scholarly journals Investigation of Roll-to-Roll Gravure Printing for Printed Electronics with Fine Features

2020 ◽  
Vol 9 (2) ◽  
pp. 79-89
Author(s):  
S.H. Chen ◽  
S.T. Pua ◽  
Z.W. Zhong ◽  
X.C. Shan
Keyword(s):  
Printed Electronics ◽  
Viscoelastic Behavior ◽  
High Viscosity ◽  
Small Scale ◽  
Gravure Printing ◽  
Large Area ◽  
Current Standard ◽  
Setup Cost ◽  
Ink Transfer ◽  
Printing Speed

Gravure printing is known to be cost competitive in manufacturing of printed electronic devices due to its capability to mass produce at lower costs. Current standard of gravure printed feature sizes is in a range of around 50 μm down to sub-10 μm, predominantly through small scale setups and specialized engraving. However, reliance on gravure cell design limits the scalability of printing over a large area due to the setup cost. In this study, ink viscoelastic behavior was modified to improve replication of gravure printed features over a large printing area of 300 mm web-width without a reduction in gravure cell dimension. Fine lines were printed using a high viscosity ink with a good replication of the nominal line width. Control over the printed features was performed through the variation of printing speed and the alteration of ink viscosity. The effects of ink viscosity and printing speed on the printed ink particle distribution and size were also examined. New methodologies of characterizing ink transfer were also developed to help understand the ink transfer processes: mass transfer and particle transfer. A deeper understanding of the thixotropic effect and shear recovery behavior of inks was achieved through simulations of shearing conditions.

Study about Influencing of Printing Process on Gravure Printing Ink Transfer

2013 ◽  
Vol 469 ◽  
pp. 301-304
Author(s):  
Pu Jun Deng ◽  
Wei Fang ◽  
Jian Dong Lu
Keyword(s):  
Quantitative Analysis ◽  
Process Conditions ◽  
Gravure Printing ◽  
Line Number ◽  
Printing Process ◽  
Ink Transfer ◽  
Printing Processes ◽  
Printing Ink ◽  
Influence Degree ◽  
Printing Speed

Abstract. Gravure printing has the characteristics including thick ink layer, bright and homochromatic color, rich and sharp tone, and strong stereoscopic impression. In the packaging-printing field, gravure printing gets more and more attentions. But in the region of gravure printing process, the study on gravure printing ink transfer is not as deep as offset print. Most researches just stay in the level of qualitative analysis, but the quantitative analysis researches are still insufficient. The factors which impact gravure printing ink transfer are not only the volume of engraving ink cell, but also printing process. In this paper, gravure printing ink transfer is analyzed quantitatively from the point of views of gravure printing pressure, printing speed, scraping blade pressure and ink viscosity. The following research has been done in this paper. Firstly, electronic engraving machine is used to engrave eight different area ink cells by 45° ink cell angle and 70lpc screen line number on the same gravure roller. Secondly, gravure proofing machine is used to make proofs in different process conditions. Thirdly, density meter is used to determine density of cell ink, and balance is used to determine the weight of ink which moves from the plate onto the paper. Finally, to analyze the influence of different printing processes on gravure printing ink transfer. The research results show that gravure printing ink transfer is influenced certainly by different printing processes. Printing process has a certain influence on the gravure printing ink transfer, and the influence degree of different dot area rate of cell is different. The doctor blade pressure and ink viscosity influence greatly gravure printing ink transfer.

scholarly journals High Performance Printed Electronics on Large Area Flexible Substrates

2020 ◽  
Author(s):  
Mahesh Soni ◽  
Dhayalan Shakthivel ◽  
Adamos Christou ◽  
Ayoub Zumeit ◽  
Nivasan Yogeswaran ◽  
...  
Keyword(s):  
High Performance ◽  
Printed Electronics ◽  
Flexible Substrates ◽  
Large Area

Toward Manufacturing Low-Cost, Large-Area Electronics

MRS Bulletin ◽  
2006 ◽  
Vol 31 (6) ◽  
pp. 471-475 ◽  
Author(s):  
Marc Chason ◽  
Daniel R. Gamota ◽  
Paul W. Brazis ◽  
Krishna Kalyanasundaram ◽  
Jie Zhang ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Consumer Products ◽  
Electronic Systems ◽  
Printed Wiring Board ◽  
Large Area ◽  
Active Devices ◽  
Materials Research ◽  
Wiring Board ◽  
Large Area Electronics

AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

An Investigation onto Polydimethylsiloxane (PDMS) Printing Plate of Multiple Functional Solid Line by Flexographic

2013 ◽  
Vol 844 ◽  
pp. 158-161 ◽  
Author(s):  
M.I. Maksud ◽  
Mohd Sallehuddin Yusof ◽  
M. Mahadi Abdul Jamil
Keyword(s):  
Laser Ablation ◽  
Line Width ◽  
High Speed ◽  
Printed Electronics ◽  
Low Cost ◽  
Flexible Substrates ◽  
Large Area ◽  
Printing Plate ◽  
Roll To Roll ◽  
Printing Processes

Recently low cost production is vital to produce printed electronics by roll to roll manufacturing printing process like a flexographic. Flexographic has a high speed technique which commonly used for printing onto large area flexible substrates. However, the minimum feature sizes achieved with roll to roll printing processes, such as flexographic is in the range of fifty microns. The main contribution of this limitation is photopolymer flexographic plate unable to be produced finer micron range due to film that made by Laser Ablation Mask (LAMs) technology not sufficiently robust and consequently at micron ranges line will not be formed on the printing plate. Hence, polydimethylsiloxane (PDMS) is used instead of photopolymer. Printing trial had been conducted and multiple solid lines successfully printed for below fifty microns line width with no interference between two adjacent lines of the printed images.

Composition Quantification of Microelectronics Multilayer Thin Films by EDX: Toward Small Scale Analysis

2009 ◽  
Vol 1184 ◽  
Author(s):  
Thierry Conard ◽  
Kai Arstila ◽  
Thomas Hantschel ◽  
Alexis Franquet ◽  
Wilfried Vandervorst ◽  
...  
Keyword(s):  
Gate Dielectric ◽  
Small Scale ◽  
Quantitative Composition ◽  
Composition Analysis ◽  
Multilayer Thin Films ◽  
Large Area ◽  
Fast Analysis ◽  
Metal Gates ◽  
High K ◽  
High K Materials

AbstractIn order to continuously improve the performances of microelectronics devices through scaling, SiO2 is being replaced by high-k materials as gate dielectric; metal gates are replacing poly-Si. This leads to increasingly more complex stacks. For future generations, the replacement of Si as a substrate by Ge and/or III/V material is also considered. This also increases the demand on the metrology tools as a thorough characterization, including composition and thickness is thus needed. Many different techniques exist for composition analysis. They usually require however large area for the analysis, complex instrumentation and can be time consuming. EDS (Energy Dispersive Spectroscopy) when coupled to Scanning Electron Microscopy (SEM) has the potential to allow fast analysis on small scale areas.In this work, we evaluate the possibilities of EDS for thin film analysis based on an intercomparison of composition analysis with different techniques. We show that using proper modeling, high quality quantitative composition and thickness of multilayers can be achieved.

scholarly journals Shape-Dependent Aggregation of Silver Particles by Molecular Dynamics Simulation

Crystals ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 405 ◽  
Author(s):  
Xue Wang ◽  
Chaofeng Hou ◽  
Chengxiang Li ◽  
Yongsheng Han
Keyword(s):  
Building Blocks ◽  
High Viscosity ◽  
High Energy ◽  
Dynamics Simulation ◽  
Structure Evolution ◽  
Shape Effect ◽  
Silver Particles ◽  
Large Area ◽  
Research Problems ◽  
High Possibility

In crystallization, nanoparticle aggregation often leads to the formation of orderly structures, even single crystals. Why can nanoparticles form orderly structures and what is the mechanism dominating their orderly aggregation? These questions raise interesting research problems, but the occurrences that could answer them often fail to be directly observed, since the interaction among particles is invisible. Here, we report an attempt to discover the interaction and aggregation of building blocks through a computer simulation, focusing on the shape effect of building blocks on the aggregation. Four types of silver building blocks were selected, each consisting of (100) and (111) facets, but the ratio of these two facets was different. It was found that the area of facets played an important role in selecting the aggregation mode. The facets with a large area and high energy had a high possibility of aggregation. In addition, the effects of solvent viscosity and temperature were also investigated. High viscosity and low temperature enhanced the orderliness of aggregation. This paper reports a detailed view of the aggregation process of silver nanoparticles, which is expected to be helpful in understanding the structure evolution of materials in nonclassical crystallization.

