A Novel High-Q Dual Mass MEMS Tuning Fork Gyroscope Based On 3D Wafer-Level Packaging

Tuning fork gyroscopes (TFGs) are promising for potential high-precision applications. This work proposes and experimentally demonstrates a novel high-Q dual mass tuning fork microelectro-mechanical system (MEMS) gyroscope utilizing three-dimensional (3D) packaging techniques. Except for two symmetrically-decoupled proof masses (PM) with synchronization structures, a symmetrically-decoupled lever structure is designed to force the antiparallel, antiphase drive-mode motion and basically eliminate the low-frequency spurious modes. The thermoelastic damping (TED) and anchor loss are greatly reduced by the linearly-coupled, momentum- and torque-balanced antiphase sense mode. Besides, a novel 3D packaging technique is used to realize high Q-factors. A composite substrate encapsulation cap, fabricated by through-silicon-via (TSV) and glass-in-silicon (GIS) reflow processes, is anodically bonded to the sensing structures at wafer scales. A self-developed control circuit is adopted to realize loop control and characterize gyro-scope performances. It is shown that a high-reliability electrical connection together with a high-air-impermeability package can be fulfilled with this 3D packaging technique. Furthermore, the Q-factors of the drive and sense modes reach up to 51947 and 49249, respectively. This TFG realizes a wide measurement range of ±1800° /s and a high resolution of 0.1° /s with a scale-factor nonlinearity 720 ppm after automatic mode-matching. Besides, the long-term zero-rate output (ZRO) drift can be effectively suppressed by temperature compensation, inducing a small angle random walk (ARW) of 0.923°/√h and a low bias instability (BI) of 9.270°/h.

Download Full-text

A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging

Sensors ◽

10.3390/s21196428 ◽

2021 ◽

Vol 21 (19) ◽

pp. 6428

Author(s):

Pengfei Xu ◽

Chaowei Si ◽

Yurong He ◽

Zhenyu Wei ◽

Lu Jia ◽

...

Keyword(s):

Tuning Fork ◽

High Reliability ◽

Three Dimensional ◽

Low Frequency ◽

Wafer Level ◽

Loop Control ◽

High Q ◽

3D Packaging ◽

Q Factors ◽

Packaging Technique

Tuning fork gyroscopes (TFGs) are promising for potential high-precision applications. This work proposes and experimentally demonstrates a novel high-Q dual-mass tuning fork microelectromechanical system (MEMS) gyroscope utilizing three-dimensional (3D) packaging techniques. Except for two symmetrically decoupled proof masses (PM) with synchronization structures, a symmetrically decoupled lever structure is designed to force the antiparallel, antiphase drive mode motion and eliminate low frequency spurious modes. Thermoelastic damping (TED) and anchor loss are greatly reduced by the linearly coupled, momentum- and torque-balanced antiphase sense mode. Moreover, a novel 3D packaging technique is used to realize high Q-factors. A composite substrate encapsulation cap, fabricated by through-silicon-via (TSV) and glass-in-silicon (GIS) reflow processes, is anodically bonded to the wafer-scale sensing structures. A self-developed control circuit is adopted to realize loop control and characterize gyroscope performances. It is shown that a high-reliability electrical connection, together with a high air impermeability package, can be fulfilled with this 3D packaging technique. Furthermore, the Q-factors of the drive and sense modes reach up to 51,947 and 49,249, respectively. This TFG realizes a wide measurement range of ±1800 °/s and a high resolution of 0.1°/s with a scale factor nonlinearity of 720 ppm after automatic mode matching. In addition, long-term zero-rate output (ZRO) drift can be effectively suppressed by temperature compensation, inducing a small angle random walk (ARW) of 0.923°/√h and a low bias instability (BI) of 9.270°/h.

Download Full-text

Wafer Level Assembly Technique Development for Fine Pitch Flip Chip 3D Die-to-Wafer Integration

International Symposium on Microelectronics ◽

10.4071/isom-2010-wp1-paper3 ◽

2010 ◽

Vol 2010 (1) ◽

pp. 000548-000553

Author(s):

Zhaozhi Li ◽

Brian J. Lewis ◽

Paul N. Houston ◽

Daniel F. Baldwin ◽

Eugene A. Stout ◽

...

