Improving Failure Analysis for Cell-Internal Defects through Cell-Aware Technology

2013 ◽  
Author(s):  
F. Hapke ◽  
M. Keim ◽  
T. Herrmann ◽  
T. Heidel ◽  
M. Reese ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Hot Spot ◽  
New Method ◽  
Internal Defects ◽  
Test Chip ◽  
New Approach ◽  
Electrical Failure ◽  
Diagnosis Method ◽  
A Cell ◽  
Standard Library

Abstract This paper describes a new approach for quickly ramping up the yield for new CMOS technologies by performing a cell-internal (CI) diagnosis based on the cell-aware (CA) methodology. We present results from carrying out this new method on a test chip of a 28-nm technology. After creating defect-oriented CA test patterns for this test chip, we tested various wafers with those CA patterns, selected fail data, conducted a normal electrical failure analysis, and used the new CI diagnosis method to guide the physical failure analysis (PFA) process to look specifically for hot-spot areas within standard library cells. This new approach can reduce the yield ramp-up time significantly.

scholarly journals A Novel Fault Diagnosis Method for High-Temperature Superconducting Field Coil of Superconducting Rotating Machine

2019 ◽  
Vol 10 (1) ◽  
pp. 223 ◽  
Author(s):  
Seunghyun Song ◽  
Tae Kuk Ko ◽  
Yojong Choi ◽  
SangGap Lee
Keyword(s):  
High Temperature ◽  
Magnetic Energy ◽  
Hot Spot ◽  
Rotating Machinery ◽  
New Method ◽  
Voltage Measurement ◽  
Normal Zone ◽  
Rotating Machine ◽  
Fast Fourier Transform Analysis ◽  
Diagnosis Method

In this paper, a new method is presented for sensitive quench detection in high-temperature superconductor (HTS) rotating machinery. The normal zone propagation velocity of an HTS is about 1000 times slower than that of a low-temperature superconductor. Therefore, the propagation of normal zone resistance, which occurs when the HTS transits from the superconducting state to the normal state, is also slower. Thus, it is difficult to detect the abnormal signals by voltage measurement using voltage taps. Moreover, the monitoring signal includes noise generated by interaction between the HTS rotating machinery and the industrial environment. Therefore, when quenching occurs in the HTS rotating machinery, a thermal runaway occurs in the hot spot. Furthermore, the magnetic energy stored in the HTS coil can damage the machinery. For these reasons, a new method is proposed for sensitive quench detection that reduces the noise generated from the power supply and from the HTS rotating machinery, using both an RLC resonance circuit and fast Fourier transform analysis.

An Advanced Reliability Improvement and Failure Analysis Approach to Thermal Stress Issues in IC Packages

2009 ◽  
Author(s):  
Michael Hertl ◽  
Diane Weidmann ◽  
Alex Ngai
Keyword(s):  
Thermal Stress ◽  
Failure Analysis ◽  
Deformation Measurement ◽  
Stress Conditions ◽  
Analysis Approach ◽  
New Approach ◽  
Reliability Improvement

Abstract A new approach to reliability improvement and failure analysis on ICs is introduced, involving a specifically developed tool for Topography and Deformation Measurement (TDM) under thermal stress conditions. Applications are presented including delamination risk or bad solderability assessment on BGAs during JEDEC type reflow cycles.

Detection and Characterization of an Electrical Failure Induced during Laser Ablation of Packages

2008 ◽  
Author(s):  
P. Schwindenhammer ◽  
H. Murray ◽  
P. Descamps ◽  
P. Poirier
Keyword(s):  
Laser Ablation ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
Ablation Process ◽  
Thermally Induced ◽  
Electrical Failure ◽  
Electrical Phenomenon ◽  
Semiconductor Packages ◽  
Complex Semiconductor

Abstract Decapsulation of complex semiconductor packages for failure analysis is enhanced by laser ablation. If lasers are potentially dangerous for Integrated Circuits (IC) surface they also generate a thermal elevation of the package during the ablation process. During measurement of this temperature it was observed another and unexpected electrical phenomenon in the IC induced by laser. It is demonstrated that this new phenomenon is not thermally induced and occurs under certain ablation conditions.

