In-Situ Study of NiO Growth on Textured Nickel Tape Using Environmental Scanning Electron Microscope (ESEM) and Hot Stage

2001 ◽  
Vol 7 (S2) ◽  
pp. 1276-1277
Author(s):  
Y. Akin ◽  
R.E. Goddard ◽  
W. Sigmund ◽  
Y.S. Hascicek
Keyword(s):  
Buffer Layer ◽  
Lattice Mismatch ◽  
Sol Gel ◽  
Surface Oxidation ◽  
Dip Coating ◽  
Buffer Layers ◽  
Superconducting Film ◽  
Environmental Scanning ◽  
Cold Rolling And Annealing

Deposition of highly textured ReBa2Cu3O7−δ (RBCO) films on metallic substrates requires a buffer layer to prevent chemical reactions, reduce lattice mismatch between metallic substrate and superconducting film layer, and to prevent diffusion of metal atoms into the superconductor film. Nickel tapes are bi-axially textured by cold rolling and annealing at appropriate temperature (RABiTS) for epitaxial growth of YBa2Cu3O7−δ (YBCO) films. As buffer layers, several oxide thin films and then YBCO were coated on bi-axially textured nickel tapes by dip coating sol-gel process. Biaxially oriented NiO on the cube-textured nickel tape by a process named Surface-Oxidation- Epitaxy (SEO) has been introduced as an alternative buffer layer. in this work we have studied in situ growth of nickel oxide by ESEM and hot stage.Representative cold rolled nickel tape (99.999%) was annealed in an electric furnace under 4% hydrogen-96% argon gas mixture at 1050°C to get bi-axially textured nickel tape.

Chemical Solution Deposition of Lanthanum Zirconate Buffer Layers on Biaxially Textured Ni–1.7% Fe–3% W Alloy Substrates for Coated-conductor Fabrication

2002 ◽  
Vol 17 (6) ◽  
pp. 1543-1549 ◽  
Author(s):  
S. Sathyamurthy ◽  
M. Paranthaman ◽  
T. Aytug ◽  
B. W. Kang ◽  
P. M. Martin ◽  
...  
Keyword(s):  
Sol Gel ◽  
Rf Sputtering ◽  
Cube Texture ◽  
Dip Coating ◽  
Buffer Layers ◽  
Lanthanum Zirconate ◽  
Solution Deposition ◽  
Ybco Films ◽  
Current Densities ◽  
Gel Processing

Sol-gel processing of La2Zr2O7 (LZO) buffer layers on biaxially textured Ni–1.7% Fe–3% W alloy substrates using a continuous reel-to-reel dip-coating unit has been studied. The epitaxial LZO films obtained have a strong cube texture and uniform microstructure. The effects of increasing the annealing speed on the texture, microstructure, and carbon content retained in the film were studied. On top of the LZO films, epitaxial layers of yttria-stabilized zirconia and Ceria (CeO2) were deposited using rf sputtering, and YBa2Cu3Ox (YBCO) films were then deposited using pulsed laser deposition. Critical current densities (Jc) of 1.9 MA/cm2 at 77 K and self-field and 0.34 MA/cm2at 77 K and 0.5 T have been obtained on these films. These values are comparable to those obtained on YBCO films deposited on all-vacuum deposited buffer layers and the highest ever obtained using solution seed layers.

LiNiO2 Thin Films Fabricated by Diffusion of Li on Ni Tapes

2007 ◽  
Vol 336-338 ◽  
pp. 505-508
Author(s):  
Cheol Jin Kim ◽  
In Sup Ahn ◽  
Kwon Koo Cho ◽  
Sung Gap Lee ◽  
Jun Ki Chung
Keyword(s):  
Thin Films ◽  
Heat Treatment ◽  
Grain Size ◽  
Sol Gel ◽  
Surface Oxidation ◽  
Cold Isostatic Pressing ◽  
Tube Furnace ◽  
Treatment Conditions ◽  
Average Grain Size ◽  
Cold Rolling And Annealing

