Early Failure Sites and Electromigration

1994 ◽  
Vol 338 ◽  
Author(s):  
George O. Ramseyer ◽  
Joseph V. Beasock ◽  
Thomas E. Renz ◽  
Lois H. Walsh
Keyword(s):  
Electron Spectroscopy ◽  
Auger Electron ◽  
Time To Failure ◽  
Early Failure ◽  
Force Microscopy ◽  
Atomic Force ◽  
Late Failure ◽  
Early Failures ◽  
Mean Time ◽  
Backscattered Scanning Electron Microscopy

ABSTRACTBy definition, half of all interconnects fail before the measured mean time to failure (t50) is reached. To predict early failures the basic reactions occurring in the metallization and its environment must be understood. To this end, fatal interconnect failure sites were characterized by Auger electron spectroscopy, atomic force microscopy and backscattered scanning electron microscopy. CVD silicon dioxide passivation layer/fatal void interfaces of typical early failure voids were characterized and compared to a typical late failure void interface. The topographies of these fatal voids were also quantitatively compared to increase our understanding of early failure sites and electromigration.

Copper Diffusion Into Aluminum-Silicon Metallizations by Accelerated Thermal and Electrical Stressing

1996 ◽  
Vol 428 ◽  
Author(s):  
G. O. Ramseyer ◽  
L. H. Walsh ◽  
J. V. Beasock ◽  
H. F. Helbig ◽  
R. C. Lacoe ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Atomic Force Microscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Depth Profiling ◽  
Copper Diffusion ◽  
Force Microscopy ◽  
Atomic Force ◽  
Line Widths ◽  
Electromigration Lifetime

AbstractPatterned 930 nm Al(1%-Si) interconnects over 147 nm of Cu were electromigration lifetime tested at 1.0–1.5 × 105 A/cm2 at 250 °C. The morphology of the surfaces of the electromigrated stripes with different line widths and times to failure were characterized by atomic force microscopy, and changes in surface roughness were compared. The diffusion of copper into the electromigrated aluminum stripes was determined by depth profiling using Auger electron spectroscopy. In particular, areas where hillocks formed were examined and compared to areas of median roughness.

scholarly journals Формирование упорядоченных кремниевых структур на поверхности графита

2019 ◽  
Vol 61 (8) ◽  
pp. 1532
Author(s):  
А.А. Ревегук ◽  
А.Е. Петухов ◽  
А.А. Вишнякова ◽  
А.В. Королева ◽  
Д.А. Пудиков ◽  
...  
Keyword(s):  
Atomic Force Microscopy ◽  
Electronic Structure ◽  
Surface Morphology ◽  
Auger Electron Spectroscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Force Microscopy ◽  
Final Structure ◽  
Atomic Force ◽  
Silicon Structures

The work investigated the formation possibility of ordered silicon structures, including silicene, on the graphite substrates surface. The various conditions influence on the silicon atoms deposition on the final structure was also studied. Surface morphology information was obtained by atomic force microscopy, and the electronic structure was measured by Auger electron spectroscopy.

Dewetting of Polymer Bilayers: Morphology and Kinetics

1994 ◽  
Vol 366 ◽  
Author(s):  
Alessandro Faldi ◽  
Karen I. Winey ◽  
Russell J. Composto
Keyword(s):  
Atomic Force Microscopy ◽  
Electron Spectroscopy ◽  
Auger Electron ◽  
Weight Percent ◽  
Force Microscopy ◽  
Atomic Force ◽  
Polymer Bilayers ◽  
Hole Profile ◽  
Interfacial Thermodynamics ◽  
Kinetics Of

ABSTRACTThe kinetics of de-wetting a polycarbonate (PC) film from a poly(styrene-coacrylonitrile) (SAN) copolymer film was monitored using optical microscopy. Whereas the SAN layer was stable upon annealing at 190°C, the PC layer dewetted the SAN and formed holes whose diameter increased linearly with time. Auger electron spectroscopy measurements confirmed that PC was fully removed from the interior of the hole. Upon varying the AN content, the dewetting velocity was found to be a minimum near 0.27 weight percent AN. This result is consistent with the interfacial thermodynamics between PC and SAN. Atomic force microscopy was used to provide a unique image of the hole profile.

