Effect of channel and fin geometries on a trapeze plate-fin heat sink performance

2021 ◽  
pp. 095440892110059
Author(s):  
Özgür Özdilli ◽  
Seyfi Şevik
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Sink ◽  
Channel Model ◽  
Rectangular Channel ◽  
Heat Sinks ◽  
Junction Temperature ◽  
Base Temperature ◽  
Thermal Enhancement ◽  
Standard Plate

This study aims to achieve a minimum base temperature (or junction temperature) and hence better thermal performance. Trapezoidal curved plate-fin heat sink with dolphin fins and rectangular channel (Model-1) and trapezoidal curved plate-fin heat sink with dolphin fins, cut corner, and rectangular channel (Model-2) were designed and compared with a standard plate-fin heat sink. The effects of fins on the airflow and heat transfer in designed plate-fin heat sinks have been investigated numerically. The numeric results show that the use of fins and small changes in geometry significantly improve the heat transfer rate. Outcomes of the study showed 44–51% and 57–62% convective heat transfer enhancement compared with a standard plate-fin heat sink, without any overall mass augmentation, in Model-1 and Model-2, respectively. The presence of dolphin fins reduces the thermal resistance by up to 30%, which contributes to the overall thermal enhancement of the designed plate-fin heat sinks. Simulation results show that increasing the fins in areas close to the heat source and reducing the non-working areas significantly influence the thermal performance of heat sinks. The results also show that the trapeze plate-fin heat sinks with the different channel-fin geometries are superior to the standard trapeze plate-fin heat sink in thermal performance.

scholarly journals Experimental study on heat transfer performance of variable area straight fin heat sinks with PCM

2021 ◽  
pp. 299-299
Author(s):  
Rajasekaran Madhaiyan ◽  
Kannan Thannir Pandal Palayam Kandasamy ◽  
Kumaragurubaran Balasubramanian ◽  
Mohan Raman
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronics Cooling ◽  
Reynolds Numbers ◽  
Heat Sinks ◽  
Base Temperature ◽  
Pin Fin ◽  
Constant Area

The thermal performance of heat sinks with variable area straight fins with and without PCM is quantitatively explored in this article. The effects of diverse fin geometries (constant area straight fin, variable area straight fin, circular pin fin, hemispherical pin fin, and elliptical pin fin), varying Reynolds numbers, and fin densities on boosting electronics cooling performance were investigated. The goal of this research is to develop the best fin geometry for electronics cooling technologies. This research demonstrates that altering fin density can improve heat sink thermal performance while also reducing heat sink weight. The base temperature of the heat sink is found to be lower in variable area straight fins. In comparison to alternative configurations for heat transfer with PCM, the results show that variable area straight fin heat sinks are the most effective. The thermal resistance of the improved heat sink with variable fin density was reduced by 9%.

scholarly journals Study of Mini Channel Heat Sink with Different Internal Configuration

2020 ◽  
Vol 319 ◽  
pp. 02004
Author(s):  
Muhammad Akif Rahman ◽  
Md Badrath Tamam ◽  
Md Sadman Faruque ◽  
A.K.M. Monjur Morshed
Keyword(s):  
Nusselt Number ◽  
Thermal Performance ◽  
Heat Sink ◽  
Rectangular Channel ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Rectangular Channels ◽  
Flow Through ◽  
Internal Configuration

In this paper a numerical analysis of three-dimensional laminar flow through rectangular channel heat sinks of different geometric configuration is presented and a comparison of thermal performance among the heat sinks is discussed. Liquid water was used as coolant in the aluminum made heat sink with a glass cover above it. The aspect ratio (section height to width) of rectangular channels of the mini-channel heat sink was 0.33. A heat flux of 20 W/cm2 was continuously applied at the bottom of the channel with different inlet velocity for Reynold’s number ranging from 150 to 1044. Interconnectors and obstacles at different positions and numbers inside the channel were introduced in order to enhance the thermal performance. These modifications cause secondary flow between the parallel channels and the obstacles disrupt the boundary layer formation of the flow inside the channel which leads to the increase in heat transfer rate. Finally, Nusselt number, overall thermal resistance and maximum temperature of the heat sink were calculated to compare the performances of the modified heat sinks with the conventional mini channel heat sink and it was observed that the heat sink with both interconnectors and obstacles enhanced the thermal performance more significantly than other configurations. A maximum of 36% increase in Nusselt number was observed (for Re =1044).