LiNiO2 thin films for the application of cathode of the rechargeable battery were fabricated by Li ion diffusion on the surface oxidized NiO layer. Bi-axially textured Ni-tapes with 50 ~ 80 μm thickness were fabricated using cold rolling and annealing of Ni-rod prepared by cold isostatic pressing of Ni powder. Surface oxidation of Ni-tapes were conducted using tube furnace or line-focused infrared heater at 700 °C for 150 sec in flowing oxygen atmosphere, resulted in NiO layer with thickness of 400 and 800 μm, respectively. After Li was deposited on the NiO layer by thermal evaporation, LiNiO2 was formed by Li diffusion through the NiO layer during subsequent heat treatment using IR heater with various heat treatment conditions. IR-heating resulted in the smoother surface and finer grain size of NiO and LiNiO2 layer compared to the tube-furnace heating. The average grain size of LiNiO2 layer was 0.5~1 μm, which is much smaller than that of sol-gel processed LiNiO2. The reacted LiNiO2 region showed homogeneous composition throughout the thickness and did not show any noticeable defects frequently found in the solid state reacted LiNiO2, but crack and delamination between the reacted LiNiO2 and Ni occurred as the reaction time increased above 4hrs.

Sn-based Group-IV Semiconductors on Si: New Infrared Materials and New Templates for Mismatched Epitaxy

2005 ◽  
Vol 891 ◽  
Author(s):  
John Tolle ◽  
Radek Roucka ◽  
Vijay D'Costa ◽  
Jose Menendez ◽  
Andrew Chizmeshya ◽  
...  
Keyword(s):  
Band Gap ◽  
Buffer Layer ◽  
Lattice Mismatch ◽  
Group Iv ◽  
Buffer Layers ◽  
Direct Band Gap ◽  
Group Iv Semiconductors ◽  
Direct Band ◽  
Infrared Materials ◽  
Edge Dislocations

ABSTRACTWe report growth and properties of GeSn and SiGeSn alloys on Si (100). These materials are prepared using a novel CVD approach based on reactions of Si-Ge hydrides and SnD4. High quality GeSn films with Sn contents up to 20%, and strain free microstructures have been obtained. The lattice mismatch between the films and Si is relieved by Lomer edge dislocations located at the interface. This material is of interest due to the predicted cross-over to a direct gap semiconductor for moderate Sn concentrations. We find that the direct band gap, and, consequently, the main absorption edge, shifts monotonically to lower energies as the Sn concentration is increased. The compositional dependence of the direct band gap shows a strong bowing, such that the direct band gap is reduced to 0.4 eV (from 0.8 eV for pure Ge) for a concentration of 14% Sn. The ternary SiGeSn alloy has been grown for the first time on GeSn buffer layers. This material opens up entirely new opportunities for strain and band gap engineering using group-IV materials via decoupling of strain and composition. Our SiGeSn layers have lattice constants above and below that of pure Ge, and depending on the thickness and composition of the underlying buffer layer they can be grown relaxed, with compressive, or with tensile strain. In addition to acting as a buffer layer for the growth of SiGeSn, we have found that GeSn can act as a template for the subsequent growth of a variety of materials, including III-V semiconductors.

Microstructures of AlN Buffer Layers for the Growth of GaN on (0001) Al2O3

1996 ◽  
Vol 449 ◽  
Author(s):  
M. Yeadon ◽  
W. Kim ◽  
A. E. Botchkarev ◽  
S. N. Mohammad ◽  
H. Morkoc ◽  
...  
Keyword(s):  
Lattice Mismatch ◽  
Wide Band ◽  
Buffer Layers ◽  
Initial Growth ◽  
Nitridation Time ◽  
Transmission Electron ◽  
Different Temperatures ◽  
Aln Buffer ◽  
Nitride Layers

ABSTRACTIll-nitride semiconductors are emerging as highly promising candidates for the fabrication of wide band-gap electronic and opto-electronic devices. Sapphire ((α-A12O3) is currently one of the primary substrates of choice for the growth of GaN despite a large lattice mismatch. Significant improvements in the quality of III-nitride layers have been demonstrated by exposure of the substrate to reactive nitrogen species followed by deposition of a low temperature AIN or GaN buffer layer. In this paper we present a study of the evolution of the surface topography and defect microstructure of nitrided α-A12O3 substrates and AIN buffer layers deposited by reactive molecular beam epitaxy (RMBE). Their influence on the morphology and properties of GaN layers is also discussed. Both nitridation time and AIN deposit thickness were varied systematically, at different temperatures and buffer growth rates. The microstructures were characterized using the atomic force microscope (AFM) and transmission electron microscope (TEM). Initial growth studies are ideally suited to in-situ experiments, and further investigations are also in progress using a unique UHV TEM with the facility for in-situ RMBE.

