Strain Rate Dependent Behavior of Pure Aluminum and Copper Micro-Wires

2001 ◽  
Vol 695 ◽  
Author(s):  
P. A. El-Deiry ◽  
R. P. Vinci
Keyword(s):  
Thin Films ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Pure Aluminum ◽  
Grain Boundary Sliding ◽  
Dislocation Motion ◽  
Small Scale ◽  
Rate Dependent ◽  
Dependent Behavior ◽  
Boundary Sliding

ABSTRACTIn order to shed light on the role that grain boundaries and dislocations play in anelastic relaxation of thin films and small-scale structures, we measured the effective elastic moduli of 99.99% pure Al and Cu 10 m m diameter micro-wires in the as-received (drawn and slight tempered) and annealed states. Moduli were determined using microtensile tests at various strain rates (6.7x10-6s-1, 1.3x10-5s-1, 2.6x10-5s-1, 4.5x10-5s-1, 2.5x10-4s-1, 4.5x10-4s-1). Focused-ion beam scanning electron microscopy was used for imaging grain sizes. Results from the as-received wires are compared with the annealed wires to illustrate the effects of grain size and dislocation density on effective moduli, which closely relates to grain boundary sliding and dislocation motion, respectively. We conclude that microstructure is more significant than scale in inducing anelasticity in small-scale wires and, by extension, thin films.

Mechanical Properties of Electroplated Copper Thin Films

1999 ◽  
Vol 594 ◽  
Author(s):  
R. Spolenak ◽  
C. A. Volkert ◽  
K. Takahashi ◽  
S. Fiorillo ◽  
J. Miner ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Grain Size ◽  
Film Thickness ◽  
Yield Stress ◽  
Laser Scanning ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Cu Films ◽  
Electroplated Copper

AbstractIt is well known that the mechanical properties of thin films depend critically on film thickness However, the contributions from film thickness and grain size are difficult to separate, because they typically scale with each other. In one study by Venkatraman and Bravman, Al films, which were thinned using anodic oxidation to reduce film thickness without changing grain size, showed a clear increase in yield stress with decreasing film thickness.We have performed a similar study on both electroplated and sputtered Cu films by using chemical-mechanical polishing (CMP) to reduce the film thickness without changing the grain size. Stress-temperature curves were measured for both the electroplated and sputtered Cu films with thicknesses between 0.1 and 1.8 microns using a laser scanning wafer curvature technique. The yield stress at room temperature was found to increase with decreasing film thickness for both sets of samples. The sputtered films, however, showed higher yield stresses in comparison to the electroplated films. Most of these differences can be attributed to the different microstructures of the films, which were determined by focused ion beam (FIB) microscopy and x-ray diffraction.

scholarly journals Ion Irradiation-Induced Microstructural Evolution of Ni–Mo–Cr Low Alloy Steels

Materials ◽  
2018 ◽  
Vol 11 (11) ◽  
pp. 2268
Author(s):  
Hongying Sun ◽  
Penghui Lei ◽  
Guang Ran ◽  
Hui Wang ◽  
Jiyun Zheng ◽  
...  
Keyword(s):  
Irradiation Dose ◽  
Focused Ion Beam ◽  
Ion Irradiation ◽  
Ion Beam ◽  
High Strength ◽  
Positron Annihilation Spectroscopy ◽  
Small Scale ◽  
Low Alloy Steels ◽  
Dislocation Loops ◽  
S Parameter

