Ultra Low-K Inorganic Silsesquioxane Films with Tunable Electrical and Mechanical Properties

2000 ◽  
Vol 612 ◽  
Author(s):  
Thomas A. Deis ◽  
Chandan Saha ◽  
Eric Moyer ◽  
Kyuha Chung ◽  
Youfan Liu ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Room Temperature ◽  
Moisture Absorption ◽  
Dielectric Constants ◽  
Mechanical And Thermal Properties ◽  
Processing Conditions ◽  
Film Composition ◽  
Temperature Oxidation ◽  
Wide Range ◽  
Low K

AbstractLow-k dielectric films have been developed using a new silsesquioxane based chemistry that allows both the electrical and mechanical properties to be tuned to specific values. By controlling the composition and film processing conditions of spin-on formulations, dielectric constants in the range 1.5 to 3.0 are obtained with modulus values that range from 1 to 30 GPa. The modulus and dielectric constant are tuned by controlling porosity, which varies from 0 to >60%, and final film composition which varies from HSiO3/2 to SiO4/2. The spin-on formulation includes hydrogen silsesquioxane resin and solvents. Adjusting the ratio of solvents to resin in the spin-on formulation controls porosity. As-spun films are treated with ammonia and moisture to oxidize the resin and form a mechanically self-supporting gel. Solvent removal and further conversion to a more “silica-like” composition occur during thermal curing at temperatures of 400 to 450°C. The final film composition was controlled through both room temperature oxidation and thermal processing. Final film properties are optimized for a balance of electrical, mechanical and thermal properties to meet the specific requirements of a wide range of applications. Processed films exhibit no stress corrosion cracking or delamination upon indentation, with indenter penetration exceeding the film thickness, and followed by exposure to water at room temperature. Films also exhibit high adhesive strength (> 60MPa) and low moisture absorption. Processing conditions, composition and properties of thin are discussed.

Mechanical Properties and Dislocation Structure of Single Crystal Cdte Deformed in Compression at 300°C

1976 ◽  
Vol 34 ◽  
pp. 592-593
Author(s):  
Ernest L. Hall ◽  
J. B. Vander Sande
Keyword(s):  
Mechanical Properties ◽  
Single Crystal ◽  
Dislocation Structure ◽  
Room Temperature ◽  
Elevated Temperatures ◽  
Strain Curve ◽  
Optical Devices ◽  
Semiconductor Compound ◽  
Wide Range ◽  
Sample Orientation

The present paper describes research on the mechanical properties and related dislocation structure of CdTe, a II-VI semiconductor compound with a wide range of uses in electrical and optical devices. At room temperature CdTe exhibits little plasticity and at the same time relatively low strength and hardness. The mechanical behavior of CdTe was examined at elevated temperatures with the goal of understanding plastic flow in this material and eventually improving the room temperature properties. Several samples of single crystal CdTe of identical size and crystallographic orientation were deformed in compression at 300°C to various levels of total strain. A resolved shear stress vs. compressive glide strain curve (Figure la) was derived from the results of the tests and the knowledge of the sample orientation.

Thermo Mechanical behaviour of Phenol Novolac Resin and Unsaturated Polyester Toughened Epoxy using nano Bentonite and Silica Nanoparticles

2020 ◽  
Vol 1 (3) ◽  
pp. 77-83
Keyword(s):  
Mechanical Properties ◽  
Epoxy Resin ◽  
Silica Nanoparticles ◽  
Moisture Absorption ◽  
Unsaturated Polyester ◽  
Physical And Mechanical Properties ◽  
Bending Test ◽  
Mechanical And Thermal Properties ◽  
Novolac Epoxy ◽  
Industrial Needs

Phenol novolac epoxy resin is a polymer matter which its properties can be modified for industrial needs. In this research, nanocomposites of phenol novolac epoxy resin and unsaturated polyester are made nano Bentonite and silica nanoparticles as filler. For this purpose, effect of nanoparticles percent on nanocomposite formation is studied and their physical, mechanical and thermal properties are obtained. The presence of unsaturated polyester in this process forms a cross-link capable of improving the physical and mechanical properties of epoxy resin. Fracture behavior was determined by a SEM device. Moreover, TGA, DSC, impact tests and bending test were applied for data analysis. When process ability is growing, moisture absorption decreases. Fracture toughness was also evaluated in a stoichiometric network. Physical and mechanical properties improve significantly with increasing nanoparticles. The most important reason for using this nanocomposite is its high resistance to corrosion.