Localization Techniques on a 0.15um CMOS Device: Charge Pump Failure Analysis

2002 ◽  
Author(s):  
Hui Pan ◽  
Thomas Gibson
Keyword(s):  
Failure Analysis ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Electrical Characterization ◽  
Charge Pump ◽  
Front Side ◽  
Pump Failure ◽  
Electrical Failure ◽  
Optical Proximity Correction ◽  
A Charge

Abstract In recent years, there have been many advances in the equipment and techniques used to isolate faults. There are many options available to the failure analyst. The available techniques fall into the categories of electrical, photonic, thermal and electron/ion beam [1]. Each technique has its advantages and its limitations. In this paper, we introduce a case of successful failure analysis using a combination of several fault localization techniques on a 0.15um CMOS device with seven layers of metal. It includes electrical failure mode characterization, front side photoemission, backside photoemission, Focused Ion Beam (FIB), Scanning Electron Microscope (SEM) and liquid crystal. Electrical characterization along with backside photoemission proved most useful in this case as a poly short problem was found to be causing a charge pump failure. A specific type of layout, often referred to as a hammerhead layout, and the use of Optical Proximity Correction (OPC) contributed to the poly level shorts.

A New Approach for the Analysis of Mixture Toxicity Data

1992 ◽  
Vol 26 (9-11) ◽  
pp. 2345-2348 ◽  
Author(s):  
C. N. Haas
Keyword(s):  
Quantitative Analysis ◽  
Mixture Toxicity ◽  
New Method ◽  
Metal Exposure ◽  
Positive Interactions ◽  
Toxicity Data ◽  
Data Set ◽  
New Approach ◽  
Negative Interactions

A new method for the quantitative analysis of multiple toxicity data is described and illustrated using a data set on metal exposure to copepods. Positive interactions are observed for Ni-Pb and Pb-Cr, with weak negative interactions observed for Ni-Cr.

scholarly journals New Method for Generating New Families of Distributions

Symmetry ◽  
2021 ◽  
Vol 13 (4) ◽  
pp. 726
Author(s):  
Lamya A. Baharith ◽  
Wedad H. Aljuhani
Keyword(s):  
Exponential Distribution ◽  
Real Data ◽  
Rate Function ◽  
New Method ◽  
Likelihood Method ◽  
Alpha Power ◽  
Unknown Parameters ◽  
Failure Rate Function ◽  
New Approach ◽  
Numerical Studies

This article presents a new method for generating distributions. This method combines two techniques—the transformed—transformer and alpha power transformation approaches—allowing for tremendous flexibility in the resulting distributions. The new approach is applied to introduce the alpha power Weibull—exponential distribution. The density of this distribution can take asymmetric and near-symmetric shapes. Various asymmetric shapes, such as decreasing, increasing, L-shaped, near-symmetrical, and right-skewed shapes, are observed for the related failure rate function, making it more tractable for many modeling applications. Some significant mathematical features of the suggested distribution are determined. Estimates of the unknown parameters of the proposed distribution are obtained using the maximum likelihood method. Furthermore, some numerical studies were carried out, in order to evaluate the estimation performance. Three practical datasets are considered to analyze the usefulness and flexibility of the introduced distribution. The proposed alpha power Weibull–exponential distribution can outperform other well-known distributions, showing its great adaptability in the context of real data analysis.

