor (FinFET)-based domino technique dynamic node-driven feedback transistor domino logic (DNDFTDL) is designed for low-power, high-speed and improved noise performance. In the proposed domino technique, the concept of current division is explored below the evaluation network for enhancement of performance parameters. Simulations are carried out for 32-nm complementary metal–oxide–semiconductor (CMOS) and FinFET node using HSPICE for 2-, 4-, 8- and 16-input OR gates with a DC supply voltage of 0.9[Formula: see text]V. Proposed technique shows a maximum power reduction of 73.93% in FinFET short-gate (SG) mode as compared to conditional stacked keeper domino logic (CSKDL) technique and a maximum power reduction of 72.12% as compared to modified high-speed clocked delay domino logic (M-HSCD) technique in FinFET low-power (LP) mode. The proposed technique shows a maximum delay reduction of 35.52% as compared to voltage comparison domino (VCD) technique in SG mode and a reduction of 25.01% as compared to current mirror footed domino logic (CMFD) technique in LP mode. The unity noise gain (UNG) of the proposed circuit is 1.72–[Formula: see text] higher compared to different existing techniques in FinFET SG mode and is 1.42–[Formula: see text] higher in FinFET LP mode. The Figure of Merit (FOM) of the proposed circuit is up to [Formula: see text] higher as compared to existing domino logic techniques because of lower values of power, delay and area and higher values of UNG of the proposed circuit. In addition, the proposed technique shows a maximum power reduction of up to 68.64% in FinFET technology as compared to its counterpart in CMOS technology.

A 4:1 multiplexer using low-power high-speed domino technique for large fan-in gates using FinFET

Circuit World ◽  
2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Sandeep Garg ◽  
Tarun Kumar Gupta
Keyword(s):  
Low Power ◽  
High Speed ◽  
Supply Voltage ◽  
Average Power ◽  
Complementary Metal Oxide Semiconductor ◽  
Propagation Delay ◽  
Oxide Semiconductor ◽  
Content Type ◽  
Maximum Delay ◽  
Average Power Consumption

Purpose This paper aims to propose a new fin field-effect transistor (FinFET)-based domino technique low-power series connected foot-driven transistors logic in 32 nm technology and examine its performance parameters by performing transient analysis. Design/methodology/approach In the proposed technique, the leakage current is reduced at footer node by a division of current to improve the performance of the circuit in terms of average power consumption, propagation delay and noise margin. Simulation of existing and proposed techniques are carried out in FinFET and complementary metal-oxide semiconductor technology at FinFET 32 nm technology for 2-, 4-, 8- and 16-input domino OR gates on a supply voltage of 0.9 V using HSPICE. Findings The proposed technique shows maximum power reduction of 77.74% in FinFET short gate (SG) mode in comparison with current-mirror-based process variation tolerant (CPVT) technique and maximum delay reduction of 51.34% in low power (LP) mode in comparison with CPVT technique at a frequency of 100 MHz. The unity noise gain of the proposed circuit is 1.10× to 1.54× higher in comparison with different existing techniques in FinFET SG mode and 1.11× to 1.71× higher in FinFET LP mode. The figure of merit of the proposed circuit is up to 15.77× higher in comparison with existing domino techniques. Originality/value The research proposes a new FinFET-based domino technique and shows improvement in power, delay, area and noise performance. The proposed design can be used for implementing high-speed digital circuits such as microprocessors and memories.

scholarly journals Investigation of PVT-Aware STT-MRAM Sensing Circuits for Low-VDD Scenario

Micromachines ◽  
2021 ◽  
Vol 12 (5) ◽  
pp. 551
Author(s):  
Zhongjian Bian ◽  
Xiaofeng Hong ◽  
Yanan Guo ◽  
Lirida Naviner ◽  
Wei Ge ◽  
...  
Keyword(s):  
Nonvolatile Memory ◽  
High Speed ◽  
Low Voltage ◽  
Supply Voltage ◽  
Random Access ◽  
Magnetic Tunnel Junction ◽  
Complementary Metal Oxide Semiconductor ◽  
Current Mode ◽  
Cmos Technology ◽  
Oxide Semiconductor