Precision Jetting of Solder Paste – A Versatile Tool for Small Volume Production

2014 ◽  
Vol 2014 (1) ◽  
pp. 000438-000443 ◽  
Author(s):  
K.-F. Becker ◽  
M. Koch ◽  
S. Voges ◽  
T. Thomas ◽  
M. Fliess ◽  
...  
Keyword(s):  
Process Development ◽  
Droplet Diameter ◽  
Rheological Behaviour ◽  
High Volume ◽  
Electronic System ◽  
High Viscosity ◽  
Solder Paste ◽  
Process Data ◽  
Current Standard ◽  
Conductive Adhesives

During the last years, jetting processes for higher viscosity materials have gained widespread interest in microelectronics manufacturing. Main reasons for this interest are high throughput/productivity of jetting, contactless material deposition, high volume precision and freely designable deposition patterns. In previous studies [i,ii] we have demonstrated the jetability of different resin-based materials, being exemplary for unfilled adhesive, for low viscous Underfill resin and for higher viscosity Glob Top materials. The focus of our previous work was on the dosing of various encapsulants - Underfill material with low viscosity and near Newtonian behaviour and Glob Top resins, being non-Newtonian fluids due to higher matrix viscosity and higher filler content (up to 70 wt %) with resulting increased filer/filler and filler/matrix interaction. During the last years jetting has become widely used and has been applied to the dosing of much more complex materials, combining high viscosity matrix materials with odd shaped and compressive particles. Examples for these materials are conductive adhesives and also solder pastes, where the jetting system developed by Swedish company Mydata set's the current standard for solder paste jetting. In a technological study solder paste jetting using different jetting systems has been investigated in comparison to solder paste dispensing and solder paste printing, especially material rheological behaviour and the correspondence to processability have been evaluated in detail. To illustrate the potential of solder paste jetting as a flexible and powerful tool for electronic system prototyping, a test vehicle has been designed, containing areas for SMD soldering and for process reproducibility. To determine process quality not only basic process data on droplet diameter, resulting material depot size and positioning accuracy have been evaluated, but also statistical means have been employed to determine process homogeneity and stability depending on the respective parameter set. Summarized this paper gives an insight into solder jet process development and describes material rheology demands and limitations and thus allows the optimized use of advanced solder jetting technology for electronics assemblies.

scholarly journals Will organic thermoelectrics get hot?

2019 ◽  
Vol 377 (2152) ◽  
pp. 20180352 ◽  
Author(s):  
Mariano Campoy-Quiles
Keyword(s):  
Carbon Nanotubes ◽  
Persistence Length ◽  
Charge Carrier Mobility ◽  
Small Scale ◽  
Heat Sources ◽  
Low Carbon ◽  
Energy Materials ◽  
Thermoelectric Efficiency ◽  
Large Area ◽  
Low Toxicity

The generally low energy density from most heat sources—the Sun, Earth as well as most human activities—implies that solid-state thermoelectric devices are the most versatile heat harvesters since, unlike steam engines, they can be used on a small scale and at small temperature differences. In this opinion piece, we first discuss the materials requirements for the widespread use of thermoelectrics. We argue that carbon-based materials, such as conducting polymers and carbon nanotubes, are particularly suited for large area and low-temperature operation applications, as they are abundant, low-toxicity and easy to process. We combine experimentally observed macro-trends and basic thermoelectric relations to evaluate the major performance limitations of this technology thus far and propose a number of avenues to take the thermoelectric efficiency of organic materials beyond the state of the art. First, we emphasize how charge carrier mobility, rather than charge density, is currently limiting performance, and discuss how to improve mobility by exploiting anisotropy, high persistence length materials and composites with long and well-dispersed carbon nanotubes. We also show that reducing thermal conductivity could double efficiency while reducing doping requirements. Finally, we discuss several ways in which composites could further boost performance, introducing the concept of interface engineering to produce phonon stack-electron tunnel composites. This article is part of a discussion meeting issue ‘Energy materials for a low carbon future'.

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