scholarly journals The Gsi-Lbl Plastic Ball/Wall Spectrometer*

2020 ◽  
pp. 283-308
Author(s):  
H.-A. Gustafsson ◽  
K.G.R. Doss ◽  
H.H. Gutbrod ◽  
B. Kolb ◽  
H. Lohner ◽  
...  
Keyword(s):  
Plastic Ball

Backside Application of Acoustic Micro Imaging (AMI) on Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) Packages

2004 ◽  
Author(s):  
Luis A. Curiel ◽  
Andrew J. Komrowski ◽  
Daniel J.D. Sullivan
Keyword(s):  
Ball Grid Array ◽  
Acoustic Microscopy ◽  
Electronic Packages ◽  
Nondestructive Technique ◽  
Molding Compound ◽  
Microscopy Technique ◽  
Plastic Ball ◽  
Die Surface ◽  
Plastic Ball Grid Array ◽  
Bond Pads

Abstract Acoustic Micro Imaging (AMI) is an established nondestructive technique for evaluation of electronic packages. Non-destructive evaluation of electronic packages is often a critical first step in the Failure Analysis (FA) process of semiconductor devices [1]. The molding compound to die surface interface of the Plastic Ball Grid Array (PBGA) and Plastic Quad Flat Pack (PQFP) packages is an important interface to acquire for the FA process. Occasionally, with these packages, the standard acoustic microscopy technique fails to identify defects at the molding compound to die surface interface. The hard to identify defects are found at the edge of the die next to the bond pads or under the bonds wires. This paper will present a technique, Backside Acoustic Micro Imaging (BAMI) analysis, which can better resolve the molding compound to die surface interface at the die edge by sending the acoustic signal through the backside of the PBGA and PQFP packages.

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

Time Domain Reflectometry Technique for Failure Analysis

2004 ◽  
Author(s):  
Teoh King Long ◽  
Ko Yin Fern
Keyword(s):  
Failure Analysis ◽  
Time Domain ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Reference Plane ◽  
First Case ◽  
Main Emphasis ◽  
Plastic Ball ◽  
Solder Balls ◽  
Non Destructive

Abstract In time domain reflectometry (TDR), the main emphasis lies on the reflected waveform. Poor probing contact is one of the common problems in getting an accurate waveform. TDR probe normalization is essential before measuring any TDR waveforms. The advantages of normalization include removal of test setup errors in the original test pulse and the establishment of a measurement reference plane. This article presents two case histories. The first case is about a Plastic Ball Grid Array package consisting of 352 solder balls where the open failure mode was encountered at various terminals after reliability assessment. In the second, a three-digit display LED suspected of an electrical short failure was analyzed using TDR as a fault isolation tool. TDR has been successfully used to perform non-destructive fault isolation in assisting the routine failure analysis of open and short failure. It is shown to be accurate and reduces the time needed to identify fault locations.

COLLECTIVITY IN COMPOSITE FRAGMENT EMISSION FROM RELATIVISTIC HEAVY ION COLLISIONS

1987 ◽  
Vol 02 (10) ◽  
pp. 721-726 ◽  
Author(s):  
R. BOCK ◽  
G. CLAESSON ◽  
K. G. R. DOSS ◽  
R. L. FERGUSON ◽  
I. GAVRON ◽  
...  
Keyword(s):  
Heavy Ion Collisions ◽  
Heavy Ion ◽  
Collective Behaviour ◽  
Relativistic Heavy Ion Collisions ◽  
Ion Collisions ◽  
Plastic Ball

Composite fragments of 2 < Z < 10 have been measured in the Plastic Ball Spectrometer in 200 MeV/nucleon Au + Au and Au + Fe collisions. Strong azimuthal alignment of the fragments reveal the collective behaviour of the reaction.

X-ray bubble lens and x-ray hollow plastic ball lens

1998 ◽  
Author(s):  
Yoshiki Kohmura ◽  
Mitsuhiro Awaji ◽  
Yoshio Suzuki ◽  
Tetsuya Ishikawa
Keyword(s):  
X Ray ◽  
Title X ◽  
Plastic Ball

Cooling of Thermal Enhanced BGA Package Using Foam Metal Heat Sinks

2000 ◽  
Author(s):  
Jenn-Jiang Hwang ◽  
Chung-Hsing Chao
Keyword(s):  
Heat Sink ◽  
Power Dissipation ◽  
Thermal Characterization ◽  
Junction Temperature ◽  
Pin Fin ◽  
Bga Packages ◽  
Plastic Ball ◽  
Bga Package ◽  
Foam Metal ◽  
Forced Air

Abstract This study reported thermal performance of a thermally enhanced plastic ball grid array (PBGA), namely T2-BGA™ which incorporates a heat slug in package, with a foam-metal heat sink on the top of this package. Experimental measurement of junction-to-ambient thermal resistance is performed in accordance with the SEMI standards of G38-0996 and G42-0996 for thermal characterization of BGA packages. Allowable power dissipation is subject to the constraint of junction temperature (Tj) at 95°C and ambient temperature (Ta) in chassis at 35 °C under free and forced air (0 ∼ 3 m/s) conditions. Based on this constraint, allowable power dissipation of a regular PBGA with a commercial pin fin heat sink under free and 3 m/s forced air is 5.45 W and 9.17 W compared with those of T2-BGA with a foam heat sink of 6.80 W and 19.6 W respectively. This results show that T2-BGA™ with a foam heat sink offers enormous potential to high power package applications.

Sign in / Sign up

Export Citation Format

Share Document