Spintronic based embedded magnetic random access memory (eMRAM) is becoming a foundry validated solution for the next-generation nonvolatile memory applications. The hybrid complementary metal-oxide-semiconductor (CMOS)/magnetic tunnel junction (MTJ) integration has been selected as a proper candidate for energy harvesting, area-constraint and energy-efficiency Internet of Things (IoT) systems-on-chips. Multi-VDD (low supply voltage) techniques were adopted to minimize energy dissipation in MRAM, at the cost of reduced writing/sensing speed and margin. Meanwhile, yield can be severely affected due to variations in process parameters. In this work, we conduct a thorough analysis of MRAM sensing margin and yield. We propose a current-mode sensing amplifier (CSA) named 1D high-sensing 1D margin, high 1D speed and 1D stability (HMSS-SA) with reconfigured reference path and pre-charge transistor. Process-voltage-temperature (PVT) aware analysis is performed based on an MTJ compact model and an industrial 28 nm CMOS technology, explicitly considering low-voltage (0.7 V), low tunneling magnetoresistance (TMR) (50%) and high temperature (85 °C) scenario as the worst sensing case. A case study takes a brief look at sensing circuits, which is applied to in-memory bit-wise computing. Simulation results indicate that the proposed high-sensing margin, high speed and stability sensing-sensing amplifier (HMSS-SA) achieves remarkable performance up to 2.5 GHz sensing frequency. At 0.65 V supply voltage, it can achieve 1 GHz operation frequency with only 0.3% failure rate.

scholarly journals Design and Analysis of SEU Hardened Latch for Low Power and High Speed Applications

2019 ◽  
Vol 9 (3) ◽  
pp. 21 ◽  
Author(s):  
Satheesh Kumar S ◽  
Kumaravel S
Keyword(s):  
Low Power ◽  
High Speed ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
High Energy ◽  
Oxide Semiconductor ◽  
High Energy Particle ◽  
Single Event Upset ◽  
Single Event ◽  
Clock Gating

Due to the reduction in technology scaling, gate capacitance and charge storage in sensitive nodes are rapidly decreasing, making Complementary Metal Oxide Semiconductor (CMOS) circuits more sensitive to soft errors caused by radiation. In this paper, a low-power and high-speed single event upset radiation hardened latch is proposed. The proposed latch can withstand single event upsets completely when the high energy particle hit on any one of its intermediate nodes. The proposed latch structure comprises of four CMOS feedback schemes and a Muller C-element with clock gating technique. For the sake of comparison, the proposed and the existing latches in the literature are implemented in 45nm CMOS technology. From the post layout simulation results, it may be noted that the proposed latch achieves 8% low power consumption, 95% less delay, and a 94% reduction in power-delay-product compared to the existing single event upset resilient and single event tolerant latches. Monte Carlo simulations show that the proposed latch is less sensitive to process, voltage, and temperature variations in comparison with the existing hardened latches in the literature.

scholarly journals A Novel High Linearity and Low Power Folded CMOS LNA for UWB Receivers

2017 ◽  
Vol 27 (03) ◽  
pp. 1850047
Author(s):  
Xin Zhang ◽  
Chunhua Wang ◽  
Yichuang Sun ◽  
Haijun Peng
Keyword(s):  
Low Power ◽  
Noise Figure ◽  
Supply Voltage ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Low Noise ◽  
Ultra Wideband ◽  
Oxide Semiconductor ◽  
High Linearity ◽  
Low Supply Voltage

This paper presents a high linearity and low power Low-Noise Amplifier (LNA) for Ultra-Wideband (UWB) receivers based on CHRT 0.18[Formula: see text][Formula: see text]m Complementary Metal-Oxide-Semiconductor (CMOS) technology. In this work, the folded topology is adopted in order to reduce the supply voltage and power consumption. Moreover, a band-pass LC filter is embedded in the folded-cascode circuit to extend bandwidth. The transconductance nonlinearity has a great impact on the whole LNA linearity performance under a low supply voltage. A post-distortion (PD) technique employing an auxiliary transistor is applied in the transconductance stage to improve the linearity. The post-layout simulation results indicate that the proposed LNA achieves a maximum power gain of 12.8[Formula: see text]dB. The input and output reflection coefficients both are lower than [Formula: see text][Formula: see text]dB over 2.5–11.5[Formula: see text]GHz. The input third-order intercept point (IIP3) is 5.6[Formula: see text]dBm at 8[Formula: see text]GHz and the noise figure (NF) is lower than 4.0[Formula: see text]dB. The LNA consumes 5.4[Formula: see text]mW power under a 1[Formula: see text]V supply voltage.

scholarly journals A Novel Domino Logic with Modified Keeper in 16nm CMOS Technology

2019 ◽  
Vol 23 (2) ◽  
Author(s):  
Anu Mehra ◽  
Smita Singhal ◽  
Upendra Tripathi
Keyword(s):  
Metal Oxide ◽  
High Speed ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Sleep Mode ◽  
Domino Logic ◽  
Power Delay Product ◽  
Or Gate