As leading candidates of sheet steels for advanced nuclear reactors, three types of Ni–Mo–Cr high-strength low alloy (HSLA) steels named as CNST1, CNST2 and CNSS3 were irradiated by 400 keV Fe+ with peak fluence to 1.4 × 1014, 3.5 × 1014 and 7.0 × 1014 ions/cm2, respectively. The distribution and morphology of the defects induced by the sample preparation method and Fe+ irradiation dose were investigated by transmission electron microscopy (TEM) and positron-annihilation spectroscopy (PAS). TEM samples were prepared with two methods, i.e., a focused ion beam (FIB) technique and the electroplating and twin-jet electropolishing (ETE) method. Point defects and dislocation loops were observed in CNST1, CNST2 and CNSS3 samples prepared via FIB. On the other hand, samples prepared via the ETE method revealed that a smaller number of defects was observed in CNST1, CNST2 and almost no defects were observed in CNST3. It is indicated that artifact defects could be introduced by FIB preparation. The PAS S-W plots showed that the existence of two types of defects after ion implantation included small-scale defects such as vacancies, vacancy clusters, dislocation loops and large-sized defects. The S parameter of irradiated steels showed a clear saturation in PAS response with increasing Fe+ dose. At the same irradiation dose, higher values of the S-parameter were achieved in CNST1 and CNST2 samples when compared to that in CNSS3 samples. The mechanism and evolution behavior of irradiation-induced defects were analyzed and discussed.

Effects of P Content on Morphology of Nanocrystals Induced by FIB Irradiation in Ni-P Amorphous Alloy

2006 ◽  
Vol 960 ◽  
Author(s):  
Koji Sato ◽  
Chiemi Ishiyama ◽  
Masato Sone ◽  
Yakichi Higo
Keyword(s):  
Thin Films ◽  
Amorphous Alloy ◽  
Crystallographic Orientation ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Orientation Relationships ◽  
Beam Direction ◽  
Precipitation Distribution ◽  
P Content

ABSTRACTWe studied the effects of phosphorus (P) on Ni nanocrystalline morphology formed by focused ion beam (FIB) irradiation for Ni-P amorphous alloy thin films. The P content in the amorphous alloy was varied from 8 to 12 wt.%. The nanocrystals induced by the FIB irradiation for Ni-11.8, 8.9, 7.9 wt.% amorphous alloy had an f.c.c. structure and showed unique crystallographic orientation relationships to the geometry of the focused ion beam, that is, {111}f.c.c. parallel to the irradiated plane and <110>f.c.c. parallel to the projected ion beam direction, respectively. The Ni nanocrystals precipitated like aggregates with decreasing of the P content. These results represent that the P content does not affect crystallographic orientation relationships, while influences the precipitation distribution of Ni nanocrystals generated by the FIB irradiation.

scholarly journals Low-temperature rheology of calcite

2019 ◽  
Vol 221 (1) ◽  
pp. 129-141 ◽  
Author(s):  
Michael K Sly ◽  
Arashdeep S Thind ◽  
Rohan Mishra ◽  
Katharine M Flores ◽  
Philip Skemer
Keyword(s):  
Low Temperature ◽  
Yield Stress ◽  
Low Temperatures ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Polycrystalline Sample ◽  
Small Scale ◽  
Indentation Hardness ◽  
Micropillar Compression ◽  
Flow Laws

SUMMARY Low-temperature plastic rheology of calcite plays a significant role in the dynamics of Earth's crust. However, it is technically challenging to study plastic rheology at low temperatures because of the high confining pressures required to inhibit fracturing. Micromechanical tests, such as nanoindentation and micropillar compression, can provide insight into plastic rheology under these conditions because, due to the small scale, plastic deformation can be achieved at low temperatures without the need for secondary confinement. In this study, nanoindentation and micropillar compression experiments were performed on oriented grains within a polycrystalline sample of Carrara marble at temperatures ranging from 23 to 175 °C, using a nanoindenter. Indentation hardness is acquired directly from nanoindentation experiments. These data are then used to calculate yield stress as a function of temperature using numerical approaches that model the stress state under the indenter. Indentation data are complemented by uniaxial micropillar compression experiments. Cylindrical micropillars ∼1 and ∼3 μm in diameter were fabricated using a focused ion beam-based micromachining technique. Yield stress in micropillar experiments is determined directly from the applied load and micropillar dimensions. Mechanical data are fit to constitutive flow laws for low-temperature plasticity and compared to extrapolations of similar flow laws from high-temperature experiments. This study also considered the effects of crystallographic orientation on yield stress in calcite. Although there is a clear orientation dependence to plastic yielding, this effect is relatively small in comparison to the influence of temperature.