Experimental Investigation of a PCM-Based Topology Optimized Heat Sink for Passive Cooling of Electronics

2020 ◽  
Author(s):  
Jin Yao Ho ◽  
Kai Choong Leong
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Volume Fraction ◽  
Solid Volume Fraction ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Base Temperature ◽  
Storage Unit ◽  
Cooling Of Electronics

Abstract A thermal energy storage unit filled with phase change material (PCM) can serve as a heat sink for the cooling of electronics with intermittent or periodic heat dissipation rates. The use of thermal conductive structures (TCS) is an effective method of improving the thermal performance of a PCM-based heat sink. In this paper, topology optimization is explored to develop a new class of TCS with a tree-like structure to enhance the thermal performance of a trapezoidal heat sink. The topology-optimized heat sink was then fabricated by Selective Laser Melting (SLM) using an aluminum alloy, AlSi10Mg, as the base powder. Experiments were performed to evaluate the thermal performance of the topology-optimized heat sink with the tree-like structure. In addition, a conventional longitudinal-fin heat sink of the same solid volume fraction (φ = 16.2%) and a heat sink without enhanced structure were also fabricated and experimentally investigated for comparison. Rubitherm RT-35HC paraffin wax was used as the PCM. Three different heat fluxes of 4.00 kW/m2, 5.08 kW/m2 and 7.24 kW/m2 were applied at the base of each specimen by a silicone rubber heater. The structure wall and the PCM temperatures were measured over time. Our results show that, for all heat rates tested, the topology-optimized heat sink was able to maintain a lower base temperature as compared to the fin-structure and the plain heat sinks. A thermal enhancement ratio (ε) is defined to evaluate the performance of the heat sinks with and without the use of PCM. From the experimental results, the highest ε value of 8.6 was achieved by the topology-optimized heat sink. These results indicate the better performance of the topology-optimized heat sink in dissipating heat as compared to the other specimens.

Computational fluid dynamics for thermal performance of a water-cooled minichannel heat sink with different chip arrangements

2014 ◽  
Vol 24 (4) ◽  
pp. 797-810 ◽  
Author(s):  
Gongnan Xie ◽  
Shian Li ◽  
Bengt Sunden ◽  
Weihong Zhang
Keyword(s):  
Heat Transfer ◽  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Bottom Surface ◽  
Moderate Pressure ◽  
Content Type

Purpose – With the development of electronic devices, including the desires of integration, miniaturization, high performance and the output power, cooling requirement of chips have been increased gradually. Water-cooled minichannel is an effective cooling technology for cooling of heat sinks. The minichannel flow geometry offers large surface area for heat transfer and a high convective heat transfer coefficient with only a moderate pressure loss. The purpose of this paper is to analyze a minichannel heat sink having the bottom size of 35 mm×35 mm numerically. Two kinds of chip arrangement are investigated: diagonal arrangement and parallel arrangement. Design/methodology/approach – Computational fluid dynamics (CFD) technique is used to investigate the flow and thermal fields in forced convection in a three-dimensional minichannels heat sink with different chip arrangements. The standard k-e turbulence model is applied for the turbulence simulations on the minichannel heat sink. Findings – The results show that the bottom surface of the heat sink with various chip arrangements will have different temperature distribution and thermal resistance. A suitable chip arrangement will achieve a good cooling performance for electronic devices. Research limitations/implications – The fluid is incompressible and the thermophysical properties are constant. Practical implications – New and additional data will be helpful as guidelines in the design of heat sinks to achieve a good thermal performance and a long lifetime in operation. Originality/value – In real engineering situations, chips are always placed in various manners according to design conditions and constraints. In this case the assumption of uniform heat flux is acceptable for the surfaces of the chips rather than for the entire bottom surface of the heat sink.

