Tem Investigation of Al0.5Ga0.5As1-y Sby Buffer Layer Systems

1997 ◽  
Vol 484 ◽  
Author(s):  
E. Chen ◽  
J. S. Ahearn ◽  
K. Nichols ◽  
P. Uppal ◽  
D. C. Paine
Keyword(s):  
Buffer Layer ◽  
Active Regions ◽  
Dark Field ◽  
Layer Growth ◽  
Buffer Layers ◽  
Growth Surface ◽  
Threading Dislocation ◽  
Misfit Dislocations ◽  
Plan View ◽  
Dark Field Imaging

AbstractWe report on a TEM study of Sb-adjusted quaternary Al0.5Ga0.5As1-y Sby buffer-layers grown on <001> GaAs substrates. A series of structures were grown by MBE at 470°C that utilize a multilayer grading scheme in which the Sb content of Al0.5Ga0.5As1-ySby is successively increased in a series of eight 125 nm thick layers. Post growth analysis using conventional bright field and weak beam dark field imaging of these buffer layers in cross-section reveals that the interface misfit dislocations are primarily of the 60° type and are distributed through out the interfaces of the buffer layer. Plan view studies show that the threading dislocation density in the active regions of the structure (approximately 2 μm from the GaAs substrate) is 105–6/cm2 which is comparable to equivalent InxGa1−x As buffers. Weak Sb-As compositional modulations with a period of 1.8 nm were observed that provide a marker for establishing the planarity of the growth process. These features reveal that the growth surface remains planar through out the buffer layer growth sequence.

Crystal Defects In Gan On (0001) Sapphire

1997 ◽  
Vol 482 ◽  
Author(s):  
Matthew T. Johnson ◽  
Zhigang Mao ◽  
C. Barry Carter
Keyword(s):  
Dark Field ◽  
Crystal Defects ◽  
Growth Surface ◽  
Threading Dislocation ◽  
Defect Structures ◽  
Plan View ◽  
Planar Defects ◽  
Dark Field Imaging ◽  
Inversion Domain ◽  
Different Types

AbstractDefect structures in GaN thin films grown on (0001) sapphire have been studied using a combination of different transmission electron microscopy (TEM) techniques. Two fundamentally different types of defects are found in these films. Planar defects which lie on planes perpendicular to the growth surface are common. In some regions of the films, other planar defects are present which run parallel to the surface of the substrate. The terminology used to describe these different defects varies quite widely in the literature and includes combinations of antiphase (inversion) domain boundaries and stacking faults. The second type of defect is generally referred to as a threading dislocation since many thread through the whole thickness of the film. Dislocations with different Burgers vectors have been identified in this work and in previous studies; these dislocations usually have a component of their Burgers vector lying normal to the (0001) plane. The overall defect structures in these films have been characterized using conventional bright-field and dark-field imaging. The detailed structure of the individual defects have been examined using weak-beam microscopy both in plan view and in cross section. This paper illustrates the different types of defects, both planar and linear, compares them to defects which have been characterized more thoroughly in related materials, and discuss the nomenclature of the different defect configurations.

Epitaxial GaN Layer Growth Using Nitrogen Enriched TiN Buffer Layers

2006 ◽  
Vol 916 ◽  
Author(s):  
Kazuhiro Ito ◽  
Yu Uchida ◽  
Sang-jin Lee ◽  
Susumu Tsukimoto ◽  
Yuhei Ikemoto ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Light Emission ◽  
Chemical Vapor ◽  
Nucleation Site ◽  
Layer Growth ◽  
Buffer Layers ◽  
Organic Chemical ◽  
Nitrogen Enrichment ◽  
Threading Dislocation ◽  
Sapphire Substrates

AbstractAbout 20 years ago, the discovery of an AlN buffer layer lead to the breakthrough in epitaxial growth of GaN layers with mirror-like surface, using a metal organic chemical vapor deposition (MOCVD) technique on sapphire substrates. Since then, extensive efforts have been continued to develop a conductive buffer layer/substrate for MOCVD-grown GaN layers to improve light emission of GaN light-emitting diodes. In the present study, we produced MOCVD-grown, continuous, flat epitaxial GaN layers on nitrogen enriched TiN buffer layers with the upper limit of the nitrogen content of TiN deposited at room temperature (RT) on sapphire substrates. It was concluded that the nitrogen enrichment would reduce significantly the TiN/GaN interfacial energy. The RT deposition of the TiN buffer layers suppresses their grain growth during the nitrogen enrichment and the grain size refining must increase nucleation site of GaN. In addition, threading dislocation density in the GaN layers grown on TiN was much lower than that in the GaN layers grown on AlN.

