Root-Cause Investigations of Stitch Bond – Shearing by Means of 3D-X-ray Computer Tomography (XCT), Metallographic Polishing and FIB

2010 ◽  
Author(s):  
Peter Jacob ◽  
Iwan Jerjen ◽  
Giovanni Nicoletti
Keyword(s):  
Failure Modes ◽  
Typical Case ◽  
Bending Properties ◽  
Thermomechanical Stress ◽  
X Ray ◽  
Root Cause ◽  
Electrical Connections ◽  
Non Destructive ◽  
Non Destructive Characterization

Abstract Since new packaging technologies came up, sensitive failure modes, which were difficult to prove, increased. In many cases, an interaction of bending properties, thermomechanical stress and the material compounds used, cause intermittent failures related to electrical connections. Since any decapsulation might falsify analysis results, non-destructive characterization approaches are of utmost importance for future failure analysis. By means of a typical case study, the capabilities and limitations of a highly developed X-ray tool in such application has been outlined as well as the complexity of root cause findings.

Failure Analysis Case Study of a 1.5 Meter Space Flex Harness

2017 ◽  
Author(s):  
Erick Kim ◽  
Kamjou Mansour ◽  
Gil Garteiz ◽  
Javeck Verdugo ◽  
Ryan Ross ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Failure Modes ◽  
Field Of View ◽  
Area Of Interest ◽  
Air Stream ◽  
Novel Method ◽  
Temperature Controlled ◽  
Non Destructive ◽  
Failure Site

Abstract This paper presents the failure analysis on a 1.5m flex harness for a space flight instrument that exhibited two failure modes: global isolation resistances between all adjacent traces measured tens of milliohm and lower resistance on the order of 1 kiloohm was observed on several pins. It shows a novel method using a temperature controlled air stream while monitoring isolation resistance to identify a general area of interest of a low isolation resistance failure. The paper explains how isolation resistance measurements were taken and details the steps taken in both destructive and non-destructive analyses. In theory, infrared hotspot could have been completed along the length of the flex harness to locate the failure site. However, with a field of view of approximately 5 x 5 cm, this technique would have been time prohibitive.

Case Study and Fault Modeling for Wrong Redundancy Evaluation on DRAM Devices

2007 ◽  
Author(s):  
Martin Versen ◽  
Dorina Diaconescu ◽  
Jerome Touzel
Keyword(s):  
Failure Mode ◽  
Failure Modes ◽  
Fault Modeling ◽  
Mode Analysis ◽  
Root Cause ◽  
Failure Mode Analysis

Abstract The characterization of failure modes of DRAM is often straight forward if array related hard failures with specific addresses for localization are concerned. The paper presents a case study of a bitline oriented failure mode connected to a redundancy evaluation in the DRAM periphery. The failure mode analysis and fault modeling focus both on the root-cause and on the test aspects of the problem.

scholarly journals Energy dispersive X-ray diffraction (EDXRD) for operando materials characterization within batteries

2020 ◽  
Vol 22 (37) ◽  
pp. 20972-20989 ◽  
Author(s):  
Amy C. Marschilok ◽  
Andrea M. Bruck ◽  
Alyson Abraham ◽  
Chavis A. Stackhouse ◽  
Kenneth J. Takeuchi ◽  
...  
Keyword(s):  
Materials Characterization ◽  
Energy Dispersive ◽  
System Level ◽  
X Ray Diffraction ◽  
X Ray ◽  
Non Destructive ◽  
Non Destructive Characterization

This review highlights the efficacy of EDXRD as a non-destructive characterization tool in elucidating system-level phenomena for batteries.

scholarly journals Non-destructive handheld XRF study of archaeological composite silver objects—the case study of the late Roman Seuso Treasure

2021 ◽  
Vol 13 (5) ◽  
Author(s):  
Viktória Mozgai ◽  
Bernadett Bajnóczi ◽  
Zoltán May ◽  
Zsolt Mráv
Keyword(s):  
Fluorescence Analysis ◽  
The Body ◽  
High Quality ◽  
X Ray ◽  
Composite Objects ◽  
Mechanical Attachment ◽  
Non Destructive ◽  
Made In ◽  
Late Roman