Heat Transfer Analysis of Supercritical Methane in Microchannels with Different Geometric Configurations On High Power Electromechanical Actuator

2022 ◽  
Author(s):  
Zhigang Gao ◽  
Tianhu Wang ◽  
Yuxin Yang ◽  
Xiaolong Shang ◽  
Junhua Bai ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Heat Removal ◽  
Electrical Equipment ◽  
Heat Sinks ◽  
Electromechanical Actuator ◽  
Regenerative Cooling ◽  
Geometric Configurations

Abstract The issue of regenerative cooling is one of the most important key technologies of flight vehicles, which is applied into both the engine and high-power electrical equipment. One pattern of regenerative cooling channels is the microchannel heat sinks, which are thought as a prospective means of improving heat removal capacities on electrical equipment of smaller sizes. In this paper, three numerical models with different geometric configurations, namely straight, zigzag, and sinusoid respectively, are built to probe into the thermal hydraulic performance while heat transfer mechanism of supercritical methane in microchannel heat sinks for the heat removal of high-power electromechanical actuator is also explored. In addition, some crucial influence factors on heat transfer such as inlet Reynolds number, operating pressure and heating power are investigated. The calculation results imply the positive effect of wavy configurations on heat transfer and confirm the important effect of buoyancy force of supercritical methane in channels. The heat sinks with wavy channel show obvious advantages on comprehensive thermal performance including overall thermal performance parameter ? and thermal resistance R compared with that of the straight one. The highest Nu and average heat transfer coefficient am appear in the heat sink with zigzag channels, but the pumping power of the heat sink with sinusoidal channels is lower due to the smaller flow loss.

Effect of Synthetic Jets Over Natural Convection Heat Sinks

2008 ◽  
Author(s):  
Mehmet Arik ◽  
Yogen Utturkar ◽  
Murat Ozmusul
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Synthetic Jet ◽  
Synthetic Jets ◽  
Operating Conditions ◽  
Heat Sinks ◽  
Junction Temperature ◽  
Allowable Limit

In moderate power electronics applications, the most preferred way of thermal management is natural convection to air with or without heat sinks. Though the use of heat sinks is fairly adequate for modest heat dissipation needs, it suffers from some serious performance limitations. Firstly, a large volume of the heat sink is required to keep the junction temperature at an allowable limit. This need arises because of the low convective film coefficients due to close spacing. In the present computational and experimental study, we propose a synthetic jet embedded heat sink to enhance the performance levels beyond two times within the same volume of a regular passive heat sink. Synthetic jets are meso-scale devices producing high velocity periodic jet streams at high velocities. As a result, by carefully positioning of these jets in the thermal real estate, the heat transfer over the surfaces can be dramatically augmented. This increase in the heat transfer rate is able to compensate for the loss of fin area happening due to the embedding of the jet within the heat sink volume, thus causing an overall increase in the heat dissipation. Heat transfer enhancements of 2.2 times over baseline natural convection cooled heat sinks are measured. Thermal resistances are compared for a range of jet operating conditions and found to be less than 0.9 K/W. Local temperatures obtained from experimental and computational agreed within ± 5%.

scholarly journals Experimental analysis of effect of base with different inner geometries filled nano PCM for the thermal performance of the plate fin heat sink

2021 ◽  
pp. 243-243
Author(s):  
Periyannan Lakshmanan ◽  
Saravanan Periyasamy ◽  
Mohan Raman
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Reynolds Number ◽  
Phase Shift ◽  
Experimental Research ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Devices ◽  
Base Plate ◽  
Heat Sinks

