The mechanism of sputter-induced epitaxy modification in YBCO (001) films grown on MgO (001) substrates

1998 ◽  
Vol 13 (12) ◽  
pp. 3378-3388
Author(s):  
Y. Huang ◽  
B. V. Vuchic ◽  
M. Carmody ◽  
P. M. Baldo ◽  
K. L. Merkle ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Film Growth ◽  
Ybco Film ◽  
Lattice Mismatch ◽  
Substrate Surface ◽  
Oriented Growth ◽  
Orientation Change ◽  
Large Lattice Mismatch ◽  
Major Factors ◽  
Hot Filament

The sputter-induced epitaxy change of in-plane orientation occurring in YBa2Cu3O7-x (001) thin films grown on MgO (001) substrates by pulsed organo-metallic beam epitaxy (POMBE) is investigated by a series of film growth and characterization experiments, including RBS and TEM. The factors influencing the orientation change are systematically studied. The experimental results suggest that the substrate surface morphology change caused by the ion sputtering and the Ar ion implantation in the substrate surface layer are not the major factors that affect the orientation change. Instead, the implantation of W ions, which come from the hot filament of the ion gun, and the initial Ba deposition layer in the YBCO film growth play the most important roles in controlling the epitaxy orientation change. Microstructure studies show that a BaxMg1-xO buffer layer is formed on top of the sputtered substrate surface due to Ba diffusion into the W implanted layer. It is believed that the formation of this buffer layer relieves the large lattice mismatch and changes the YBCO film from the 45° oriented growth to the 0° oriented growth.

Fabrication and Properties of Epitaxial Buffer Layers on Nonmagnetic Textured Ni Based Alloy Substrates

1999 ◽  
Vol 13 (09n10) ◽  
pp. 1029-1034 ◽  
Author(s):  
G. Celentano ◽  
V. Boffa ◽  
L. Ciontea ◽  
F. Fabbri ◽  
V. Galluzzi ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Ybco Film ◽  
Lattice Mismatch ◽  
Substrate Surface ◽  
Liquid Nitrogen Temperature ◽  
Metallic Substrate ◽  
Buffer Layers ◽  
X Ray Diffraction ◽  
Metallic Substrates ◽  
Layer Deposition

Biaxially aligned YBCO thick films on oxide buffered metallic substrates is a promising route toward the fabrication of superconducting tapes operating at liquid nitrogen temperature. The role of buffer layer is to reduce the lattice mismatch between the substrate and the YBCO film, to adapt the thermal expansion coefficient, to hamper the diffusion of Ni in YBCO film and to prevent the oxidation of the metallic substrate surface. This paper presents a study regarding CeO 2 buffer layer deposition on a new nonmagnetic (001)[100] textured Ni-V alloy substrates. The deposition of CeO 2 was performed by both pulsed laser ablation and e-beam evaporation techniques. The θ-2θ X-ray diffraction pattern mainly exhibits the (00l) peaks of CeO 2, indicating that the films are epitaxially grown with the c axis perpendicular to the substrate. Rocking curved through the CeO 2 (002) peak have a FWHM of about 6°. The SEM studies have shown that the surface is smooth, continuos and free of cracks. Texture analysis reveals a good in-plane orientation for the ablated CeO 2 film, whereas the electron beam evaporated CeO 2 shows two textures in the growth plane. Further efforts are focused on the deposition of YBCO thick film on the as buffered nonmagnetic metallic substrate.

Comparison of Different Substrate Pre-Treatments on the Quality of GaN Film Growth on 6H-, 4H-, and 3C-SiC

2000 ◽  
Vol 622 ◽  
Author(s):  
K. H. Lee ◽  
M. H. Hong ◽  
K. Teker ◽  
C. Jacob ◽  
P. Pirouz
Keyword(s):  
Buffer Layer ◽  
Film Growth ◽  
Lattice Mismatch ◽  
Substrate Surface ◽  
Substrate Material ◽  
Cross Sectional ◽  
Pre Treatment ◽  
Film Substrate ◽  
Gan Film