Keyword(s):

Flip Chip ◽

Low Cost ◽

Three Dimensional ◽

Cost Effective ◽

Market Demand ◽

Wafer Level ◽

Packaging Technology ◽

Fine Pitch ◽

3D Packaging ◽

Assembly Technique

Three Dimensional (3D) Packaging has become an industry obsession as the market demand continues to grow toward higher packaging densities and smaller form factor. In the meanwhile, the 3D die-to-wafer (D2W) packaging structure is gaining popularity due to its high manufacturing throughput and low cost per package. In this paper, the development of the assembly process for a 3D die-to-wafer packaging technology, that leverages the wafer level assembly technique and flip chip process, is introduced. Research efforts were focused on the high-density flip chip wafer level assembly techniques, as well as the challenges, innovations and solutions associated with this type of 3D packaging technology. Processing challenges and innovations addressed include flip chip fluxing methods for very fine-pitch and small bump sizes; wafer level flip chip assembly program creation and yield improvements; and set up of the Pb-free reflow profile for the assembled wafer. 100% yield was achieved on the test vehicle wafer that has totally 1,876 flip chip dies assembled on it. This work has demonstrated that the flip chip 3D die-to-wafer packaging architecture can be processed with robust yield and high manufacturing throughput, and thus to be a cost effective, rapid time to market alternative to emerging 3D wafer level integration methodologies.

Download Full-text

3D & System-in-Package Development with the Redistributed Chip Package (RCP)

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2012dpc-tha23 ◽

2012 ◽

Vol 2012 (DPC) ◽

pp. 002374-002398

Author(s):

Zhiwei (Tony) Gong ◽

Scott Hayes ◽

Navjot Chhabra ◽

Trung Duong ◽

Doug Mitchell ◽

...

Keyword(s):

Three Dimensional ◽

Wafer Level ◽

Wafer Level Packaging ◽

Systems On Chip ◽

3D Packaging ◽

Packaging Space ◽

Advanced Packaging ◽

On Chip ◽

Imaging Sensors ◽

3D Applications

Fan-out wafer level packaging (FO-WLP) has become prevalent in past two years as a package option with large number of pin count. As the result of early development, the single die packages with single-sided redistribution has reached the maturity to take off. While the early applications start to pay back the investment on the technology, the developments have shifted to more advanced packaging solutions with System-in-Package (SiP) and 3D applications. The nature of the FO-WLP interconnect along with the material compatibility and process capability of the Redistributed Chip Package (RCP) have enabled Freescale to create novel System-in-Package (SiP) solutions not possible in more traditional packaging technologies or Systems-on-Chip. Simple SiPs using two dimensional (2D), multi-die RCP solutions have resulted in significant package size reduction and improved system performance through shortened traces when compared to discretely packaged die or a substrate based multi-chip module (MCM). More complex three dimensional (3D) SiP solutions allow for even greater volumetric efficiency of the packaging space. 3D RCP is a flexible approach to 3D packaging with complexity ranging from Package-on-Package (PoP) type solutions to systems including ten or more multi-sourced die with associated peripheral components. Perhaps the most significant SiP capability of the RCP technology is the opportunity for heterogeneous integration. The combination of various system elements including, but not limited to SMDs, CMOS, GaAs, MEMS, imaging sensors or IPDs gives system designers the capability to generate novel systems and solutions which can then enable new products for customers. The following paper further discusses SiP advantages, applications and examples created with the RCP technology. Rozalia/Ron ok move from 2.5/3D to Passive 1-4-12.

Download Full-text

A novel tuning fork gyroscope with high Q-factors working at atmospheric pressure

Microsystem Technologies ◽

10.1007/s00542-004-0438-8 ◽

2005 ◽

Vol 11 (2-3) ◽

pp. 111-116 ◽

Cited By ~ 18

Author(s):

Y. Chen ◽

J. Jiao ◽

B. Xiong ◽

L. Che ◽

X. Li ◽

...