Equilibrium Lattice Relaxation and Misfit Dislocations in Continuously- and Step-Graded InxGa1-xAs/GaAs (001) and GaAs1-yPy/GaAs (001) Metamorphic Buffer Layers

2015 ◽  
Vol 24 (03n04) ◽  
pp. 1520009 ◽  
Author(s):  
Tedi Kujofsa ◽  
John E. Ayers
Keyword(s):  
Dislocation Density ◽  
Buffer Layer ◽  
Minimum Energy ◽  
Lattice Relaxation ◽  
Structure Type ◽  
Elastic Stiffness ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Misfit Dislocations ◽  
Metamorphic Buffer

The inclusion of metamorphic buffer layers (MBL) in the design of lattice-mismatched semiconductor heterostructures is important in enhancing reliability and performance of optical and electronic devices. These metamorphic buffer layers usually employ linear grading of composition, and materials including InxGa1-xAs and GaAs1-yPy have been used. Non-uniform and continuously graded profiles are beneficial for the design of partially-relaxed buffer layers because they reduce the threading dislocation density by allowing the distribution of the misfit dislocations throughout the metamorphic buffer layer, rather than concentrating them at the interface where substrate defects and tangling can pin dislocations or otherwise reduce their mobility as in the case of uniform compositional growth. In this work we considered heterostructures involving a linearly-graded (type A) or step-graded (type B) buffer layer grown on a GaAs (001) substrate. For each structure type we present minimum energy calculations and compare the cases of cation (Group III) and anion (Group V) grading. In addition, we studied the (i) average and surface in-plane strain and (ii) average misfit dislocation density for heterostructures with various thickness and compositional profile. Moreover, we show that differences in the elastic stiffness constants give rise to significantly different behavior in these two commonly-used buffer layer systems.

Residual Strain and Defect Analysis in as Grown and Annealed SiGe Layers

1991 ◽  
Vol 220 ◽  
Author(s):  
A. R. Powell ◽  
R. A. Kubiak ◽  
T. E. Whall ◽  
E. H. C. Parker ◽  
D. K. Bowen
Keyword(s):  
Residual Strain ◽  
Buffer Layers ◽  
Limited Area ◽  
Threading Dislocation ◽  
Misfit Dislocations ◽  
High Temperature Anneal ◽  
Dislocation Densities ◽  
Acceptable Quality ◽  
Strained Sige

ABSTRACTIn this paper we address the problem of producing SiGe buffer layers of acceptable quality for the growth of symmetrically strained SiGe structures. Initially we consider SiGe layers grown to well beyond the metastable critical thickness and examine the degree of residual strain both as - grown and post anneal. The defect levels in metastable SiGe layers following high temperature anneal were also studied. A buffer layer was grown consisting of stacked metastable SiGe layers each of which is annealed in situ prior to the growth of the next layer and terminating with a 0.45 SiGe alloy. This produces nearly fully relaxed 1.15pim thick structures with threading dislocation densities of 4 × 106cm−2. Limited area growth on Si suggests that elastically relaxed material free of both threading and misfit dislocations can be produced.

scholarly journals Effect of Buffer Layer and III/V Ratio on the Surface Morphology of Gan Grown by MBE

1999 ◽  
Vol 4 (S1) ◽  
pp. 417-422 ◽  
Author(s):  
E. C. Piquette ◽  
P. M. Bridger ◽  
R. A. Beach ◽  
T. C. McGill
Keyword(s):  
Surface Morphology ◽  
Buffer Layer ◽  
Flux Ratio ◽  
Plasma Source ◽  
Growth Conditions ◽  
Nitrogen Plasma ◽  
Layer Growth ◽  
Buffer Layers ◽  
Flat Surfaces ◽  
Aln Buffer

The surface morphology of GaN is observed by atomic force microscopy for growth on GaN and AlN buffer layers and as a function of III/V flux ratio. Films are grown on sapphire substrates by molecular beam epitaxy using a radio frequency nitrogen plasma source. Growth using GaN buffer layers leads to N-polar films, with surfaces strongly dependent on the flux conditions used. Flat surfaces can be obtained by growing as Ga-rich as possible, although Ga droplets tend to form. Ga-polar films can be grown on AlN buffer layers, with the surface morphology determined by the conditions of buffer layer deposition as well as the III/V ratio for growth of the GaN layer. Near-stoichiometric buffer layer growth conditions appear to support the flattest surfaces in this case. Three defect types are typically observed in GaN films on AlN buffers, including large and small pits and “loop” defects. It is possible to produce surfaces free from large pit defects by growing thicker films under more Ga-rich conditions. In such cases the surface roughness can be reduced to less than 1 nm RMS.