New Carbon-bridged Hybrid Polymers for Low-k Materials

2005 ◽  
Vol 863 ◽  
Author(s):  
Bum-Gyu Choi ◽  
Byung Ro Kim ◽  
Myung-Sun Moon ◽  
Jung-Won Kang ◽  
Min-Jin Ko
Keyword(s):  
Mechanical Properties ◽  
Hybrid Materials ◽  
Chemical Mechanical Planarization ◽  
Sol Gel ◽  
Dielectric Constants ◽  
Metal Line ◽  
Inorganic Hybrid ◽  
Low Dielectric ◽  
Continuous Stiffness Measurement ◽  
Low K

AbstractReducing interline capacitance and line resistance is required to minimize RC delays, reduce power consumption and crosstalk below 100nm node technology. For this purpose, various inorganic- and organic polymers have been tested to reduce dielectric constants in parallel with the use of copper as metal line. Lowering the dielectric constants, in particular, causes the detrimental effect on mechanical properties, and then leads to film damage and/or delamination during chemical-mechanical planarization CMP) or repeated thermal cure cycles. To overcome this issue, new carbon-bridged hybrid materials synthesized by organometallic silane precursors and sol-gel reaction are proposed.In this work, we have developed new organic-inorganic hybrid low-k dielectrics with linear or cyclic carbon bridged structures. The differently bridged carbon structures were formed by a controlled reaction. 1H NMR, 29Si NMR analysis and GC/MSD analysis were conducted for the structural characterization of new hybrid low-k dielectric. The mechanical and dielectric properties of these hybrid materials were characterized by using nanoindentation with continuous stiffness measurement and Al dot MIS techniques. The results indicated that these organic-inorganic hybrid materials were very promising polymers for low-k dielectrics that had low dielectric constants with high thermal and mechanical properties. It has been also demonstrated that electrical and mechanical properties of the hybrid films could be tailored by copolymerization with PMSSQ and through the introduction of porogen.

Effects of Hydrophobic Barrier Films on the Mechanical Properties of Fiber Reinforced Composites Immersed in Water

2011 ◽  
Author(s):  
E. Kececi ◽  
R. Asmatulu
Keyword(s):  
Mechanical Properties ◽  
Moisture Absorption ◽  
Uv Light ◽  
Fiber Reinforced Composites ◽  
Reinforced Composites ◽  
Fiber Reinforced ◽  
Bending Tests ◽  
Barrier Films ◽  
Hydrophobic Barrier ◽  
Wide Range

Fiber reinforced composites are subjected to a wide range of mechanical loads and environmental conditions, such as wind, high/low temperature, moisture, UV light and aggressive solvents. Compared to other structural materials, polymers can absorb more moisture and UV light from outside environment and lose their material properties (e.g., mechanical, electrical, surface and thermal) and thus the service life. In this study, hydrophobic barrier films including polyvinylfluoride (PVF) and polyether ether ketone (PEEK) were applied on the carbon, Kevlar, and glass fiber reinforced epoxy resin composites (laminate and sandwich structures), and then the effects of moisture absorption on those films were investigated in detail. The coupons were immersed in water for a number of days in order to determine the changes in mechanical properties of the composites. Three point bending tests were applied to the laminate composites, while four point bending tests were conducted on the Nomex sandwich structured composites. We found that moisture absorption could be eliminated by using these hydrophobic films. We found that PEEK film could be an alternative barrier film for the aircraft industry.

Effect of Moisture on the Mechanical Properties of Additively Manufactured PLA, ABS and PLA/SiC Composites

2019 ◽  
Author(s):  
Padmalatha Kakanuru ◽  
Kishore Pochiraju
Keyword(s):  
Mechanical Properties ◽  
Room Temperature ◽  
Moisture Absorption ◽  
Failure Strain ◽  
Acrylonitrile Butadiene Styrene ◽  
Distilled Water ◽  
Weight Percentage ◽  
Lower Volume ◽  
Sic Composites ◽  
Butadiene Styrene

Abstract In this study the tensile properties of additively manufactured Polylactic Acid (PLA), Acrylonitrile Butadiene Styrene (ABS) and Silicon Carbide (SiC) particulate filled PLA composites were assessed after aging for 4.5 months at 50°C in distilled water. The maximum moisture gain in PLA was about 16% by weight, and ABS gained 0.65%. In PLA/SiC composites, the weight gain due to moisture absorption was inversely proportional to the weight percentage of SiC loading. The PLA specimens degraded completely during aging without measurable residual strength. While the addition of SiC to PLA increased the room temperature tensile strength at lower volume fractions of SiC, the degradation of aged strength was similar to that of the pure PLA. The PLA/SiC composites had no measurable strength after aging. The ABS specimens retained their strength and failure strain after aging.

scholarly journals The Influence of Sub-Zero Conditions on the Mechanical Properties of Polylactide-Based Composites

Materials ◽  
2020 ◽  
Vol 13 (24) ◽  
pp. 5789
Author(s):  
Olga Mysiukiewicz ◽  
Mateusz Barczewski ◽  
Arkadiusz Kloziński
Keyword(s):  
Mechanical Properties ◽  
Room Temperature ◽  
Mechanical Performance ◽  
Mechanical Analysis ◽  
Uniaxial Tensile ◽  
Uniaxial Tensile Test ◽  
Mechanical And Thermal Properties ◽  
Scanning Calorimetry ◽  
Linseed Cake ◽  
Static Mechanical

Polylactide-based composites filled with waste fillers due to their sustainability are a subject of many current papers, in which their structural, mechanical, and thermal properties are evaluated. However, few studies focus on their behavior in low temperatures. In this paper, dynamic and quasi-static mechanical properties of polylactide-based composites filled with 10 wt% of linseed cake (a by-product of mechanical oil extraction from linseed) were evaluated at room temperature and at −40 °C by means of dynamic mechanical analysis (DMA), Charpy’s impact strength test and uniaxial tensile test. It was found that the effect of plasticization provided by the oil contained in the filler at room temperature is significantly reduced in sub-zero conditions due to solidification of the oil around −18 °C, as it was shown by differential scanning calorimetry (DSC) and DMA, but the overall mechanical performance of the polylactide-based composites was sufficient to enable their use in low-temperature applications.

