Epitaxial Growth of Thick Ag/Si(111) Films

1987 ◽  
Vol 102 ◽  
Author(s):  
K.-H. Park ◽  
H.-S. Jin ◽  
L. Luo ◽  
W.M. Gibson ◽  
G.-C. Wang ◽  
...  

ABSTRACT600∼4000Å thick Ag films grown on 3∼4· misoriented Si(111) substrates by molecular beam epitaxy (MBE) technique have been studied by using x-ray pole-figure analysis and MeV He+ Rutherford Backscattering Spectrometry (RBS)/channeling technique. X-ray pole-figure measurements revealed that despite the large lattice mismatch (∼25%) between Ag and Si, Ag films with epitaxial relationship Ag(111)//Si(111):Ag[011]//Si[011] were grown with a small quantity (15∼20%) of twin structure. The <111> axial channeling minimum yield (Xmin) is reduced at the Ag surface as the Ag film thickness increases. These films were thermally stable up to 500°C annealing but the twinning disappeared after annealing

1992 ◽  
Vol 285 ◽  
Author(s):  
Rina Chowdhury ◽  
X. Chen ◽  
K. Jagannadham ◽  
J. Narayan

ABSTRACTWe have successfully deposited multilayer Si/ITiN/Si(100) epitaxial heterostructures at a substrate temperature of 600°C in a chamber maintained at a vacuum of ∼10−7 torr using pulsed laser (KrF: λ = 248 nm, τ = 25 ns) deposition. This silicon-on-conductor device configuration has potential applications in three-dimensional integrated circuits and radiation hard devices.The two interfaces were quite sharp without any indication of interfacial reaction between them. The epitaxial relationship was found to be <100> Si II<100> TiN II<100> Si. In the plane, four unit cells of TiN matched with three unit cells of silicon with less than 4.0% misfit. This domain matching epitaxy provides the mechanism of epitaxial growth in systems with large lattice mismatch. Energetics and growth characteristics of such domain matching epitaxy in the high lattice mismatch Si/TiN/Si(100) system and possible device implications are discussed.


1992 ◽  
Vol 280 ◽  
Author(s):  
Tsvetanka S. Zheleva ◽  
K. Jagannadham ◽  
J. Narayan

ABSTRACTThe characteristics of epitaxial growth in large lattice mismatch TiN/Si and TiN/GaAs systems are analyzed. The epitaxial growth in these large mismatch systems is modelled in terms of various energy contributions to the epilayer. The new mode of growth, defined as domain epitaxial growth in these high mismatch systems is maintained by the formation of misfit dislocations at repeated intervals. The epitaxial relationship within the domain consists of n interplanar distances of the overlayer film closely matching with m interplanar distances of the substrate, where m and n are integers. The interfacial energy is found to be a very important term in determining the orientation relationships. The results of the model calculations are compared with the experimental observations.


1990 ◽  
Vol 209 ◽  
Author(s):  
D.C. McKenna ◽  
G.-C. Wang ◽  
K. Rajan

ABSTRACTThe interfacial structure of a large lattice mismatched (˜25%) (111) Ag-Si system was studied by using transmission electron diffraction (SADP - Selected Area Diffraction Pattern). The epitaxial films of Ag (600–1200Å) were grown by MBE on flat Si(111) and misoriented Si(1ll) surfaces. We have examined the interfacial structures of the Ag on 2° misoriented Si(111) using diffraction patterns of cross sectional view. Through a detail analysis of thelocation and shape of the diffraction spots, we can determine the epitaxial relationship between Ag and Si, the small tilt angle of Ag(111) planes withrespect to the misoriented Si(111), the period of the finite terrace size of the misoriented Si substrate, and the size of the ordered region in the Ag film. The O-lattice analysis developed by Bollmann has beenapplied to this interface andthe result is compared with the SADP observation.


1998 ◽  
Vol 535 ◽  
Author(s):  
V. Gopal ◽  
E.-H. Chen ◽  
E. P. Kvam ◽  
J. M. Woodall

AbstractWe have investigated the direct growth of narrow-gap InAs on wide-gap GaP by Molecular Beam Epitaxy. InAs and GaP have the largest mismatch among all the III-arsenides and the III-phosphides – 11%. A perfect epitaxial relationship is maintained between the InAs and the GaP despite the large lattice mismatch. Moreover, a reproducible defect structure with unique electronic properties is developed at the heterointerface. A point defect associated with the intersection of 90° misfit dislocations may act as an ordered, structural dopant. This dopant is fully ionized with a constant, high sheet carrier density of 1013 cm−2, independent of InAs layer thickness, and exhibits no freeze out even at 5 K. Device applications for such a system include temperature insensitive Hall sensors. We have also demonstrated high electron mobilities (over 10000 cm2/V-sec) in nominally undoped thick InAs layers grown on GaP. The explanation of this effect is presented to emphasize the exciting possibilities of band gap engineering in this system.


