A QoS provisioning architecture of fiber wireless network based on XGPON and IEEE 802.11ac

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Khalid H. Mohammadani ◽  
Rizwan A. Butt ◽  
Kamran A. Memon ◽  
Azhar A. Pirzado ◽  
Muhammad Faheem ◽  
...  

Abstract The integration of the XGPON network with the 5G WLAN network is a suitable solution for next-generation high-speed access Internet service. We demonstrated the integration of two different standards via the QoS concept. Further, this work also presents a proper mapping scheme of QoS traffic between XG-PON and fifth-generation Wi-Fi standards known as IEEE 802.11ac. The analysis assessment compares the behavior of different IEEE 802.11ac standards with XGPON with-respect-to multimedia traffic in the FiWi network. To assess the performance of the FiWi network, the OMNET++ and INET framework are used to carrying out a comparative analysis in terms of upstream (US) delay and fairness index. The study concludes that the EDCA Wi-Fi module has better performance than the DCF Wi-Fi module with the integrated XGPON system for the FiWi access network.

2020 ◽  
Vol 0 (0) ◽  
Author(s):  
Jinxia Yu ◽  
Shangya Han ◽  
Qing Ye ◽  
Panke Qin ◽  
Yongli Tang ◽  
...  

AbstractAn important problem of network traffic is how to efficiently carry massive amounts of data traffic generated by Peer-to-Peer (P2P) services in high-speed and large-capacity optical access networks. P2P file-sharing traffic is regarded as one of the biggest bandwidth consumption in the world. Internet service providers can reduce the bandwidth burden in the feeder fiber by localizing the network traffic. In this paper, we propose an enhanced redirection strategy based on the optimized MPCP protocol (ERS-MPCP) to redirect the traffic into the access network and reduce the latency. A Markov chain is used for mathematical modeling. In the proposed strategy, we build a simulation platform for network simulation. Simulation results show that our strategy can improve the overall redirection success rate by up to 9%, thereby reducing the data traffic burden on the core network.


2012 ◽  
Vol E95-B (3) ◽  
pp. 730-739 ◽  
Author(s):  
Kunitaka ASHIZAWA ◽  
Takehiro SATO ◽  
Kazumasa TOKUHASHI ◽  
Daisuke ISHII ◽  
Satoru OKAMOTO ◽  
...  

2020 ◽  
Vol 26 (3) ◽  
pp. 169-183
Author(s):  
Phudit Ampririt ◽  
Yi Liu ◽  
Makoto Ikeda ◽  
Keita Matsuo ◽  
Leonard Barolli ◽  
...  

The Fifth Generation (5G) networks are expected to be flexible to satisfy demands of high-quality services such as high speed, low latencies and enhanced reliability from customers. Also, the rapidly increasing amount of user devices and high user’s requests becomes a problem. Thus, the Software-Defined Network (SDN) will be the key function for efficient management and control. To deal with these problems, we propose a Fuzzy-based SDN approach. This paper presents and compares two Fuzzy-based Systems for Admission Control (FBSAC) in 5G wireless networks: FBSAC1 and FBSAC2. The FBSAC1 considers for admission control decision three parameters: Grade of Service (GS), User Request Delay Time (URDT) and Network Slice Size (NSS). In FBSAC2, we consider as an additional parameter the Slice Priority (SP). So, FBSAC2 has four input parameters. The simulation results show that the FBSAC2 is more complex than FBSAC1, but it has a better performance for admission control.


Author(s):  
Cédric Lopez ◽  
François Malburet ◽  
André Barraco

This paper studies problematic of a mechanical system composed of different coupled parts submitted to a high speed shock and proposes analysis of anti vibratory passive and active methods based on an experimental and theoretical coupled approach. After a shock, different parts of the system oscillate. If one of them is excited at a particular frequency, such as its proper frequency, important oscillations appear and can lead to the deterioration of the system by introducing important stresses. In this paper, we propose an analysis in order to understand this kind of problem and what we can do to avoid it. Firstly, we discuss problematic and we expose the studied system. In a second time, we develop two approaches of modeling that allow us to understand the phenomenon by carrying out numerical simulations. Then cross checking of model is completed via experimental study on drop test bench. Passive minimization method of vibrations based on experimental and theoretical coupled approach is exposed. Finally, a comparative analysis of different methods of control and experimental results of controlled system are presented.


Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1664
Author(s):  
Do Hoon Cho ◽  
Seong Min Seo ◽  
Jang Baeg Kim ◽  
Sri Harini Rajendran ◽  
Jae Pil Jung

With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging.


Sensors ◽  
2021 ◽  
Vol 22 (1) ◽  
pp. 26
Author(s):  
Ramraj Dangi ◽  
Praveen Lalwani ◽  
Gaurav Choudhary ◽  
Ilsun You ◽  
Giovanni Pau

In wireless communication, Fifth Generation (5G) Technology is a recent generation of mobile networks. In this paper, evaluations in the field of mobile communication technology are presented. In each evolution, multiple challenges were faced that were captured with the help of next-generation mobile networks. Among all the previously existing mobile networks, 5G provides a high-speed internet facility, anytime, anywhere, for everyone. 5G is slightly different due to its novel features such as interconnecting people, controlling devices, objects, and machines. 5G mobile system will bring diverse levels of performance and capability, which will serve as new user experiences and connect new enterprises. Therefore, it is essential to know where the enterprise can utilize the benefits of 5G. In this research article, it was observed that extensive research and analysis unfolds different aspects, namely, millimeter wave (mmWave), massive multiple-input and multiple-output (Massive-MIMO), small cell, mobile edge computing (MEC), beamforming, different antenna technology, etc. This article’s main aim is to highlight some of the most recent enhancements made towards the 5G mobile system and discuss its future research objectives.


Author(s):  
SABITA NAHATA ◽  
SUBRATA BHATTACHARYA

Inter-symbol interference (ISI) due to multipath fading is a vital problem in high-speed wireless communication which restricts communication quality and capacity. Therefore, in addition to choosing a fading mitigation technique, it is also important to strategically select a modulation scheme for effective data transmission. Recent literature review on wireless standards, such as 3G and 4G indicates that QAM and QPSK are suitable choices for data transmission. In this paper, a comparative analysis on selected modulation schemes is performed in a fading environment. The mitigation of fading is done using adaptive equalization technique. Also, we show that the signal to noise ratio (SNR) is an important parameter to choose. It is observed that, even when an adaptive equalizer is used at the receiver, a very low SNR gives very high symbol error rate (SER). We derive some important conclusions from our simulation result: QPSK shows minimum SER, whereas 256-PSK and 256-PAM perform worse. Given its spectral efficiency and a low SER, the best choice is 256- QAM.


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