High Speed GaAs Based Devices on Si Substrates

1986 ◽  
Vol 67 ◽  
Author(s):  
Hadis Morkoc

ABSTRACTRemarkably good device performance at both dc and microwave frequencies has recently been obtained from GaAs based devices grown on Si substrates. In GaAs MESFETs on Si, current gain cutoff frequencies and maximum oscillation frequencies of fT = 13.3 GHz and fmax = 30 GHz have been obtained for 1.2μm devices, which is nearly identical to the performance achieved in GaAs on GaAs technology for both direct implant and epitaxial technology. For heterojunction bipolar transistors, current gain cutoff frequencies and maximum oscillation frequencies of fT = 30 GHz and fmax = 11.3 GHz have been obtained for emitter dimensions of 4×20μm2. In GaAs AlGaAs MODFETs. current gain cut-off frequencies of about 15 GHz with lμm gates were obtained on GaAs and Si substrates. The pseudomorphic InGaAs/GaAs MODFETs were also fabricated and found to be comparable to GaAs MODFETs although they should perform better. The structures were also shown to maintain their properties when put through ion implantation and annealing process. Given the performance already demonstrated in GaAs on Si devices and the advantages afforded by this technology, the growth of III-Vs on Si promises to play an important role in the future of heterojunction electronics.

1995 ◽  
Vol 06 (01) ◽  
pp. 1-89 ◽  
Author(s):  
GUANG-BO GAO ◽  
S. NOOR MOHAMMAND ◽  
GREGORY A. MARTIN ◽  
HADIS MORKOÇ

Recent developments in the physics and technology of III-V compound heterojunction bipolar transistors (HBTs) are reviewed. The technologies discussed are AlGaAs/GaAs, GaInP/GaAs, InP/InGaAs, and AlInAs/InGaAs based heterostructures. WIth current gain cut off frequencies over 100 GHz and maximum oscillation frequencies of about 200 GHz, the III-V compound semiconductor based HBTs have advanced to the point of commercialization. These developments also had the fortuitous effect of providing impetus and theoretical base to advance Si based HBT technologies, such as SiGe HBTs, to advance also. Recent SiGe HBTs, taking advantage of advanced Si processing technologies, have also recorded performances in excess of 100 GHz with applications envisioned in high speed analog-digital converters. While there remain some voids in the fundamental understanding of HBTs, the state-of-the-art of the GaAs HBT technology, concerning reproducibility and reliability, is at a point where problems related to production are at the forefront. The next few years are going to prove interesting with each technology recording improved performance.


1995 ◽  
Vol 387 ◽  
Author(s):  
G. Ritter ◽  
B. Tillack ◽  
D. Knoll

AbstractComplete epitaxial Si-SiGe-Si- stacks with a defined doping profile for each component have been deposited on Si substrates from the system SiH4, GeH4, H2, B2H6, PH3 by RTCVD. The deposition has been carried out at a temperature of 650°C for Si and of 500°C for SiGe, respectively, both at a pressure of 2 mbar. The developed epitaxial process including an effective H2 in-situ preclean annealing has been integrated in a simple double mesa technology for the preparation of SiGe base heterojunction bipolar transistors (HBT). Despite the simplicity of the technology and the lithographical level allowing emitter dimensions of 2.3×2.5 μm2 only, test devices on 4” wafers reached transit frequencies fT and maximum oscillation frequencies fmax of higher than 60 GHz and 30 GHz, respectively. Besides, a low base current has been measýnl as proof for a good layer quality.


2019 ◽  
Vol 61 (1) ◽  
pp. 22-32
Author(s):  
Abdelkader Khadir ◽  
Nouredine Sengouga ◽  
Mohamed Kamel Abdelhafidi

AbstractThe effect of germanium trapezoidal profile shape on the direct current (DC) current gain (βF), cut-off frequency (fT) and maximum oscillation frequency (fMAX) of silicon-germanium (SiGe) hetero-junction bipolar transistors (HBTs) has been investigated. The energy balance (EB), hydrodynamic (HD) and drift-diffusion (DD) physical transport models in SILVACO technology computer aided design (T-CAD) simulator were used. It was found that the current gain values using energy balance model are higher than hydrodynamic and much higher than those corresponding to drift-diffusion. Moreover, decreasing the germanium gradient slope towards the collector side of the base enhances the maximum oscillation frequencies using HD and EB models whilst, they remain stable for DD model.


2001 ◽  
Vol 24 (4) ◽  
pp. 265-287
Author(s):  
K. F. Yarn ◽  
K. H. Ho

Heterojunction bipolar transistors (HBT) based on Npn AlGaAs/GaAs material system have attracted considerable attention for microwave power and digital applications due to their high speed and high current capabilities. In this paper, a numerical model based on the Npn AlGaAs/GaAs HBT structure for the carrier transport is presented. Three figures of merit on device operation, current gain, cut-off frequency and maximum oscillation frequency are calculated. Besides, thermal instability plays an important role on power HBT resulted from the low thermal conductivity in GaAs. The generated heat will increase the junction temperature and cause self-destruction. Therefore, the thermal runaway study of the junction temperature, current–voltage (IV) characteristics and frequency response using an analytical thermal model is described.


Author(s):  
N. David Theodore ◽  
Donald Y.C Lie ◽  
J. H. Song ◽  
Peter Crozier

SiGe is being extensively investigated for use in heterojunction bipolar-transistors (HBT) and high-speed integrated circuits. The material offers adjustable bandgaps, improved carrier mobilities over Si homostructures, and compatibility with Si-based integrated-circuit manufacturing. SiGe HBT performance can be improved by increasing the base-doping or by widening the base link-region by ion implantation. A problem that arises however is that implantation can enhance strain-relaxation of SiGe/Si.Furthermore, once misfit or threading dislocations result, the defects can give rise to recombination-generation in depletion regions of semiconductor devices. It is of relevance therefore to study the damage and anneal behavior of implanted SiGe layers. The present study investigates the microstructural behavior of phosphorus implanted pseudomorphic metastable Si0.88Ge0.12 films on silicon, exposed to various anneals.Metastable pseudomorphic Si0.88Ge0.12 films were grown ~265 nm thick on a silicon wafer by molecular-beam epitaxy. Pieces of this wafer were then implanted at room temperature with 100 keV phosphorus ions to a dose of 1.5×1015 cm-2.


2004 ◽  
Vol 14 (03) ◽  
pp. 625-631 ◽  
Author(s):  
J. W. LAI ◽  
W. HAFEZ ◽  
M. FENG

We have fabricated the high-speed InP/InGaAs -based single heterojunction bipolar transistors (SHBTs) with current gain cutoff frequency, fT from 166GHz to over 500GHz by the approach of vertical scaling. Collector thickness is reduced from 3000Å to 750Å and the peak current density is increased up to 1300kA/cm2. In this paper, device rf performance has been compared with respect to materials with different vertical dimensions. The scaling limitation is also studied by analytical approach. The extracted physical parameters suggest that the parasitic emitter resistance is the major limit on further enhancing ultra-scaled HBT intrinsic speed due to the associated RECBC delay. The cut-off frequency of a 500Å collector SHBT has been measured and the results indicate a dramatic drop on fT, supporting the conclusion projected by model analysis. It is also commented that for deeply downscaled HBTs, impact ionization could be another degrading mechanism limits device bandwidth.


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