1990 ◽  
Vol 201 ◽  
Author(s):  
H.-S. Jin ◽  
L. You ◽  
T.-M. Lu

AbstractAg films deposited on Si(111) substrates by partially ionized beam (PIB) under conventional vacuum conditions were studied by MeV ion channeling techniques. In spite of their large lattice mismatch (24.8%), Ag films were still found to be epitaxial. With a deposition temperature of 350°C and without post-annealing, the Xmin value at the surface of a 2550 A° thick Ag film was found to be 10%. The azimuthal angular scan and the measured axial channeling dip showed that the Ag film was (111) oriented. The lattice quality of the films was comaparable to that deposited by MBE techniques. Dislocations were found in the PIB deposited Ag films. Lattice damage due to the bombardment of energetic ions was also observed. The thickness of the Ag film was found to have a pronounced effect on the crystalline quality at the surface. With the thickness increasing from 1240 A° to 2550 A°, the lattice quality at the Ag surface improved significantly, but not much change in the defect density in the Ag films was obseved.


2014 ◽  
Vol 67 (6) ◽  
pp. 844
Author(s):  
Huichao Zhang ◽  
Yonghong Ye ◽  
Boping Yang ◽  
Li Shen ◽  
Yiping Cui ◽  
...  

When a ZnS shell is coated onto a CdSe core, some non-radiative defects are formed with the relaxation of the strain induced by the large lattice mismatch between CdSe and ZnS even though there are Zn0.5Cd0.5Se or ZnSe buffer layers, as indicated by the decrease of photoluminescent (PL) quantum yield and the reverse evolution of temperature-dependent time-resolved PL decay. X-Ray photoelectron spectroscopy analysis reveals that these defects are induced by the formation of an interfacial alloy during the epitaxy process. These defects could be significantly suppressed if the ZnxCd1–xSeyS1–y alloy buffer layer is artificially introduced.


2005 ◽  
Vol 20 (5) ◽  
pp. 1250-1256 ◽  
Author(s):  
Joshua R. Williams ◽  
Chongmin Wang ◽  
Scott A. Chambers

We grew epitaxial α–Fe2O3(1010) on TiO2(001) rutile by oxygen plasma-assisted molecular-beam epitaxy. High-resolution transmission electron microscopy (HRTEM), reflection high-energy electron diffraction (RHEED), and x-ray diffraction pole figures confirm that the film is composed of four different in-plane orientations rotated by 90° relative to one another. For a given Fe2O3 unit cell, the lattice mismatch along the parallel [0001]Fe2O3 and [100]TiO2 directions is nominally +67%. However, due to a 3-fold repetition of the slightly distorted square symmetry of anion positions within the Fe2O3 unit cell, there is a coincidental anion alignment along the [0001]Fe2O3 and [100]TiO2 directions, which results in an effective lattice mismatch of only −0.02% along this direction. The lattice mismatch is nearly 10% in the orthogonal [1120]Fe2O3 and [100]TiO2 directions. The film is highly ordered and well registered to the substrate despite a large lattice mismatch in one direction. The film grows in registry with the substrate along the parallel [0001]Fe2O3 and [100]TiO2 directions and nucleates dislocations along the orthogonal [1120]Fe2O3 [100]TiO2 directions.


2021 ◽  
Author(s):  
Mingming Jiang ◽  
Yang Liu ◽  
Ruiming Dai ◽  
Kai Tang ◽  
Peng Wan ◽  
...  

Suffering from the indirect band gap, low carrier mobility, and large lattice mismatch with other semiconductor materials, one of the current challenges in Si-based materials and structures is to prepare...


2001 ◽  
Vol 696 ◽  
Author(s):  
Gu Hyun Kim ◽  
Jung Bum Choi ◽  
Joo In Lee ◽  
Se-Kyung Kang ◽  
Seung Il Ban ◽  
...  

AbstractWe have studied infrared photoluminescence (PL) and x-ray diffraction (XRD) of 400 nm and 1500 nm thick InAs epilayers on GaAs, and 4 nm thick InAs on graded InGaAs layer with total thickness of 300 nm grown by molecular beam epitaxy. The PL peak positions of 400 nm, 1500 nm and 4 nm InAs epilayer measured at 10 K are blue-shifted from that of InAs bulk by 6.5, 4.5, and 6 meV, respectively, which can be largely explained by the residual strain in the epilayer. The residual strain caused by the lattice mismatch between InAs and GaAs or graded InGaAs/GaAs was observed from XRD measurements. While the PL peak position of 400 nm thick InAs layer is linearly shifted toward higher energy with increase in excitation intensity ranging from 10 to 140 mW, those of 4 nm InAs epilayer on InGaAs and 1500 nm InAs layer on GaAs is gradually blue-shifted and then, saturated above a power of 75 mW. These results suggest that adopting a graded InGaAs layer between InAs and GaAs can efficiently reduce the strain due to lattice mismatch in the structure of InAs/GaAs.


2004 ◽  
Vol 19 (4) ◽  
pp. 347-351
Author(s):  
J. Xu ◽  
X. S. Wu ◽  
B. Qian ◽  
J. F. Feng ◽  
S. S. Jiang ◽  
...  

Ge–Si inverted huts, which formed at the Si∕Ge interface of Si∕Ge superlattice grown at low temperatures, have been measured by X-ray diffraction, grazing incidence X-ray specular and off-specular reflectivities, and transmission electron microscopy (TEM). The surface of the Si∕Ge superlattice is smooth, and there are no Ge–Si huts appearing on the surface. The roughness of the surfaces is less than 3 Å. Large lattice strain induced by lattice mismatch between Si and Ge is found to be relaxed because of the intermixing of Ge and Si at the Si∕Ge interface.


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