Preparation of PbZrxTi1−xO3 Films on Si Substrates Using SrTiO3 Buffer Layers

1994 ◽  
Vol 361 ◽  
Author(s):  
Eisuke Tokumitsu ◽  
Kensuke Itani ◽  
Bum-Ki Moon ◽  
Hiroshi Ishiwara
Keyword(s):  
Buffer Layer ◽  
Secondary Ion Mass Spectrometry ◽  
Sol Gel ◽  
Buffer Layers ◽  
Si Substrates ◽  
Pzt Film ◽  
Pzt Films ◽  
Evaporation Technique ◽  
Gel Technique ◽  
Secondary Ion

ABSTRACTWe report the preparation of PbZrxTi1−xO3 (PZT) films on Si substrates with a SrTiO3 (STO) buffer layer. STO buffer layers and PZT films were formed on Si substrates by the electron-beam assisted vacuum evaporation technique and sol-gel technique, respectively. By evaporating a thin (8nm) metal Sr layer prior to the STO deposition, which deoxidizes the SiO2 layer at the Si surface, (100)- and (111)-oriented STO thin films can be grown on Si(100) and (111) substrates, respectively. It is shown that a strongly (100)-oriented PZT film is grown on STO(100)/Si(100), whereas a strongly (111)-oriented PZT film is obtained on STO(111)/Si(111). It is also found that the STO buffer layer remains intact even after the PZT deposition. Secondary ion mass spectrometry (SIMS) analysis showed that the STO barrier layer was effective in preventing diffusion of Pb into the Si substrate.

Microstructure and texture evolution of CeO2 buffer layers prepared via dip-coating sol–gel method on IBAD-YSZ/Hastelloy substrates

2007 ◽  
Vol 463-465 ◽  
pp. 580-583 ◽  
Author(s):  
P. Du ◽  
S.S. Wang ◽  
H. Chen ◽  
Z. Wang ◽  
J.C. Sun ◽  
...  
Keyword(s):  
Texture Evolution ◽  
Sol Gel ◽  
Dip Coating ◽  
Buffer Layers ◽  
Gel Method ◽  
Sol Gel Method

Fabrication of High Jc YBa2Cu3O7-δ Coated Conductors Using Sol-Gel Buffer Layers On Nickel and Nickel Alloy Substrates

2001 ◽  
Vol 689 ◽  
Author(s):  
S. Sathyamurthy ◽  
M. Paranthaman ◽  
B. W. Kang ◽  
H. Y. Zhai ◽  
T. Aytug ◽  
...  
Keyword(s):  
Critical Current Density ◽  
Critical Current ◽  
Current Density ◽  
Sol Gel ◽  
Rf Sputtering ◽  
Cube Texture ◽  
Dip Coating ◽  
Coated Conductors ◽  
Buffer Layers ◽  
Ybco Films

Sol-gel processing of La2Zr2O7 (LZO) buffer layers on biaxially textured Ni-3 at.% W alloy substrates using a continuous reel-to-reel dip-coating unit has been studied. The epitaxial LZO films obtained have a strong cube texture and uniform microstructure. The effect of increasing the annealing speed on the texture, microstructure and the carbon content retained in the film were studied. On top of the LZO films, epitaxial layers of Yttria Stabilized Zirconia (YSZ) and Ceria (CeO2) were deposited using rf sputtering, and YBa2Cu3Ox (YBCO) films were then deposited using Pulsed Laser Deposition (PLD). A critical current density (Jc) of 1.9 MA/cm2 at 77K and self-field and 0.34 MA/cm2 at 77K and 0.5T have been obtained on these films. These values are comparable to those obtained on YBCO films deposited on all-vacuum deposited buffer layers, and are the highest ever obtained using solution seed layers. The use of all-solution buffers for coated conductor processing has also been explored. A critical current density of 1.1 MA/cm2 at 77 K and self-field was obtained on YBCO films grown be PLD on LZO buffered nickel substrates.