AbstractThis study details the non-destructive chemical analysis of composite silver objects (ewers, situlas, amphora and casket) from one of the most significant late Roman finds, the Seuso Treasure. The Seuso Treasure consists of fourteen large silver vessels that were made in the fourth–early fifth centuries AD and used for dining during festive banquets and for washing and beautification. The measurements were systematically performed along a pre-designed grid at several points using handheld X-ray fluorescence analysis. The results demonstrate that all the objects were made from high-quality silver (above 90 wt% Ag), with the exception of the base of the Geometric Ewer B. Copper was added intentionally to improve the mechanical properties of soft silver. The gold and lead content of the objects shows constant values (less than 1 wt% Au and Pb). The chemical composition as well as the Bi/Pb ratio suggests that the parts of the composite objects were manufactured from different silver ingots. The ewers were constructed in two ways: (i) the base and the body were made separately, or (ii) the ewer was raised from a single silver sheet. The composite objects were assembled using three methods: (i) mechanical attachment; (ii) low-temperature, lead-tin soft solders; or (iii) high-temperature, copper-silver hard solders. Additionally, two types of gilding were revealed by the XRF analysis, one with remnants of mercury, i.e. fire-gilding, and another type without remnants of mercury, presumably diffusion bonding.

Non-Destructive Measurements of III-V Semiconductor Device Structure by a Hard X-ray Microprobe

1991 ◽  
Vol 240 ◽  
Author(s):  
F. Uchida ◽  
J. Shigeta ◽  
Y. SUZUKI
Keyword(s):  
Semiconductor Device ◽  
Film Structure ◽  
Device Structure ◽  
X Ray ◽  
Model Sample ◽  
Device Structures ◽  
The Difference ◽  
X Ray Absorption ◽  
Non Destructive ◽  
Non Destructive Characterization

ABSTRACTA non-destructive characterization technique featuring a hard X-ray Microprobe is demonstrated for lll-V semiconductor device structures. A GaAs FET with a 2 μm gate length is measured as a model sample of a thin film structure. X-ray scanning microscopic images of the FET are obtained by diffracted X-ray and fluorescence X-ray detection. Diffracted X-ray detection measures the difference in gate material and source or drain material as a gray level difference on the image due to the X-ray absorption ratio. Ni Ka fluorescence detection, on the other hand, provides imaging of 500 Å thick Ni layers, which are contained only in the source and drain metals, through non-destructive observation.

Applying Advanced FMEA Methods to Vehicle Fire Cause Determinations

2011 ◽  
Author(s):  
Kerry D. Parrott ◽  
Pat J. Mattes ◽  
Douglas R. Stahl
Keyword(s):  
Automotive Industry ◽  
Failure Modes ◽  
Illustrative Case ◽  
Analysis Tool ◽  
Fire Investigation ◽  
Root Cause ◽  
Product And Process ◽  
Illustrative Case Study ◽  
Fire Cause

This paper proposes that the advanced Failure Modes and Effects Analysis (FMEA) techniques and methodology currently used by the automotive industry for product and process design can be reversed and used as an effective failure/root cause analysis tool. This paper will review FMEA methodologies, explain the newest advanced FMEA methodologies that are now being used in the automotive industry, and will then explain how this methodology can be effectively reversed and used as a failure analysis and fire cause determination tool referred to as a “reverse FMEA” (rFMEA). This paper will address the application of these techniques and methodology to vehicle fire cause determination. This methodology is particularly suited to situations where multiple potential fire causes are contained within an established area of origin. NFPA 921 Guide for Fire & Explosion Investigations [1] and NFPA 1033 Standard for Professional Qualifications for Fire Investigator [2], often referenced by the fire investigation community, prescribe following a systematic approach utilizing the scientific method for fire origin and cause determinations. The rFMEA methodology is proposed as a fire investigation tool that assists in that process. This “reverse FMEA” methodology will then be applied to a hypothetical, illustrative case study to demonstrate its application.

scholarly journals A Factory Analysis on the Proportion of Defects Reduction in The Animal Feed Pellet Production Process using Design of Experiment Analysis