New Approach of Laser-SQUID Microscopy to LSI Failure Analysis

2009 ◽  
Vol E92-C (3) ◽  
pp. 327-333 ◽  
Author(s):  
Kiyoshi NIKAWA ◽  
Shouji INOUE ◽  
Tatsuoki NAGAISHI ◽  
Toru MATSUMOTO ◽  
Katsuyoshi MIURA ◽  
...  
Keyword(s):  
Failure Analysis ◽  
New Approach

Comparison of New Telescopic Video Microlaryngoscopic and Standard Microlaryngoscopic Techniques

1992 ◽  
Vol 101 (1) ◽  
pp. 51-60 ◽  
Author(s):  
Eiji Yanagisawa ◽  
Ken Yanagisawa ◽  
Jay B. Horowitz ◽  
Lawrence J. Mambrino
Keyword(s):  
Video Camera ◽  
New Method ◽  
Depth Of Field ◽  
Microscopic Technique ◽  
New Approach ◽  
Advantages And Disadvantages ◽  
Laryngeal Surgery ◽  
Valuable Method ◽  
Microlaryngeal Surgery ◽  
Television Image

A new approach to microlaryngeal surgery using a specially designed video microlaryngoscope with a rigid endoscopic telescope and an attached video camera was introduced by Kantor et al in 1990. The ability to video document and perform surgery of the larynx by viewing a high-resolution television image was demonstrated. This method was recommended over the standard microscopic technique for increased visibility with greater depth of field, unimpeded instrument access, instant documentation, and superior teaching value. The authors tried this new method and the standard microscopic technique at the same sitting on a series of patients. This paper will compare these two different techniques and discuss their advantages and disadvantages. Although the new method has many advantages, the standard microscopic technique remains as a valuable method in laryngeal surgery.

Inferring age from otolith measurements: a review and a new approach

2004 ◽  
Vol 61 (7) ◽  
pp. 1269-1284 ◽  
Author(s):  
RIC Chris Francis ◽  
Steven E Campana
Keyword(s):  
Simulation Experiment ◽  
Cost Benefit Analysis ◽  
Cost Benefit ◽  
New Method ◽  
Population Parameters ◽  
Benefit Analysis ◽  
Mixture Analysis ◽  
New Approach ◽  
Individual Fish ◽  
The Cost

In 1985, Boehlert (Fish. Bull. 83: 103–117) suggested that fish age could be estimated from otolith measurements. Since that time, a number of inferential techniques have been proposed and tested in a range of species. A review of these techniques shows that all are subject to at least one of four types of bias. In addition, they all focus on assigning ages to individual fish, whereas the estimation of population parameters (particularly proportions at age) is usually the goal. We propose a new flexible method of inference based on mixture analysis, which avoids these biases and makes better use of the data. We argue that the most appropriate technique for evaluating the performance of these methods is a cost–benefit analysis that compares the cost of the estimated ages with that of the traditional annulus count method. A simulation experiment is used to illustrate both the new method and the cost–benefit analysis.

SRAM Bitcell Defect Identification Methodology Using Electrical Failure Analysis Data

2020 ◽  
Author(s):  
Hyungtae Kim ◽  
Geonho Kim ◽  
Yunrong Li ◽  
Jinyong Jeong ◽  
Youngdae Kim
Keyword(s):  
Failure Analysis ◽  
Technology Development ◽  
New Technology ◽  
Random Access ◽  
Analysis Data ◽  
Test Method ◽  
Design For Test ◽  
Defect Identification ◽  
Electrical Failure ◽  
Efficient Test

Abstract Static Random Access Memory (SRAM) has long been used for a new technology development vehicle because it is sensitive to process defects due to its high density and minimum feature size. In addition, failure location can be accurately predicted because of the highly structured architecture. Thus, fast and accurate Failure Analysis (FA) of the SRAM failure is crucial for the success of new technology learning and development. It is often quite time consuming to identify defects through conventional physical failure analysis techniques. In this paper, we present an advanced defect identification methodology for SRAM bitcell failures with fast speed and high accuracy based on the bitcell transistor analog characteristics from special design for test (DFT) features, Direct Bitcell Access (DBA). This technique has the advantage to shorten FA throughput time due to a time efficient test method and an intuitive failure analysis method based on Electrical Failure Analysis (EFA) without destructive analysis. In addition, all the defects in a wafer can be analyzed and improved simultaneously utilizing the proposed defect identification methodology. Some successful case studies are also discussed to demonstrate the efficiency of the proposed defect identification methodology.

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