Domino logic is a clocked CMOS (Complementary Metal-Oxide Semiconductor) logic with fewer transistors than static CMOS logic. A PMOS (P-type Metal-Oxide Semiconductor) transistor, known as “keeper”, is included in the design to improve the noise tolerance performance and to reduce the leakage current. The aspect ratio i.e. W/L of the keeper (W=width and L=length) is kept low for the correct functionality of the domino logic. This paper proposes a domino logic with modified keeper in order to improve the circuit with respect to power and area as compared to various existing techniques of domino logic i.e. clock delayed domino logic (CDD), high speed domino logic (HSD), multi threshold high speed domino logic (MHSD), clock delayed sleep mode domino logic (CDSMD), sleep switch domino logic (SSDD), PMOS only sleep switch domino logic (PSSDD), reduced delay variations domino logic (RDVD) and Foot Driven Stack Transistor Domino Logic (FDSTDL). The proposed as well as existing domino logics, for 8-input as well as 16-input OR gate in 16nm CMOS technology, are simulated for different values of W/L of keeper with W/L ratio ranging from 1 to 6. The power-delay-product(PDP) of proposed design has improved as compared to the existing designs. For 8-input OR gate and W/L=6, PDP had improved to maximum of 99.99% for CDD and minimum of 38.09% for SSDD.

scholarly journals Low Power Robust Early Output Asynchronous Block Carry Lookahead Adder with Redundant Carry Logic

Electronics ◽  
2018 ◽  
Vol 7 (10) ◽  
pp. 243 ◽  
Author(s):  
Padmanabhan Balasubramanian ◽  
Douglas Maskell ◽  
Nikos Mastorakis
Keyword(s):  
Low Power ◽  
Digital Signal Processor ◽  
Digital Signal ◽  
Complementary Metal Oxide Semiconductor ◽  
Low Power Design ◽  
Cmos Technology ◽  
General Purpose ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Power Cycle

Adder is an important datapath unit of a general-purpose microprocessor or a digital signal processor. In the nanoelectronics era, the design of an adder that is modular and which can withstand variations in process, voltage and temperature are of interest. In this context, this article presents a new robust early output asynchronous block carry lookahead adder (BCLA) with redundant carry logic (BCLARC) that has a reduced power-cycle time product (PCTP) and is a low power design. The proposed asynchronous BCLARC is implemented using the delay-insensitive dual-rail code and adheres to the 4-phase return-to-zero (RTZ) and the 4-phase return-to-one (RTO) handshaking. Many existing asynchronous ripple-carry adders (RCAs), carry lookahead adders (CLAs) and carry select adders (CSLAs) were implemented alongside to perform a comparison based on a 32/28 nm complementary metal-oxide-semiconductor (CMOS) technology. The 32-bit addition was considered for an example. For implementation using the delay-insensitive dual-rail code and subject to the 4-phase RTZ handshaking (4-phase RTO handshaking), the proposed BCLARC which is robust and of early output type achieves: (i) 8% (5.7%) reduction in PCTP compared to the optimum RCA, (ii) 14.9% (15.5%) reduction in PCTP compared to the optimum BCLARC, and (iii) 26% (25.5%) reduction in PCTP compared to the optimum CSLA.

Simulations and Modeling of TFET for Low Power Design

2016 ◽  
pp. 640-667 ◽  
Author(s):  
Sunil Kumar ◽  
Balwinder Raj
Keyword(s):  
Low Power ◽  
Semiconductor Industry ◽  
Complementary Metal Oxide Semiconductor ◽  
Low Power Design ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Manufacturing Cost ◽  
Technology Advancement ◽  
Channel Effects ◽  
Tunnel Fets

In Complementary Metal-Oxide-Semiconductor (CMOS) technology, scaling has been a main key for continuous progress in silicon-based semiconductor industry over the past four decades. However, as the technology advancement on nanometer scale regime for the purpose of building ultra-high density integrated electronic computers and extending performance, CMOS devices are facing fundamental problems such as increased leakage currents, large process parameter variations, short channel effects, increase in manufacturing cost, etc. The new technology must be energy efficient, dense, and enable more device function per unit area and time. There are many novel nanoscale semiconductor devices, this book chapter introduces and summarizes progress in the development of the Tunnel Field-Effect Transistors (TFETs) for low power design. Tunnel FETs are interesting devices for ultra-low power applications due to their steep sub-threshold swing (SS) and very low OFF-current. Tunnel FETs avoid the limit 60mv/decade by using quantum-mechanical Band-to-Band Tunneling (BTBT).