Threading Dislocation Density Reduction in GaN/Sapphire Heterostructures.

1999 ◽  
Vol 595 ◽  
Author(s):  
A. Kvit ◽  
A. K. Sharma ◽  
J. Narayan
Keyword(s):  
Basal Plane ◽  
Stacking Faults ◽  
High Density ◽  
Thin Layers ◽  
Interfacial Region ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Misfit Dislocations ◽  
Plan View ◽  
Partial Dislocations

AbstractLarge lattice mismatch between GaN and α-Al2O3 (15%) leads to the possibility of high threading dislocation densities in the nitride layers grown on sapphire. This investigation focused on defect reduction in GaN epitaxial thin layer was investigated as a function of processing variables. The microstructure changes from threading dislocations normal to the basal plane to stacking faults in the basal plane. The plan-view TEM and the corresponding selected-area diffraction patterns show that the film is single crystal and is aligned with a fixed epitaxial orientation to the substrate. The epitaxial relationship was found to be (0001)GaN∥(0001)Sap and [01-10]GaN∥[-12-10]Sap. This is equivalent to a 30° rotation in the basal (0001) plane. The film is found to contain a high density of stacking faults with average spacing 15 nm terminated by partial dislocations. The density of partial dislocations was estimated from plan-view TEM image to be 7×109 cm−2. The cross-section image of GaN film shows the density of stacking faults is highest in the vicinity of the interface and decreases markedly near the top of the layer. Inverted domain boundaries, which are almost perpendicular to the film surface, are also visible. The concentration of threading dislocation is relatively low (∼;2×108 cm−2), compared to misfit dislocations. The average distance between misfit dislocations was found to be 22 Å. Contrast modulations due to the strain near misfit dislocations are seen in high-resolution cross-sectional TCM micrograph of GaN/α-Al2O3 interface. This interface is sharp and does not contain any transitional layer. The interfacial region has a high density of Shockley and Frank partial dislocations. Mechanism of accommodation of tensile, sequence and tilt disorder through partial dislocation generation is discussed. In order to achieve low concentration of threading dislocations we need to establish favorable conditions for some stacking disorder in thin layers above the film-substrate interface region.

Defect and Dopant Control During Silicon Epitaxy Using B and Ge

1987 ◽  
Vol 104 ◽  
Author(s):  
R. R. Kola ◽  
J. B. Posthill ◽  
A. S. M. Salih ◽  
G. A. Rozgonyi ◽  
K. E. Bean ◽  
...  
Keyword(s):  
High Speed ◽  
Maximum Yield ◽  
Dark Field ◽  
Electrical Performance ◽  
Epitaxial Layers ◽  
Threading Dislocation ◽  
Epitaxial Silicon ◽  
Cross Sectional ◽  
Plan View ◽  
Co Doped

ABSTRACTThe control of dopants, impurities and defects for VLSI of silicon integrated circuits requires a complex set of crystal and processing conditions to be satisfied simultaneously. In order to achieve the maximum yield and highest level of electrical performance for a given device design, we have manipulated the lattice constant and boron doping levels in CVD epitaxial silicon layers co-doped with germanium. By adjusting the ratios of germane and diborane in a dichlorosilane/hydrogen CVD reactor we have obtained buried high conducting layers which are strain-free and lattice matched to the Si substrate. Degenerate boron and boron and germanium codoped epitaxial layers on (100) p-type silicon substrates were investigated. Solubility, electrical activity limits and defect structure of boron in strained and strain-free silicon epitaxial layers were investigated by spreading resistance, SIMS profiling, X-ray and transmission electron microscopy techniques. Bright field and weak-beam dark field imaging of cross-sectional and plan-view specimens were used to confirm the presence or absence of precipitates and threading dislocations. A model has been proposed to describe the mechanism of threading dislocation formation in heavily boron-doped layers. We are now in a position to strategically locate co-doped Si(B, Ge) p++ layers as recombination zones or buried field plates to suit the needs of MOS latchup control, high speed and radiation hard devices, as well as the needs of defect free p++ etch stops for thin membranes and three-dimensional silicon structures.