Dependence of the Residual Strain in GaN on the AlN Buffer Layer Annealing Parameters

1997 ◽  
Vol 468 ◽  
Author(s):  
Y.-M. Le Vaillant ◽  
S. Ciur ◽  
A. Andenet ◽  
O. Briot ◽  
B. Gil ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Annealing Time ◽  
Residual Strain ◽  
Lattice Mismatch ◽  
Strain Relaxation ◽  
Amorphous State ◽  
Lattice Parameter ◽  
Optical Quality ◽  
Buffer Layers ◽  
Aln Buffer

ABSTRACTThe problem of residual strain in GaN epilayers is currently the attention of many studies, since it affects the optical and electrical properties of the epilayers. In order to discuss the origin of this residual strain, we have grown a series of GaN epilayers onto AlN buffer layers, sapphire (0001) being used as substrate. The buffer layer is usually deposited in an amorphous state and is recrystallized by a thermal annealing. Here we have made a systematic study of the buffer recrystallization by changing the annealing temperature and the annealing time. The surface morphology is probed using Atomic Force Microscopy (AFM). The lattice parameter c is carried out from accurate x-ray diffraction measurements. The GaN layers were studied by low temperature photoluminescence and reflectivity. The amount of residual strain is calibrated from the position of the A exciton and the optical quality of the layers is assessed from the photoluminescence linewidths. The longer the annealing time the better the strain relaxation in AlN buffer layers and the higher the lattice mismatch with GaN overlayers.

Growth and properties of epitaxial PbSe on Si(111) and Si(100) without buffer layer

1995 ◽  
Vol 379 ◽  
Author(s):  
P. Müller ◽  
A.N. Tiwari ◽  
H. Zogg
Keyword(s):  
Buffer Layer ◽  
Lattice Mismatch ◽  
Infrared Detector ◽  
Device Fabrication ◽  
Buffer Layers ◽  
Silicon Substrates ◽  
High Quality ◽  
Si Substrates ◽  
Large Lattice ◽  
Large Lattice Mismatch

Narrow gap IV-VI materials like PbS, PbSnSe and PbSnTe are used for infrared detector device fabrication [1,2]. Earlier an intermediate Ila-fluoride buffer layer, which consisted of a BaF2/CaF2-stack of about 2000 Å thickness, was used to get epitaxial high quality layers on silicon substrates. This buffer is now reduced to a much thinner layer of only about 20 Å thick CaF2, regardless the large lattice mismatch between layer and substrate [3,4,5]. The question therefore arises if high quality IV-VI layers can be grown on Si-substrates without any buffer layer as e.g. in CdTe/Si or GaAs/Si systems.The aim of this work is to grow IV-VI layers directly on Si-substrates without any buffer layers to study the growth kinetics and epitaxial quality. PbSe was chosen as a representant of IV-VI materials, and layers were grown on (111)- and (100)-oriented silicon substrates.

Fabrication and Properties of Epitaxial Buffer Layers on Nonmagnetic Textured Ni Based Alloy Substrates

1999 ◽  
Vol 13 (09n10) ◽  
pp. 1029-1034 ◽  
Author(s):  
G. Celentano ◽  
V. Boffa ◽  
L. Ciontea ◽  
F. Fabbri ◽  
V. Galluzzi ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Ybco Film ◽  
Lattice Mismatch ◽  
Substrate Surface ◽  
Liquid Nitrogen Temperature ◽  
Metallic Substrate ◽  
Buffer Layers ◽  
X Ray Diffraction ◽  
Metallic Substrates ◽  
Layer Deposition

Biaxially aligned YBCO thick films on oxide buffered metallic substrates is a promising route toward the fabrication of superconducting tapes operating at liquid nitrogen temperature. The role of buffer layer is to reduce the lattice mismatch between the substrate and the YBCO film, to adapt the thermal expansion coefficient, to hamper the diffusion of Ni in YBCO film and to prevent the oxidation of the metallic substrate surface. This paper presents a study regarding CeO 2 buffer layer deposition on a new nonmagnetic (001)[100] textured Ni-V alloy substrates. The deposition of CeO 2 was performed by both pulsed laser ablation and e-beam evaporation techniques. The θ-2θ X-ray diffraction pattern mainly exhibits the (00l) peaks of CeO 2, indicating that the films are epitaxially grown with the c axis perpendicular to the substrate. Rocking curved through the CeO 2 (002) peak have a FWHM of about 6°. The SEM studies have shown that the surface is smooth, continuos and free of cracks. Texture analysis reveals a good in-plane orientation for the ablated CeO 2 film, whereas the electron beam evaporated CeO 2 shows two textures in the growth plane. Further efforts are focused on the deposition of YBCO thick film on the as buffered nonmagnetic metallic substrate.

Sign in / Sign up

Export Citation Format

Share Document