Design of Low Power Integrated CMOS Potentiometric Biosensor for Direct Electronic Detection of DNA Hybridization

2014 ◽  
Vol 67 (1) ◽  
Author(s):  
Wong How Hwan ◽  
Vinny Lam Siu Fan ◽  
Yusmeeraz Yusof
Keyword(s):  
Power Consumption ◽  
Low Power ◽  
Dna Hybridization ◽  
Point Of Care ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Channel Length ◽  
Electrical Signal ◽  
Oxide Semiconductor ◽  
Detection Circuit

The purpose of this research is to design a low power integrated complementary metal oxide semiconductor (CMOS) detection circuit for charge-modulated field-effect transistor (CMFET) and it is used for the detection of deoxyribonucleic acid (DNA) hybridization. With the available CMOS technology, it allows the realization of complete systems which integrate the sensing units and transducing elements in the same device. Point-of-care (POC) testing device is a device that allows anyone to operate anywhere and obtain immediate results. One of the important features of POC device is low power consumption because it is normally battery-operated. The power consumption of the proposed integrated CMOS detection circuit requires only 14.87 mW. The detection circuit will amplify the electrical signal that comes from the CMFET to a specified level in order to improve the recording characteristics of the biosensor. Self-cascode topology was used in the drain follower circuit in order to reduce the channel length modulation effect. The proposed detection circuit was designed with 0.18µm Silterra CMOS fabrication process and simulated under Cadence Simulation Tool. 

scholarly journals DIGITAL CONTROLLED OSCILLATOR (DCO) FOR ALL DIGITAL PHASE-LOCKED LOOP (ADPLL) – A REVIEW

2019 ◽  
Vol 82 (1) ◽  
Author(s):  
Florence Choong ◽  
Mamun Ibne Reaz ◽  
Mohamad Ibrahim Kamaruzzaman ◽  
Md. Torikul Islam Badal ◽  
Araf Farayez ◽  
...  
Keyword(s):  
Supply Voltage ◽  
Complementary Metal Oxide Semiconductor ◽  
Phase Locked Loop ◽  
Cmos Technology ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Process Technology ◽  
Chip Area ◽  
Digital Phase ◽  
Low Power Dissipation

Digital controlled oscillator (DCO) is becoming an attractive replacement over the voltage control oscillator (VCO) with the advances of digital intensive research on all-digital phase locked-loop (ADPLL) in complementary metal-oxide semiconductor (CMOS) process technology. This paper presents a review of various CMOS DCO schemes implemented in ADPLL and relationship between the DCO parameters with ADPLL performance. The DCO architecture evaluated through its power consumption, speed, chip area, frequency range, supply voltage, portability and resolution. It can be concluded that even though there are various schemes of DCO that have been implemented for ADPLL, the selection of the DCO is frequently based on the ADPLL applications and the complexity of the scheme. The demand for the low power dissipation and high resolution DCO in CMOS technology shall remain a challenging and active area of research for years to come. Thus, this review shall work as a guideline for the researchers who wish to work on all digital PLL.

scholarly journals A 2.6 GS/s 8-Bit Time-Interleaved SAR ADC in 55 nm CMOS Technology

Electronics ◽  
2019 ◽  
Vol 8 (3) ◽  
pp. 305 ◽  
Author(s):  
Dong Wang ◽  
Xiaoge Zhu ◽  
Xuan Guo ◽  
Jian Luan ◽  
Lei Zhou ◽  
...  
Keyword(s):  
High Speed ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Sar Adc ◽  
Oxide Semiconductor ◽  
Power Measurement ◽  
Cmos Process ◽  
Analog To Digital ◽  
Full Speed ◽  
Time Interleaved

This paper presents an eight-channel time-interleaved (TI) 2.6 GS/s 8-bit successive approximation register (SAR) analog-to-digital converter (ADC) prototype in a 55-nm complementary metal-oxide-semiconductor (CMOS) process. The channel-selection-embedded bootstrap switch is adopted to perform sampling times synchronization using the full-speed master clock to suppress the time skew between channels. Based on the segmented pre-quantization and bypass switching scheme, double alternate comparators clocked asynchronously with background offset calibration are utilized in sub-channel SAR ADC to achieve high speed and low power. Measurement results show that the signal-to-noise-and-distortion ratio (SNDR) of the ADC is above 38.2 dB up to 500 MHz input frequency and above 31.8 dB across the entire first Nyquist zone. The differential non-linearity (DNL) and integral non-linearity (INL) are +0.93/−0.85 LSB and +0.71/−0.91 LSB, respectively. The ADC consumes 60 mW from a 1.2 V supply, occupies an area of 400 μm × 550 μm, and exhibits a figure-of-merit (FoM) of 348 fJ/conversion-step.

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