New hybrid low-k dielectric materials prepared by vinylsilane polymerization

2004 ◽  
Vol 812 ◽  
Author(s):  
Jung-Won Kang ◽  
Byung Ro Kim ◽  
Gwi-Gwon Kang ◽  
Myung-Sun Moon ◽  
Bum-Gyu Choi ◽  
...  
Keyword(s):  
Fracture Toughness ◽  
Hybrid Materials ◽  
Dielectric Materials ◽  
Dielectric Constants ◽  
Good Adhesion ◽  
Inorganic Hybrid ◽  
Adhesion Promoters ◽  
Semiconductor Structures ◽  
Wide Range ◽  
Low K

AbstractSpin-on Low-K materials are potentially very attractive as interconnection materials in a wide range of semiconductor structures. In this work, new organic-inorganic hybrid materials synthesized by vinylsilane polymerization were proposed. According to compositions and additional fabrications, dielectric constants of these materials were evaluated to be 2.3∼3.1. The hardness was 2.0GPa after 430°C curing. These materials had good adhesion strength such that fracture toughness on silicon wafer was 0.22 MPam0.5 without any adhesion promoters. This result indicates that these organicinorganic hybrid materials are very promising candidates for low-K dielectrics.

Mechanical Behavior of a Metal Matrix Nanocomposite Synthesized by High-Pressure Torsion via Diffusion Bonding

2016 ◽  
Vol 879 ◽  
pp. 1068-1073
Author(s):  
Han Joo Lee ◽  
Jae Kyung Han ◽  
Byung Min Ahn ◽  
Megumi Kawasaki ◽  
Terence G. Langdon
Keyword(s):  
Mechanical Properties ◽  
High Pressure ◽  
Metal Matrix ◽  
Room Temperature ◽  
High Pressure Torsion ◽  
Ambient Temperatures ◽  
Metal Matrix Nanocomposite ◽  
Wide Range ◽  
Zk60 Magnesium Alloy ◽  
Matrix Nanocomposite

High-pressure torsion (HPT) is one of the major severe plastic deformation (SPD) procedures where disk metals generally achieve exceptional grain refinement at ambient temperatures. HPT has been applied for the consolidation of metallic powders and bonding of machining chips whereas very limited reports examined the application of HPT for the fabrication of nanocomposites. An investigation was initiated to evaluate the potential for the formation of a metal matrix nanocomposite (MMNC) by processing two commercial metal disks of Al-1050 and ZK60 magnesium alloy through HPT at room temperature. Evolutions in microstructure and mechanical properties including hardness and plasticity were examined in the processed disks with increasing numbers of HPT turns up to 5. This study demonstrates the promising possibility for using HPT to fabricate a wide range of hybrid MMNCs from simple metals.

Bio-based polyhydroxyalkanoates blends and composites

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Samy A. Madbouly
Keyword(s):  
Mechanical Properties ◽  
Functional Materials ◽  
Cost Effective ◽  
Production Method ◽  
Industrial Applications ◽  
Mechanical And Thermal Properties ◽  
Wide Range ◽  
High Production ◽  
High Production Cost ◽  
New Generation

Abstract Polyhydroxyalkanoates (PHAs) are linear semicrystalline polyesters produced naturally by a wide range of microorganisms for carbon and energy storage. PHAs can be used as replacements for petroleum-based polyethylene (PE) and polypropylene (PP) in many industrial applications due to their biodegradability, excellent barrier, mechanical, and thermal properties. The overall industrial applications of PHAs are still very limited due to the high production cost and high stiffness and brittleness. Therefore, new novel cost-effective production method must be considered for the new generation of PHAs. One approach is based on using different type feedstocks and biowastes including food byproducts and industrial and manufacturing wastes, can lead to more competitive and cost-effective PHAs products. Modification of PHAs with different function groups such as carboxylic, hydroxyl, amine, epoxy, etc. is also a relatively new approach to create new functional materials with different industrial applications. In addition, blending PHA with biodegradable materials such as polylactide (PLA), poly(ε-caprolactone) (PCL), starch, and distiller’s dried grains with solubles (DDGS) is another approach to address the drawbacks of PHAs and will be summarized in this chapter. A series of compatibilizers with different architectures were successfully synthesized and used to improve the compatibility and interfacial adhesion between PHAs and PCL. Finer morphology and significantly improvement in the mechanical properties of PHA/PCL blends were observed with a certain type of block compatibilizer. In addition, the improvement in the blend morphology and mechanical properties were found to be strongly influenced by the compatibilizer architecture.

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