ABSTRACTTogether with sapphire, SiC is the most common substrate material for GaN epitaxial growth. In fact, SiC has advantages over sapphire because of its better thermal conductivity and lower film substrate lattice mismatch (∼3.5%). However, nucleation of GaN on SiC is rather difficult because of the low surface energy of SiC and the sensitivity of substrate preparation. This latter point makes it essential to use a very careful cleaning step, and also to pre-treat the substrate surface by growing a thick buffer layer of AlN at a relatively high temperature. In this study, several pre-treatment steps of SiC for GaN deposition were tested including (a) nitration with NH3 for 0.5-20 minutes, (b) pre-adsorption of trimethyl gallium (TMG) or trimethyl aluminum (TMA) for 0.5-5 minutes, and (c) deposition of an AlN buffer layer at ∼1150°C. After each pre-treatment, GaN was deposited by MOCVD using dilute H2(Ar+12%H2), NH3 and TMG. All the films were characterized by XRD and cross-sectional TEM. After nitration of SiC, the deposited GaN film was found to be polycrystalline. In case of pre-adsorption of TMG, epitaxial but island-like GaN formed on the substrate. In the third case, with an ultra-thin (∼1.5nm) coverage of AlN on SiC (by pre-adsorption of TMA or by 50 seconds deposition of AlN), GaN epilayers were successfully deposited on SiC. However, when AlN was deposited for longer than 3 minutes (up to 10 minutes), only polycrystalline GaN was obtained. With this technique of covering the surface with an ultra-thin layer of AlN, epitaxial GaN has been successfully deposited on 6H-SiC (0001), on 4H-SiC(0001), and on 3C-SiC/Si(111) substrates. The effect of the different pre-treatments of SiC on the quality of the deposited GaN films will be discussed and compared, and the optimal conditions for GaN deposition for each substrate will be presented.

The atomic structure of growth interfaces in Y–Ba–Cu–O thin films

1991 ◽  
Vol 6 (11) ◽  
pp. 2264-2271 ◽  
Author(s):  
R. Ramesh ◽  
A. Inam ◽  
D.M. Hwang ◽  
T.S. Ravi ◽  
T. Sands ◽  
...  
Keyword(s):  
Thin Films ◽  
Atomic Structure ◽  
Film Growth ◽  
Substrate Surface ◽  
Oriented Growth ◽  
Surface Steps ◽  
Nucleation Sites ◽  
Oriented Films ◽  
Second Phases ◽  
Ledge Mechanism

We have examined the atomic structure of growth interfaces in thin films of Y–Ba–Cu–O grown on [001] perovskite or cubic substrates. At substrate heater temperatures in the range of 780–820 °C c-axis oriented growth is observed on these substrates. On SrTiO3, the first layer appears to be either a BaO or a CuO2 plane while on LaAlO3 the first layer appears to be a CuO chain layer. The mismatch on the a-b plane is accommodated by the formation of interface dislocations. Defects on the substrate surface propagate as defects in the film. These defects are primarily translational boundaries and in some cases second phases. At lower substrate heater temperatures, i.e., 650–700 °C, a, b-axis growth dominates. Defects and steps on the substrate surface are more detrimental in the growth of a, b-axis oriented films, since they tend to favor the nucleation of c-axis oriented domains. This is ascribed to the ledge mechanism of c-axis film growth, for which the surface steps are good nucleation sites.

Attempts to p-Dope Ultrananocrystalline Diamond Films in a Hot Filament Reactor

2006 ◽  
Vol 956 ◽  
Author(s):  
Paul William May ◽  
Matthew Hannaway
Keyword(s):  
Vapour Deposition ◽  
Film Growth ◽  
Substrate Surface ◽  
Diamond Films ◽  
Chemical Vapour ◽  
Grain Sizes ◽  
Ultrananocrystalline Diamond ◽  
The Individual ◽  
P Type ◽  
Hot Filament

ABSTRACTUltrananocrystalline diamond (UNCD) films have been deposited using hot filament chemical vapour deposition using Ar/CH4/H2 gas mixtures plus additions of B2H6 in an attempt to make p-type semiconducting films. With increasing additions of B2H6 from 0 to 40,000 ppm with respect to C, the film growth rate was found to decrease substantially, whilst the individual grain sizes increased from nm to μm. With 40,000 ppm of B2H6, crystals of boric oxide were found on the substrate surface, which slowly hydrolysed to boric acid on exposure to air. These results are rationalised using a model for UNCD growth based on competition for surface radical sites between CH3 and C atoms.