Keyword(s):

Atmospheric Pressure ◽

Tuning Fork ◽

High Q ◽

Q Factors

Download Full-text

Assembly Process Development for Fine Pitch Flip Chip Silicon-to-Silicon 3D Wafer Level Integration with No Flow Underfill

Journal of Microelectronics and Electronic Packaging ◽

10.4071/imaps.262 ◽

2010 ◽

Vol 7 (3) ◽

pp. 146-151 ◽

Cited By ~ 2

Author(s):

Zhaozhi Li ◽

Sangil Lee ◽

Brian J. Lewis ◽

Paul N. Houston ◽

Daniel F. Baldwin ◽

...

Keyword(s):

High Performance ◽

Flip Chip ◽

Process Development ◽

Low Cost ◽

Three Dimensional ◽

Process Time ◽

Wafer Level ◽

Fine Pitch ◽

3D Packaging ◽

Small Form Factor

The industry has witnessed the adoption of the flip chip for its low cost, small form factor, high performance, and great I/O flexibility. As three-dimensional (3D) packaging technology moves to the forefront, the flip chip to wafer integration, which is also a silicon-to-silicon assembly, is gaining more and more popularity. No flow underfill is of special interest for the wafer level flip chip assembly, as it can dramatically reduce the process time and the cost per package, due to the reduction in the number of process steps as well as the dispenser and cure oven that would otherwise be necessary for the standard capillary underfill process. This paper introduces the development of a no flow underfill process for a sub-100 micron pitch flip chip to CSP wafer level assembly. Challenges addressed include the no flow underfill reflow profile study, underfill dispense amount study, chip floating control, underfill voiding reduction, and yield improvement. Also, different no flow underfill candidates were investigated to determine the best performing processing material.

Download Full-text

Accuracy and Reproducibility of Facial Measurements of Digital Photographs and Wrapped Cone Beam Computed Tomography (CBCT) Photographs

Diagnostics ◽

10.3390/diagnostics11050757 ◽

2021 ◽

Vol 11 (5) ◽

pp. 757

Author(s):

Maged Sultan Alhammadi ◽

Abeer Abdulkareem Al-mashraqi ◽

Rayid Hussain Alnami ◽

Nawaf Mohammad Ashqar ◽

Omar Hassan Alamir ◽

...

Keyword(s):

Computed Tomography ◽

Soft Tissue ◽

Cone Beam Computed Tomography ◽

High Reliability ◽

Three Dimensional ◽

Cone Beam ◽

Cross Sectional ◽

Facial Profile ◽

Digital Photographs ◽

Gonial Angle

The study sought to assess whether the soft tissue facial profile measurements of direct Cone Beam Computed Tomography (CBCT) and wrapped CBCT images of non-standardized facial photographs are accurate compared to the standardized digital photographs. In this cross-sectional study, 60 patients with an age range of 18–30 years, who were indicated for CBCT, were enrolled. Two facial photographs were taken per patient: standardized and random (non-standardized). The non-standardized ones were wrapped with the CBCT images. The most used soft tissue facial profile landmarks/parameters (linear and angular) were measured on direct soft tissue three-dimensional (3D) images and on the photographs wrapped over the 3D-CBCT images, and then compared to the standardized photographs. The reliability analysis was performed using concordance correlation coefficients (CCC) and depicted graphically using Bland–Altman plots. Most of the linear and angular measurements showed high reliability (0.91 to 0.998). Nevertheless, four soft tissue measurements were unreliable; namely, posterior gonial angle (0.085 and 0.11 for wrapped and direct CBCT soft tissue, respectively), mandibular plane angle (0.006 and 0.0016 for wrapped and direct CBCT soft tissue, respectively), posterior facial height (0.63 and 0.62 for wrapped and direct CBCT soft tissue, respectively) and total soft tissue facial convexity (0.52 for both wrapped and direct CBCT soft tissue, respectively). The soft tissue facial profile measurements from either the direct 3D-CBCT images or the wrapped CBCT images of non-standardized frontal photographs were accurate, and can be used to analyze most of the soft tissue facial profile measurements.