Experimental research demonstrates the performance of electronic devices on plate fin heat sinks in order to guarantee that operating temperatures are kept as low as possible for reliability. Paraffin wax (PCM) is a substance that is used to store energy and the aluminum plate fin cavity base is chosen as a Thermal Conductivity Enhancer (TCEs). The effects of PCM material (Phase shift material), cavity form base (Rectangular, Triangular, Concave and Convex) with PCM, Reynolds number (Re= 4000-20000) on heat transfer effectiveness of plate fin heat sinks were experimentally explored in this research. The thermal performance of concave base plate fin heat sink with PCM is increased up to 7.8% compared to other cavity base heat sinks.

Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks

1994 ◽  
Vol 116 (3) ◽  
pp. 206-211 ◽  
Author(s):  
R. A. Wirtz ◽  
Weiming Chen ◽  
Ronghua Zhou
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Thermal Performance ◽  
Heat Sink ◽  
Design Guidelines ◽  
Heat Sinks ◽  
Air Cooling ◽  
Regular Array ◽  
Electronic Package ◽  
And Performance

Heat transfer experiments are reported on the thermal performance of longitudinal fin heat sinks attached to an electronic package which is part of a regular array of packages undergoing forced convection air cooling. The effect of coolant bypass on the performance of the heat sink is assessed and performance correlations for reduced heat transfer due to this effect are developed. These correlations are used to develop design guidelines for optimal performance.

The Flow and Heat Transfer Characteristic of Curved Channel CPU Water-Cooled Heat Sinks

2013 ◽  
Vol 391 ◽  
pp. 213-216
Author(s):  
Yan Feng Liu ◽  
Xiang Hong Li ◽  
Shi Ping Li
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Rectangular Channel ◽  
Transfer Characteristic ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Curved Channel ◽  
Flow And Heat Transfer ◽  
Heat Sink Temperature ◽  
Better Than

This article conducted numerical simulation and experimental study of curved channel laminar flow and heat transfer characteristics with different Reynolds number and different heat fluxes, it also showed the comparison with straight rectangular channel of a same heat transfer area. The results showed that: cooling effect of curved channel heat sink is better than that of straight rectangular channel heat sink, temperature distribution appears to be more uniform as well; The experimental results showed that the curved channel heat sink can effectively satisfy the needs of the CPU cooling.

scholarly journals Graph Theory-Based Mathematical Calculation Modeling for Temperature Distribution of LED Lights’ Convective Cooled Heat Sinks under Moisture Environment

2020 ◽  
Vol 2020 ◽  
pp. 1-12
Author(s):  
Bei-xuan Lyu ◽  
Yu-ren Chen ◽  
Yong Li
Keyword(s):  
Heat Transfer ◽  
Mathematical Model ◽  
Graph Theory ◽  
Transfer Process ◽  
Heat Sink ◽  
Heat Transfer Process ◽  
Heat Sinks ◽  
Junction Temperature ◽  
Model Based ◽  
Led Lights

In this paper, a mathematical model based on graph theory is proposed to calculate the heat distribution of LED lights’ convective cooled heat sink. First, the heat and mass transfer process of a single fin under moisture environment is analyzed. Then, the heat transfer process is characterized by a digraph, defining fins and joints of a heat sink as edges and vertices in graph theory. Finally, the whole heat transfer process is described by two criteria achieved based on graph theory. Therefore, the temperature-heat calculation equations of the whole heat sink are deduced. The accuracy of this model is verified by testing the junction temperature of different LED chips mounted on the same heat sink under moisture environment, and the relative errors between the calculated value and the experimental data are all within 5%, and it is also concluded from the model that heat sinks with an identical heat digraph but different types have close cooling performance and are verified by two typical heat sinks, cylindrical heat sink and rectangular plate-fin heat sink, under the same conditions. The mathematical model based on group theory developed in this paper combined with computer technology is convenient for the performance analysis among a large number of heat sink fin arrangement schemes.

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