scholarly journals Characterization of new materials for capacitor formation in integrated circuit technology

2010 ◽  
pp. 26-31
Author(s):  
Wenbin Chen
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Building Blocks ◽  
Electronic Systems ◽  
New Materials ◽  
Computer Logic ◽  
Widespread Availability ◽  
Scaling Down ◽  
Circuit Technology

There have been tremendous developments in electronic technology in the last 40 years as evidenced by the widespread availability of computers, mobile phones and electronic entertainment systems and their continued shrinking in size and cost. Much of the improvement in the performance of electronic systems can be traced to developments in Integrated Circuits (ICs) (“microchips”) which form the fundamental building blocks of modern electronics technology. Within an IC, the most important electronic component is the transistor and it is the transistor that is used to implement the operations associated with computer logic. With each generation of technology, the size of the transistors is reduced and more of them can fit on a single IC, which allows more powerful devices to be made that take up the same or even smaller space and draw less power from the battery. This trend regarding the scaling down in size of the transistors was ...

Long-Term Characterization of 6H-SiC Transistor Integrated Circuit Technology Operating at 500 °C

2008 ◽  
Vol 1069 ◽  
Author(s):  
Philip Neudeck ◽  
David J. Spry ◽  
Liang-Yu Chen ◽  
Carl W. Chang ◽  
Glenn M. Beheim ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Field Effect Transistors ◽  
Aircraft Engines ◽  
Electrical Parameters ◽  
Air Atmosphere ◽  
Circuit Technology ◽  
Very High

ABSTRACTNASA has been developing very high temperature semiconductor integrated circuits for use in the hot sections of aircraft engines and for Venus exploration. This paper reports on long-term 500 °C electrical operation of prototype 6H-SiC integrated circuits based on epitaxial 6H-SiC junction field effect transistors (JFETs). As of this writing, some devices have surpassed 4000 hours of continuous 500 °C electrical operation in oxidizing air atmosphere with minimal change in relevant electrical parameters.

Emerging Techniques for the Characterization of Nano-Mechanical Properties of Integrated Circuit Components

2008 ◽  
Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair
Keyword(s):  
Mechanical Properties ◽  
Quality Control ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
Manufacturing Process ◽  
Solder Bumps ◽  
Initial Work ◽  
Circuit Components ◽  
Materials Used

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.

scholarly journals Interband Cascade Photonic Integrated Circuits on Native III-V Chip

Sensors ◽  
2021 ◽  
Vol 21 (2) ◽  
pp. 599
Author(s):  
Jerry R. Meyer ◽  
Chul Soo Kim ◽  
Mijin Kim ◽  
Chadwick L. Canedy ◽  
Charles D. Merritt ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Detection System ◽  
Laser Cavity ◽  
Building Blocks ◽  
Drive Power ◽  
Optical Elements ◽  
Photonic Integrated Circuit ◽  
Cleaved Facets ◽  
On Chip

We describe how a midwave infrared photonic integrated circuit (PIC) that combines lasers, detectors, passive waveguides, and other optical elements may be constructed on the native GaSb substrate of an interband cascade laser (ICL) structure. The active and passive building blocks may be used, for example, to fabricate an on-chip chemical detection system with a passive sensing waveguide that evanescently couples to an ambient sample gas. A variety of highly compact architectures are described, some of which incorporate both the sensing waveguide and detector into a laser cavity defined by two high-reflectivity cleaved facets. We also describe an edge-emitting laser configuration that optimizes stability by minimizing parasitic feedback from external optical elements, and which can potentially operate with lower drive power than any mid-IR laser now available. While ICL-based PICs processed on GaSb serve to illustrate the various configurations, many of the proposed concepts apply equally to quantum-cascade-laser (QCL)-based PICs processed on InP, and PICs that integrate III-V lasers and detectors on silicon. With mature processing, it should become possible to mass-produce hundreds of individual PICs on the same chip which, when singulated, will realize chemical sensing by an extremely compact and inexpensive package.

Hybrid Integrated Circuits and Integrated Circuit Technology at 30 GHz

1971 ◽  
Author(s):  
M. V. Schneider ◽  
B. S. Glance ◽  
R. F. Trambarulo
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Circuit Technology

Application of data screening to the characterization of integrated circuits

1989 ◽  
Vol 67 (4) ◽  
pp. 221-224
Author(s):  
Zarrin Ghaemi
Keyword(s):  
Integrated Circuits ◽  
Test Data ◽  
Integrated Circuit ◽  
Software Package ◽  
Automatic Method ◽  
Statistical Software ◽  
Data Screening ◽  
Actual Test ◽  
Visual Graph

Large amounts of integrated-circuit test data may be too great to be analysed by (human) visual graph inspection, and must be inspected by an automatic method. In this paper, a method called data screening is described. Data screening automatically identifies the presence of abnormalities (unexpected clusters and (or) outliers) in sets of test data, and has been implemented in a program in a statistical software package called Enhansys. The method has been used on actual test data with good results.