2019 ◽  
Vol 3 (2) ◽  
pp. 26-33
Author(s):  
Keyword(s):  
Production Process ◽  
Failure Modes ◽  
Animal Feed ◽  
Fractional Factorial ◽  
Pareto Chart ◽  
Manufacturing Defects ◽  
Root Cause ◽  
Pellet Production ◽  
Feed Pellet

The aim of this research is to reduce a number of defects during a feed pellet production process to improve customer satisfaction. A factory case study produces the feed pellets for several species such as food for pigs, chickens, and ducks. Production data from January to June 2017 manufacturing found that the manufacturing defects rate were about 3.32%. The data showed that the overall defects originated from different problems; 1) cracked or broken food; 2) high humidity; 3) distorted of product color; and 4) an ingredient error, respectively. Statistical methods, design analysis, and cause analysis techniques e.g. the Ishikawa diagram, Pareto chart, and FMEA (Failure Mode and Effects Analysis) were applied to help the factory to identify the main root cause of the defects and the potential failure modes of the factory case study. Due to an increasing number of complaints, this study only concentrated on the duck feed pellet production process. The study was divided into two parts: finding the root cause of the defects, which are the most critical factors for further analysis, and applying an experimental statistical design to decrease the number of defects during the duck pellet production process. The problem with cracked or broken pellets (dust) was found as the main factor affecting the production defects. Results showed that the main factors contributing to the amount of dusk in the duck feed productions came from three factors as follow: the thickness of die, distance between compression rollers and die, and time and temperature of mill machine needed during compressing the duck feed pellet production. Both the fractional factorial experimental design, 2k and 3k, were used to evaluate the influence of each factor on the duck feed production defects. The results by using the factorial 2K experimental show that the most important variable in duck pellets production were thickness of the die, distance between compression rollers and die, and temperature of mill machine needed during compressing the duck feed pellet production while time was not an interaction effect in this problem. The 3k factorial design was used to determine the interaction effects for the duck pellets production process. The experiment was ran and tested for 3 months. The final outcomes showed a significant reduction of defects from 2.51% to 1.09% (P<0.01). The results indicated that thickness -20 mm. of the die, 0.05 mm of distance between compression rollers and die, and 95 degree Celsius of temperature of mill machine needed during compressing the duck feed pellet production would be the most appropriate set of pelleting machine for the duck production process case study.

X-ray Advances in Support of Advanced Packaging – Today and Tomorrow

2018 ◽  
Vol 2018 (1) ◽  
pp. 000409-000414
Author(s):  
David Bernard
Keyword(s):  
Heat Dissipation ◽  
X Ray ◽  
Destructive Test ◽  
Heat Transfer Efficiency ◽  
Advanced Packaging ◽  
History Of ◽  
Production Output ◽  
2D And 3D ◽  
Non Destructive

Abstract As advanced packaging continues to develop to support novel and emerging technologies, the need for, ideally non-destructive, test and inspection continues to be vital to ensure the quality and assurance of functionality, wherever the package may go. This is made ever more difficult as the package complexity increases, whilst the feature sizes within continue to decrease. X-ray technology has long been an important part of the non-destructive inspection protocol over the history of advanced packaging and will continue to need to play a more important part in the future. This paper will review the advances made in both 2D and 3D X-ray inspection over recent years and the new opportunities that are now starting to be available, especially in 3D, or CT, inspection, that will enable this 120-year-old technology to remain relevant to and supportive of the needs of advanced packaging. To highlight the above, a case study will be presented on the faults that 2D and CT X-ray analysis can find in LEDs during their manufacture. LEDs are a good example of the remarkable developments in packaging and technology over the last 20 years, where the use of higher powers, smaller sized features and increased reliability requirements intensify the need for higher quality, more consistent production output. Flaws cannot be accepted, especially as higher usage powers mean higher operating temperatures which, in turn, then requires very good thermal conductivity in the package to move heat away from key areas. Without good heat dissipation then heat stresses at the interfaces can cause delamination or die fractures, so reducing LED lifetimes. The presence of voids, particularly at the die to package interface, creates air gaps that reduces heat transfer efficiency. As many LEDs are potted, or encapsulated, the only non-destructive test option to check for voiding and other faults is by using 2D and CT X-ray analysis.

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