scholarly journals Drain-Engineered Reconfigurable Transistor Exhibiting Complementary Operation

Author(s):  
M Ehteshamuddin ◽  
Hend I Alkhammash ◽  
Sajad A Loan

Abstract In this paper, we propose and simulate a multifunctional transistor that exhibits device reconfigurability and realizes both nFET and pFET electrical characteristics when adequately biased. The use of this device will significantly reduce the transistor count in realizing sequential and combinational circuits and will result in highly compact design. The device uses a dual fin structure having a single mid-gap workfunction gate (∼4.65 eV) alongside dual metal (metal-silicide) drain regions. It employs n + / p + - i junctions at the source-channel interface along with the Schottky junctions at the channel-drain interface. In practice, metal-silicides such as erbium/ytterbium silicide (ErSi x /YbSi x ) for the n -drain and platinum silicide (PtSi) for the p -drain can be used as they provide smallest electron and hole Schottkybarrier heights (SBHs). Simulations carried out using calibrated parameters show better drive current (≈ 10 −2 −10 −3 A/ µ m) compared to the quantum tunneling current in simulated stateof-the-art multifunctional devices (≈ 10 −4 − 10 −5 A/ µ m). In addition, butterfly curves show symmetric high (NM H ) and low (NM L ) noise margins of 0.43V and 0.29V for zero and finite SBHs, respectively. The switching characteristics is shown to have an overshoot of ∼0.15 V for realistic SBHs which is then eliminated for the case of zero SBHs. In the last section, it is also demonstrated that a simplified structure having single mid-gap workfunction (∼4.65 eV) drain of Nickel silicide (NiSi) does not hamper the reconfigurability of the device. Index Terms —MOSFET, Multifunctional circuit, CMOS,
Schottky junction.

2018 ◽  
Vol 54 (16) ◽  
pp. 2044-2047 ◽  
Author(s):  
Fang Cui ◽  
Jiajia Zhang ◽  
Qing Shao ◽  
Linxu Xu ◽  
Xinzi Pan ◽  
...  

Despite numerous reports on noble metal/metal oxide composites, the control of the exposed facet is still a great challenge. Here, the large-scale synthesis of noble metal/metal oxide spheres with controlled facets is enabled by making use of a bottom-up self-assembly strategy.


2012 ◽  
Vol 195 ◽  
pp. 37-41
Author(s):  
Tan Yong Siang ◽  
Seah Boon Meng ◽  
Leong Lup San ◽  
Liu Huang ◽  
Zainab Ismail ◽  
...  

The salicide (self-aligned silicide) technology involves selective wet etching step of non-reacted metal with respect to metal silicides. It was introduced in MOSFET fabrication due to the increase of the source, drain and gate resistances with the reduction of device dimensions. The introduction of a low resistive silicide layer on these areas has become mandatory to meet device specifications. NiSi has been widely considered for sub-65nm technology nodes due to its low resistivity, low silicon consumption and low formation temperature [1-2]. The two step annealing sequence is common in the industry for nickel silicide application to control the reverse linewidth effect. However, since Ni is the diffusing element in the NiSi reaction, a first high temperature rapid thermal anneal (RTA) will inadvertently result in Ni lateral diffusion under the spacer towards the gate causing electrical shorts. Indeed, a first low temperature anneal could seriously limit the nickel lateral diffusion and prevent this phenomenon. Minimizing thermal budget by means of reducing the temperature has also been proven to lower junction leakage current [3].


2020 ◽  
Author(s):  
Y. Nakao

AbstractThe background and principles of dual metal/metal catalysis are briefly introduced in this section, with a particular focus on novel C–C bond-forming cross-coupling-type reactions. By taking advantage of synergistic dual metal/metal catalysis, these transformations have provided the synthetic and organometallic communities with new ideas to design challenging transformations that are difficult to catalyze using a conventional, single metal catalyst.