Growth and properties of epitaxial PbSe on Si(111) and Si(100) without buffer layer

1995 ◽  
Vol 379 ◽  
Author(s):  
P. Müller ◽  
A.N. Tiwari ◽  
H. Zogg
Keyword(s):  
Buffer Layer ◽  
Lattice Mismatch ◽  
Infrared Detector ◽  
Device Fabrication ◽  
Buffer Layers ◽  
Silicon Substrates ◽  
High Quality ◽  
Si Substrates ◽  
Large Lattice ◽  
Large Lattice Mismatch

Narrow gap IV-VI materials like PbS, PbSnSe and PbSnTe are used for infrared detector device fabrication [1,2]. Earlier an intermediate Ila-fluoride buffer layer, which consisted of a BaF2/CaF2-stack of about 2000 Å thickness, was used to get epitaxial high quality layers on silicon substrates. This buffer is now reduced to a much thinner layer of only about 20 Å thick CaF2, regardless the large lattice mismatch between layer and substrate [3,4,5]. The question therefore arises if high quality IV-VI layers can be grown on Si-substrates without any buffer layer as e.g. in CdTe/Si or GaAs/Si systems.The aim of this work is to grow IV-VI layers directly on Si-substrates without any buffer layers to study the growth kinetics and epitaxial quality. PbSe was chosen as a representant of IV-VI materials, and layers were grown on (111)- and (100)-oriented silicon substrates.

Growth of GaAs on Si and its Application to FETs and LEDs

1986 ◽  
Vol 67 ◽  
Author(s):  
Masahiro Akiyama ◽  
Yoshihiro Kawarada ◽  
Seiji Nishi ◽  
Takashi Ueda ◽  
Katsuzo Kaminishi
Keyword(s):  
Buffer Layer ◽  
Lattice Mismatch ◽  
Antiphase Domain ◽  
Thin Layers ◽  
The Other ◽  
Heteroepitaxial Growth ◽  
Si Substrates ◽  
Large Lattice ◽  
Strained Layer Superlattice ◽  
Large Lattice Mismatch

In recent years, the heteroepitaxial growth of GaAs layers on Si substrates has been gained an increasing interest [1 - 14]. GaAs is one of the most important III-V materials and has been well studied and used for optical and electrical devices. On the other hand, with Si we have large size wafers of superior quality and sophisticated technologies and Si is a main material for semiconductor industries. Therefore, GaAs/Si system has possibilities for realizing new types of functional devices or ICs with GaAs and Si devices. This system, however, has two serious problems. One is the large lattice mismatch of about 4 % between these materials and the other is the polar on nonpolar problem i.e., the formation of an antiphase domain disorder. It was reported that when (211)-oriented Si substrates were used, there was no problem of the formation of an antiphase domain structure 5. For growing materials on lattice mismatched substrates, it was reported that the thin layers deposited at low temperatures were effective to relax the lattice mismatches for the systems such as SiC on Si[15] and Si on saphire [16]. In GaAs/Si system, the Ge buffer layer has been used to relax the lattice mismatch[17 - 22] It was also reported that the composite strained layer superlattice with GaP/GaAsP and GaAsP/GaAs was very effective as a buffer layer[23 - 25].

scholarly journals Crystallinity Improvement of ZnO Thin Film on Different Buffer Layers Grown by MBE

2012 ◽  
Vol 2012 ◽  
pp. 1-7 ◽  
Author(s):  
Shao-Ying Ting ◽  
Po-Ju Chen ◽  
Hsiang-Chen Wang ◽  
Che-Hao Liao ◽  
Wen-Ming Chang ◽  
...  
Keyword(s):  
Thin Film ◽  
Buffer Layer ◽  
Film Growth ◽  
Lattice Mismatch ◽  
Deep Level ◽  
Thin Film Growth ◽  
Buffer Layers ◽  
Threading Dislocations ◽  
Zno Thin Film

The material and optical properties of ZnO thin film samples grown on different buffer layers on sapphire substrates through a two-step temperature variation growth by molecular beam epitaxy were investigated. The thin buffer layer between the ZnO layer and the sapphire substrate decreased the lattice mismatch to achieve higher quality ZnO thin film growth. A GaN buffer layer slightly increased the quality of the ZnO thin film, but the threading dislocations still stretched along thec-axis of the GaN layer. The use of MgO as the buffer layer decreased the surface roughness of the ZnO thin film by 58.8% due to the suppression of surface cracks through strain transfer of the sample. From deep level emission and rocking curve measurements it was found that the threading dislocations play a more important role than oxygen vacancies for high-quality ZnO thin film growth.