Dependence of GaN Defect Structure on the Growth Temperature of the AlN Buffer Layer

2008 ◽  
Vol 1068 ◽  
Author(s):  
Yuen-Yee Wong ◽  
Edward Yi Chang ◽  
Tsung-Hsi Yang ◽  
Jet-Rung Chang ◽  
Yi-Cheng Chen ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Growth Temperature ◽  
Defect Structure ◽  
Defect Density ◽  
Layer Growth ◽  
Threading Dislocation ◽  
Higher Temperature ◽  
Lower Temperature ◽  
Aln Buffer ◽  
Gan Film

ABSTRACTThe defect structure of the GaN film grown on sapphire by plasma-assisted molecular beam epitaxy (PAMBE) technique was found to be dependent on the AlN buffer layer growth temperature. This buffer growth temperature controlled the defect density in GaN film but had shown contrary effects on the density of screw threading dislocation (TD) and edge TD. The density of screw TD was high on lower temperature buffer but low on the higher temperature buffer. Meanwhile the density of edge TD had shown the opposite. Further examinations have suggested that the defect structure was closely related to the stress in the GaN film, which can be controlled by the growth temperature of the AlN buffer. Using the 525°C AlN buffer, optimum quality GaN film with relatively low screw and edge TDs were achieved.

Analysis of co-deposited Ti-Hf thin film on (0001)6H-SiC by HREM, energy-selected and hollow-cone images

1994 ◽  
Vol 52 ◽  
pp. 978-979
Author(s):  
J. S. Bow
Keyword(s):  
Thin Film ◽  
Solid Solution ◽  
Lattice Parameter ◽  
Dark Field ◽  
Electron Beam Evaporation ◽  
Structural Defects ◽  
Misfit Dislocations ◽  
Hollow Cone ◽  
Chemical Homogeneity ◽  
Dark Field Imaging

Solid solution binary alloys are attractive for defect-free thin film semiconductor contacts because lattice matching can be obtained by composition adjustment, but chemical homogeneity is required. Highly composition sensitive energy-selected and hollow cone (HC) dark field imaging were evaluated for heterogeneity detection in Ti-Hf films using an Ω filter/Zeiss 912 TEM. Conventional HREM, which relatively insensitive to spatial composition variations in this case, was used to observe structural defects in the films near the interfaces.Thin films of pure Ti deposited via UHV electron beam evaporation at room temperature on n-type, vicinal (0001) 6H-SiC showed good epitaxy. This contact displayed rectifying characteristics. The interface was both structurally and chemically sharp. However, misfit dislocations at “stand off” positions were found, due to 4 % mismatch between the basal parameters of Ti and SiC. same column with Ti in the periodic table and has hexagonal crystal structure, but larger lattice parameter (aHf = 3.196 Å, and aTi = 2.950 Å). The Ti-Hf solid solution system obeys Vergard's law well, that is, the lattice parameters of this alloy change linearly with composition.

The Effect of Buffer Layer on CNT Structure and CNT/Copper Interfacial Properties

MRS Advances ◽  
2016 ◽  
Vol 1 (20) ◽  
pp. 1447-1452
Author(s):  
Qiuhong Zhang ◽  
Levi Elston ◽  
James Scofield ◽  
Joseph Merrett ◽  
William Lanter ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
Buffer Layer ◽  
Substrate Surface ◽  
High Surface ◽  
Interfacial Properties ◽  
Layer Growth ◽  
Buffer Layers ◽  
Mechanical And Thermal Properties ◽  
Cu Substrate ◽  
Cu Substrates

ABSTRACTCarbon nanotubes (CNTs), with exceptional thermal and mechanical properties as well as inherently high surface area, are an attractive candidate for integrating into thermal structures of advanced power electronics. Growth of vertically aligned carbon nanotubes (VACNTs) directly onto copper (Cu) substrates is a promising approach to apply CNTs as novel thermal interface materials (TIMs) in electronics packaging. However, compared to growing CNTs on conventional inert substrates such as SiO2, direct growth of controllable CNT arrays onto Cu substrates is significantly more challenging due to the diffusion of metallic catalyst into the substrate during growth. By depositing an appropriate buffer layer on the Cu substrate surface, VACNTs of good alignment and high quality were reproducibly synthesized on the Cu substrate via the chemical vapor deposition (CVD) method in this study. The effect of different buffer layers on the CNT growth, nanotube structure and quality was investigated (SEM, Raman), particularly in terms of the interfacial properties between the CNT array and Cu substrate (Tensile compression force tester, Laser Flash Analysis). Our experimental results indicated that the buffer layer material, deposition method, and thickness play a key role in regulating the CNT layer growth/structure, leading to variable mechanical and thermal properties. The fundamental understanding thus obtained allows the successful synthesis of VACNT on copper substrates with desired structure and properties.

Sign in / Sign up

Export Citation Format

Share Document