Author(s):  
C. Hayzelden ◽  
J.L. Batstonc

Metal silicides in thin films play an essential role in the increasingly fine-scale fabrication of integrated circuits. Although commonly produced by interfacial reaction between metal films and silicon, buried metal silicides have recently been produced in crystalline Si by ion-implantation. Cammarata et al., have reported the use of ion-implantation to form buried nickel silicide precipitates in amorphous Si thin films, in which the first (and only) phase to form was NiSi2. The kinetics of the nucleation and growth of NiSi2 precipitates were investigated and an enhancement of the crystallization kinetics of the amorphous Si, apparently due to the migration of silicide precipitates, was found. In this paper, we describe the results of an in-situ transmission electron microscopy (TEM) and high resolution electron microscopy (HREM) investigation of the silicide-mediated crystallization of amorphous Si.


2007 ◽  
Vol 995 ◽  
Author(s):  
Rinus Tek Po Lee ◽  
Kian-Ming Tan ◽  
Tsung-Yang Liow ◽  
Andy Eu-Jin Lim ◽  
Guo-Qiang Lo ◽  
...  

AbstractWe investigated the material and electrical characteristics of platinum and ytterbium silicides for potential applications as metallic Schottky-barrier source/drain (S/D) and fully-silicided (FUSI) gate electrodes in fin field-effect transistors (FinFETs). Due to the low electro-negativity parameter of ytterbium, a low temperature silicidation process was developed to avoid the reaction of ytterbium with the isolation regions (i.e. SiO2 and SiN) to integrate ytterbium silicide successfully in mesa-isolated n-FinFETs. The integration of FUSI metal gate into p-FinFETs was also explored in this work and a novel two-step silicidation process that integrates simultaneously two different phases of platinum silicide with the appropriate work function values for gate electrode and source/drain application was demonstrated.


2012 ◽  
Vol 100 (11) ◽  
pp. 112901 ◽  
Author(s):  
Debashis Panda ◽  
Chun-Yang Huang ◽  
Tseung-Yuen Tseng

2015 ◽  
Vol 15 (10) ◽  
pp. 7430-7435 ◽  
Author(s):  
Young Jun Yoon ◽  
Hye Rim Eun ◽  
Jae Hwa Seo ◽  
Hee-Sung Kang ◽  
Seong Min Lee ◽  
...  

We have investigated and proposed a highly scaled tunneling field-effect transistor (TFET) based on Ge/GaAs heterojunction with a drain overlap to suppress drain-induced barrier thinning (DIBT) and improve low-power (LP) performance. The highly scaled TFET with a drain overlap achieves lower leakage tunneling current because of the decrease in tunneling events between the source and drain, whereas a typical short-channel TFET suffers from a great deal of tunneling leakage current due to the DIBT at the off-state. However, the drain overlap inevitably increases the gate-to-drain capacitance (Cgd) because of the increase in the overlap capacitance (Cov) and inversion capacitance (Cinv). Thus, in this work, a dual-metal gate structure is additionally applied along with the drain overlap. The current performance and the total gate capacitance (Cgg) of the device with a dual-metal gate can be possibly controlled by adjusting the metal gate workfunction (Φgate) and Φoverlap-gate in the overlapping regions. As a result, the intrinsic delay time (τ) is greatly reduced by obtaining lower Cgg divided by the on-state current (Ion), i.e., Cgg/Ion. We have successfully demonstrated excellent LP and high-speed performance of a highly scaled TFET by adopting both drain overlap and dual-metal gate with DIBT minimization.


2015 ◽  
Vol 3 (40) ◽  
pp. 20073-20079 ◽  
Author(s):  
Fang Cui ◽  
Qing Shao ◽  
Tieyu Cui ◽  
Linxu Xu ◽  
Tongjie Yao ◽  
...  

Coordination polymer nanoribbons equipped with dual metal ions are fabricated by using a Janus building block.


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