Toward Biomolecular Computers Using Reaction-Diffusion Dynamics

2011 ◽  
pp. 176-183
Author(s):  
Masahiko Hiratsuka ◽  
Koichi Ito ◽  
Takafumi Aoki ◽  
Tatsuo Higuchi
Keyword(s):  
Integrated Circuits ◽  
Molecular Electronics ◽  
Integrated Circuit ◽  
Functional Model ◽  
Reaction Diffusion ◽  
Building Blocks ◽  
Biological Molecules ◽  
Computing Paradigm ◽  
Diffusion Dynamics ◽  
Massively Parallel Computing

This article investigates a possibility of constructing massively parallel computing systems using molecular electronics technology. By employing the specificity of biological molecules, such as enzymes, new integrated circuit architectures that are free from interconnection problems could be constructed. To clarify the proposed concept, we present a functional model of an artificial catalyst device called an enzyme transistor. In this article, we develop artificial catalyst devices as basic building blocks for molecular computing integrated circuits, and explore the possibility of a new computing paradigm using reaction-diffusion dynamics induced by collective behavior of artificial catalyst devices.

A Novel Fault Isolation Technique Using Noise Detection and Characterization of Light Emitted From Integrated Circuits

1998 ◽  
Author(s):  
Hong Zheng ◽  
Joe Patterson ◽  
G. P. Li
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Light Emission ◽  
Fault Isolation ◽  
Noise Detection ◽  
Isolation Technique ◽  
Potential Effectiveness ◽  
Defect Sites ◽  
A New Technique

Abstract This paper describes a new technique for identifying defects on integrated circuit. This technique detects the noise content in light emitted from defect sites. The purpose of this technique is to determine which of many light emission sites represent a defect and which represent normal devices. It reports the first phase of studies to evaluate the feasibility and potential effectiveness of this technique. The feasibility of this technique has been demonstrated by simultaneously monitoring electrical noise and the noise in the light emitted from a gallium arsenide light emission diode (LED) and a bipolar transistor. The paper will present the methodology and apparatus used to detect and analyze the noise in light emission.

Characterization of a three-dimensional SOI integrated-circuit technology

2008 ◽  
Author(s):  
C.K. Chen ◽  
N. Checka ◽  
B.M. Tyrrell ◽  
C.L. Chen ◽  
P.W. Wyatt ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Three Dimensional ◽  
Circuit Technology

Overview of High Performance Packaging Materials

1990 ◽  
Vol 203 ◽  
Author(s):  
Barry C. Johnson
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Building Blocks ◽  
Electrical Performance ◽  
Electronic Systems ◽  
Circuit Performance ◽  
Signal Velocity ◽  
Semiconductor Chip ◽  
Thermal Cooling ◽  
The Impact

ABSTRACTHigh Performance Integrated Circuits form the basic building blocks of modern electronic systems that are designed to process ever larger numbers of electrical signals at greater signal velocity and fidelity. In such applications, each circuit must be packaged in order to provide it with necessary mechanical support, environmental protection, electrical interconnection and thermal cooling. The package, however, can also impose certain constraints on the chip. It can degrade electrical performance, add size and weight, introduce reliability problems and increase cost. Thus, packaging can be viewed as a complex balance between the provision of desired functions and the reduction of associated constraints.The ability to strike a proper balance has become increasingly difficult in recent years due to the relentless march of integrated circuits toward higher levels of complexity, size, speed, heat flux and customization. It is anticipated that the continuing evolution of high performance circuits and systems will soon be limited by the package designs and materials-of-construction, rather than by the devices on the semiconductor chip.The intent of this talk is to provide a brief overview of high performance packaging and the related materials issues. The approach is to (a) present the forecasted trends in relevant circuit performance characteristics, (b) discuss the impact of these characteristics on current chip and board level packaging methods, and (c) present new package and materials concepts that might furnish potential solutions to the developing circuit-package performance gap.

Method of radiational identification of a plant and characterization of integrated circuit technology

2017 ◽  
Vol 46 (4) ◽  
pp. 290-296
Author(s):  
A. V. Sogoyan ◽  
G. G. Davydov ◽  
A. S. Artamonov ◽  
A. S. Kolosova ◽  
V. A. Telets ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Circuit Technology
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