Non-Vacuum Deposition of Buffer Layer for YBCO Superconductor Oxide Films

2005 ◽  
Vol 868 ◽  
Author(s):  
Raghu Bhattacharya ◽  
Sovannary Phok ◽  
Priscila Spagnol ◽  
Tapas Chaudhuri
Keyword(s):  
Electron Spectroscopy ◽  
Auger Electron ◽  
Ybco Superconductor ◽  
Vacuum Deposition ◽  
X Ray Diffraction ◽  
X Ray ◽  
Force Microscopy ◽  
Atomic Force ◽  
Pole Figures ◽  
Better Than

AbstractNonvacuum electrodeposition was used to prepare biaxially textured CeO2 and Sm-doped CeO2 coatings on Ni-W substrates. The samples were characterized by X-ray diffraction (including Θ/2Θ, pole figures, omega scans, and phi scans), atomic force microscopy, and Auger electron spectroscopy (AES). Pole-figure scans show that electrodeposited CeO2 and Sm-doped CeO2 on textured Ni-W (3 at.%) is cube textured. Full-width at half-maximum values of thew scan andf scan of the electrodeposited layers were better than those of the Ni-W base substrates, indicating improved biaxial texturing of the electrodeposited layers. AES analysis of the YBCO/CeO2/YSZ/ED-CeO2/Ni-W revealed that Ni interdiffusion was completely stopped at the first electrodeposited CeO2 layer.

Effectiveness and Reliability of Metal Diffusion Barriers for Copper Interconnects

1995 ◽  
Vol 403 ◽  
Author(s):  
G. Bai ◽  
S. Wittenbrock ◽  
V. Ochoa ◽  
R. Villasol ◽  
C. Chiang ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Chemical Vapor ◽  
Diffusion Barriers ◽  
Copper Interconnects ◽  
Time To Failure ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron

AbstractCu has two advantages over Al for sub-quarter micron interconnect application: (1) higher conductivity and (2) improved electromigration reliability. However, Cu diffuses quickly in SiO2and Si, and must be encapsulated. Polycrystalline films of Physical Vapor Deposition (PVD) Ta, W, Mo, TiN, and Metal-Organo Chemical Vapor Deposition (MOCVD) TiN and Ti-Si-N have been evaluated as Cu diffusion barriers using electrically biased-thermal-stressing tests. Barrier effectiveness of these thin films were correlated with their physical properties from Atomic Force Microscopy (AFM), Transmission Electron Microscopy (TEM), Secondary Electron Microscopy (SEM), and Auger Electron Spectroscopy (AES) analysis. The barrier failure is dominated by “micro-defects” in the barrier film that serve as easy pathways for Cu diffusion. An ideal barrier system should be free of such micro-defects (e.g., amorphous Ti-Si-N and annealed Ta). The median-time-to-failure (MTTF) of a Ta barrier (30 nm) has been measured at different bias electrical fields and stressing temperatures, and the extrapolated MTTF of such a barrier is > 100 year at an operating condition of 200C and 0.1 MV/cm.

A Novel Cell Co-Culture Method Utilizing Thermo-Responsive Surface

2007 ◽  
Vol 342-343 ◽  
pp. 221-224
Author(s):  
Jin Suk Bae ◽  
Ga Young Jun ◽  
Akihiko Kikuchi ◽  
Teruo Okano ◽  
Chang Hyun Ahn ◽  
...  
Keyword(s):  
Contact Angle ◽  
Electron Spectroscopy ◽  
Electron Beam Irradiation ◽  
Culture Method ◽  
Total Reflection ◽  
Attenuated Total Reflection ◽  
Beam Irradiation ◽  
Cover Glass ◽  
Force Microscopy ◽  
Atomic Force

In this work, we developed a novel patterned co-culture method with thermo-responsive poly(N-isopropylacrylamide) (PIPAAm) and poly(N-ρ-vinylbenzyl-Ο-β-D-galactopyranosyl-(1→ 4)-D-gluconamide) (PVLA) inducing active hepatocyte attachment. Patterned graft of PIPAAm onto PS dishes was carried out by electron beam irradiation using cover-glass as a photomask. PVLA was only coated onto PIPAAm-ungrafted domain because of hydrated hydrophilic property of PIPAAm at below the LCST. Analysis by attenuated total reflection-Fourier transform infrared and electron spectroscopy for chemical analysis revealed that PIPAAm and PVLA were successfully grafted and coated on surfaces of PS dishes. PIPAAm-grafted surface exhibited decreasing contact angle by changing temperature from 37 to 20°C, while PVLA-coated PS and non-treated PS had negligible contact angle changes with temperature alternation. Atomic force microscopy (AFM) results showed that PIPAAm-grafted and PVLA-coated PS had smoother surfaces than that of ungrafted PS dishes. After culture for 12 hours, hepatocytes were well attached on PVLA-coated domain. Hepatocytes adherent on PIPAAm-grafted domain were detached by decreasing temperature. And then, fibroblasts were seeded onto PIPAAm pattern-grafted domain. Fibroblasts were only attached and spread onto PIPAAm-grafted domain. Co-cultured hepatocytes showed better differentiated function of albumin expression compared to homotypic hepatocyte culture

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