Structural and Electrical Properties of Y2O3 Buffer Layer Prepared by Two Step Process

2001 ◽  
Vol 666 ◽  
Author(s):  
Dong-Gun Lim ◽  
Bum-Sik Jang ◽  
Sang-Il Moon ◽  
Dong-Min Jang ◽  
Jinhee Heo ◽  
...  
Keyword(s):  
Substrate Temperature ◽  
Partial Pressure ◽  
Buffer Layer ◽  
Film Growth ◽  
Lattice Mismatch ◽  
Metal Layer ◽  
Buffer Layers ◽  
Step Process ◽  
Structural And Electrical Properties ◽  
Semiconductor Type

ABSTRACTIn this paper we investigated a feasibility of Y2O3 films as a buffer layer of MFIS (metal ferroelectric insulator semiconductor) type capacitor. Buffer layers were prepared by two-step process of a low temperature film growth and subsequent RTA treatment. Investigated parameters are given as substrate temperature, O2 partial pressure, post-annealing temperature, and suppression method of interfacial SiO2layer generation. By employing an ultra thin Y pre-metal layer, unwanted SiO2 layer generation was successfully suppressed at an interface between the buffer layer and Si substrate. By using two-step process, we improved the leakage current density of Y2O3 films by 2 orders and the Dit as low as 8.72×1010 cm−2eV−1. For a substrate temperature above 400°C and O2 partial pressure of 20%, we observed cubic Y2O3 phase domination in XRD spectra. We achieved 1.75% lattice mismatch between Y2O3 film and silicon substrate. Y2O3 buffer layer for a single transistor FRAM exhibited optimal properties when it was grown at 400°C with 20% O2 partial pressure then RTA treatment at 900°C in oxygen ambient.

In-Situ Study of NiO Growth on Textured Nickel Tape Using Environmental Scanning Electron Microscope (ESEM) and Hot Stage

2001 ◽  
Vol 7 (S2) ◽  
pp. 1276-1277
Author(s):  
Y. Akin ◽  
R.E. Goddard ◽  
W. Sigmund ◽  
Y.S. Hascicek
Keyword(s):  
Buffer Layer ◽  
Lattice Mismatch ◽  
Sol Gel ◽  
Surface Oxidation ◽  
Dip Coating ◽  
Buffer Layers ◽  
Superconducting Film ◽  
Environmental Scanning ◽  
Cold Rolling And Annealing

Deposition of highly textured ReBa2Cu3O7−δ (RBCO) films on metallic substrates requires a buffer layer to prevent chemical reactions, reduce lattice mismatch between metallic substrate and superconducting film layer, and to prevent diffusion of metal atoms into the superconductor film. Nickel tapes are bi-axially textured by cold rolling and annealing at appropriate temperature (RABiTS) for epitaxial growth of YBa2Cu3O7−δ (YBCO) films. As buffer layers, several oxide thin films and then YBCO were coated on bi-axially textured nickel tapes by dip coating sol-gel process. Biaxially oriented NiO on the cube-textured nickel tape by a process named Surface-Oxidation- Epitaxy (SEO) has been introduced as an alternative buffer layer. in this work we have studied in situ growth of nickel oxide by ESEM and hot stage.Representative cold rolled nickel tape (99.999%) was annealed in an electric furnace under 4% hydrogen-96% argon gas mixture at 1050°C to get bi-axially textured nickel tape.

scholarly journals MOCVD Grown HgCdTe Heterostructures for Medium Wave Infrared Detectors

Coatings ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 611
Author(s):  
Waldemar Gawron ◽  
Jan Sobieski ◽  
Tetiana Manyk ◽  
Małgorzata Kopytko ◽  
Paweł Madejczyk ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Infrared Detectors ◽  
Lattice Mismatch ◽  
Layer Growth ◽  
Ex Situ ◽  
Current Status ◽  
Organic Chemical ◽  
Infrared Band ◽  
Donor And Acceptor ◽  
Wide Range

This paper presents the current status of medium-wave infrared (MWIR) detectors at the Military University of Technology’s Institute of Applied Physics and VIGO System S.A. The metal–organic chemical vapor deposition (MOCVD) technique is a very convenient tool for the deposition of HgCdTe epilayers, with a wide range of compositions, used for uncooled infrared detectors. Good compositional and thickness uniformity was achieved on epilayers grown on 2-in-diameter, low-cost (100) GaAs wafers. Most growth was performed on substrates, which were misoriented from (100) by between 2° and 4° in order to minimize growth defects. The large lattice mismatch between GaAs and HgCdTe required the usage of a CdTe buffer layer. The CdTe (111) B buffer layer growth was enforced by suitable nucleation procedure, based on (100) GaAs substrate annealing in a Te-rich atmosphere prior to the buffer deposition. Secondary-ion mass spectrometry (SIMS) showed that ethyl iodide (EI) and tris(dimethylamino)arsenic (TDMAAs) were stable donor and acceptor dopants, respectively. Fully doped (111) HgCdTe heterostructures were grown in order to investigate the devices’ performance in the 3–5 µm infrared band. The uniqueness of the presented technology manifests in a lack of the necessity of time-consuming and troublesome ex situ annealing.

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