In-situ observation of cooperative grain boundary sliding and migration in the nano-twinned nanocrystalline-Au thin-films

2020 ◽  
Vol 180 ◽  
pp. 97-102 ◽  
Author(s):  
Qizhen Li ◽  
Lihua Wang ◽  
Jiao Teng ◽  
Xiaolu Pang ◽  
Xiaodong Han ◽  
...  
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Grain Boundary Sliding ◽  
In Situ Observation ◽  
Boundary Sliding ◽  
Au Thin Films ◽  
And Migration

Microstructural aspects of fracture in nanolayered TiAlCrN thin films

2003 ◽  
Vol 795 ◽  
Author(s):  
A. E. Santana ◽  
A. Karimi ◽  
V. H. Derflinger ◽  
A. Schütze
Keyword(s):  
Thin Films ◽  
Grain Boundary Sliding ◽  
Enhancement Effect ◽  
Bilayer Thickness ◽  
Structural Modifications ◽  
Bilayer Films ◽  
High Resolution Tem ◽  
Boundary Sliding ◽  
And Control ◽  
Cathodic Arc

ABSTRACTThis paper studies the effects of bilayer thickness and chromium content on the microstructure and mechanical properties of nanolayered TiAlN/CrN thin films. By rotation of samples holder and control of targets activity, a variety of multilayers and chemically modulated thin films were grown on WC-Co substrates using cathodic arc PVD. Conventional and high resolution TEM showed that aluminum contributes to refinement of structure while chromium favors the formation of coarse columnar morphology. Consequently, TiAlN layers periodically interrupt the formation of columns in CrN layers in multilayer films, while in chemically modulated samples the columns are not interrupted leading thus to the formation of strongly columnar films. Both Cr content and bilayer thickness contribute to hardness enhancement. Effect of Cr arises from the formation of hard fcc-(CrAl)N phase to the detriment of softer wurtzite-like hcp-AlN. The contribution of bilayer thickness is explained by the grain refinement based on Hall-Petch effect and the formation of highly stressed columnar structures with (111) preferred orientation. Such structural modifications strongly influence crack modes and morphologies as observed using AFM and FIB cross-section of indents. Thin bilayer films exhibit well-organized straight cracks parallel to the contact edge between indenter and film, while large bilayer films show a network of discontinuous irregular mud cracks attributed to grain boundary sliding. Refinement of structure favours crack meandering and branching that prevents the propagation of large cracks with more dramatic effects.

Focused Ion-Beam (FIB) Nanomachining of Silicon Carbide (SiC) Stencil Masks for Nanoscale Patterning

2012 ◽  
Vol 717-720 ◽  
pp. 889-892 ◽  
Author(s):  
Hamidreza Zamani ◽  
Seung Wan Lee ◽  
Amir Avishai ◽  
Christian A. Zorman ◽  
R. Mohan Sankaran ◽  
...  
Keyword(s):  
Thin Films ◽  
Silicon Carbide ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
High Quality ◽  
Nanoscale Patterning ◽  
Different Types ◽  
Thin Membranes ◽  
Amorphous Sic ◽  
Nanoscale Features

We report on experimental explorations of using focused ion beam (FIB) nanomachining of different types of silicon carbide (SiC) thin membranes, for making robust, high-quality stencil masks for new emerging options of nanoscale patterning. Using thin films and membranes in polycrystalline SiC (poly-SiC), 3C-SiC, and amorphous SiC (a-SiC) with thicknesses in the range of t~250nm−1.6μm, we have prototyped a series of stencil masks, with nanoscale features routinely down to ~100nm.

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