Download Full-text

Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging

Micromachines ◽

10.3390/mi12030295 ◽

2021 ◽

Vol 12 (3) ◽

pp. 295

Author(s):

Pao-Hsiung Wang ◽

Yu-Wei Huang ◽

Kuo-Ning Chiang

Keyword(s):

Finite Element ◽

Thermal Cycling ◽

Glass Substrate ◽

High Speed ◽

Coefficient Of Thermal Expansion ◽

Three Dimensional ◽

Design Parameters ◽

Time To Failure ◽

Wafer Level ◽

Fine Pitch

The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent characteristics, glass is a good material for high-speed transmission applications. Therefore, this study proposes a fan-out wafer-level packaging (FO-WLP) with glass substrate-type PoP. The reliability life of the proposed FO-WLP was evaluated under thermal cycling conditions through finite element simulations and empirical calculations. Considering the simulation processing time and consistency with the experimentally obtained mean time to failure (MTTF) of the packaging, both two- and three-dimensional finite element models were developed with appropriate mechanical theories, and were verified to have similar MTTFs. Next, the FO-WLP structure was optimized by simulating various design parameters. The coefficient of thermal expansion of the glass substrate exerted the strongest effect on the reliability life under thermal cycling loading. In addition, the upper and lower pad thicknesses and the buffer layer thickness significantly affected the reliability life of both the FO-WLP and the FO-WLP-type PoP.

Download Full-text

Posturography with head movements in the assessment of balance in chronic unilateral vestibular lesions

Scientific Reports ◽

10.1038/s41598-021-85745-x ◽

2021 ◽

Vol 11 (1) ◽

Author(s):

Magdalena Janc ◽

Mariola Sliwinska-Kowalska ◽

Piotr Politanski ◽

Marek Kaminski ◽

Magdalena Jozefowicz-Korczynska ◽

...

Keyword(s):

High Reliability ◽

Low Frequency ◽

Random Order ◽

Head Movements ◽

Canal Paresis ◽

Eyes Closed ◽

Static Posturography ◽

Unstable Surface ◽

Novel Method ◽

The One

AbstractThe aim of our study was to validate the method of head-shake static posturography (HS-posturography) in healthy individuals and to establish the value of this novel method in the diagnostics of patients with unilateral vestibular lesion (UV). The study included 202 participants divided into two groups, one consisting of 133 patients with canal paresis CP > 19% and one of 69 healthy subjects. Participant was tested according to the standard protocol of static posturography (SP), and with head movements of 0.3 Hz (HS 40), 0.6 Hz (HS 70) in random order controlled by a metronome. HS-posturography revealed a similar repeatability and internal consistency as the standard posturography. In patients with UV, 4th condition revealed higher sensitivity (74%) and specificity (71%) in HS 40 than in the standard posturography (67%, 65% respectively) and HS 70 (54%, 70% respectively). Static posturography and HS- posturography revealed a high reliability of the testing method. The head movements added to static posturography improve the sensitivity and specificity of the method in group with vestibular impairment. The most important test for that purpose seems to be the one on unstable surface with the eyes closed, with low frequency of head movements.

Download Full-text

Evolution of a narrow-band spectrum of random surface gravity waves

Journal of Fluid Mechanics ◽

10.1017/s0022112002002616 ◽

2003 ◽

Vol 478 ◽

pp. 1-10 ◽

Cited By ~ 83

Author(s):

KRISTIAN B. DYSTHE ◽

KARSTEN TRULSEN ◽

HARALD E. KROGSTAD ◽

HERVÉ SOCQUET-JUGLARD

Keyword(s):

Three Dimensional ◽

Low Frequency ◽

Three Dimensions ◽

Band Spectrum ◽

Nls Equation ◽

Random Surface ◽

Narrow Bandwidth ◽

Quasi Stationary State ◽

The Stability ◽

Three Dimensional Simulations

Numerical simulations of the evolution of gravity wave spectra of fairly narrow bandwidth have been performed both for two and three dimensions. Simulations using the nonlinear Schrödinger (NLS) equation approximately verify the stability criteria of Alber (1978) in the two-dimensional but not in the three-dimensional case. Using a modified NLS equation (Trulsen et al. 2000) the spectra ‘relax’ towards a quasi-stationary state on a timescale (ε2ω0)−1. In this state the low-frequency face is steepened and the spectral peak is downshifted. The three-dimensional simulations show a power-law behaviour ω−4 on the high-frequency side of the (angularly integrated) spectrum.

Download Full-text