scholarly journals Optimization of the Rework of Bended OLED Displays by Surface-Energy Control

Coatings ◽  
2021 ◽  
Vol 11 (12) ◽  
pp. 1523
Author(s):  
Young-Gyun Kim ◽  
Byung-Min Park ◽  
Jong-Keun Choi ◽  
Dong-Hoon Jang ◽  
Kwan-Young Han
Keyword(s):  
Surface Treatment ◽  
Window Glass ◽  
Substrate Surface ◽  
Complete Removal ◽  
Adhesive Force ◽  
Process Technology ◽  
Flat Type ◽  
Initial Adhesion ◽  
Display Technology ◽  
Lamination Process

Recent display technology has changed substantially from flat-type displays to bended displays. As a result, the lamination process for bonding the panel substrates and bended window glass has become difficult due to the changes in display shape, and the use of optically clear adhesive (OCA) makes it impossible to rework defective substrates due to residue problems. Therefore, it is necessary to research and develop a substrate-surface treatment that maintains the initial adhesion and is reusable via the complete removal of impurities during delamination in order to enable rework. In this paper, the possibility of maintaining adhesive force and reusing substrates was confirmed through the surface treatment of substrates and OCA using various materials. We found that a surface coating and a cooling treatment of additional substrates completely removed the impurities that remained on the substrates during reworking. These results could contribute to improving lamination-process technology and the productivity of the various forms of next-generation displays that are currently under development.

Transmission electron microscopy of misfit dislocation and strain relaxation in lattice mismatched III-V heterostructures versus substrate surface treatment

2011 ◽  
Vol 1324 ◽  
Author(s):  
Y. Wang ◽  
P. Ruterana ◽  
L. Desplanque ◽  
S. El Kazzi ◽  
X. Wallart
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Surface Treatment ◽  
Substrate Surface ◽  
Strain Relaxation ◽  
Dislocation Core ◽  
Misfit Dislocations ◽  
Heteroepitaxial Growth ◽  
Transmission Electron ◽  
Growth Initiation

ABSTRACTHigh resolution transmission electron microscopy in combination with geometric phase analysis is used to investigate the interface misfit dislocations, strain relaxation, and dislocation core behavior versus the surface treatment of the GaAs for the heteroepitaxial growth of GaSb. It is pointed out that Sb-rich growth initiation promotes the formation of a high quality network of Lomer misfit dislocations that are more efficient for strain relaxation.

Temporary Bonding of Wafers, Displays, and Components

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 1-68
Author(s):  
John Moore ◽  
Jared Pettit ◽  
Alex Brewer ◽  
Alman Law
Keyword(s):  
Printed Electronics ◽  
Adhesion Force ◽  
Substrate Surface ◽  
Adhesive Force ◽  
Flexible Displays ◽  
Substrate Removal ◽  
Solder Bumps ◽  
Silicone Polymers ◽  
Temporary Bonding ◽  
Industry Needs

Packaging practices are conducted on work unit substrates while they are temporarily held in place. This requires a simple adhesion process that enables easy removal without the burdens of complex cleaning. Substrates may be wafers, flexible displays, or components, organic or inorganic, and may contain topography such as solder bumps. The choice of a temporary bonding medium is dependent upon its ability to resist exposure to heat and chemicals. Thermal resistant materials as polyimide (PI), bisbenzocyclobutene (BCB, DOW CycloteneTM), or silicone can support processes that exceed 300°C, depending upon exposure conditions. In building flexible displays, PI materials are popular choices as a substrate processed from liquid and film forms. [1] These products may use silicone polymers, providing low outgas and inert character with an adhesive force tuned to allow substrate removal by peeling without a loss of integrity. Similar approaches are used for discrete, thin, fragile components, attached by dry bonding, processed, and removed by simple peeling practices without observed residue. Examples of die temporary bonding include encapsulation during bumping, permanent bonding, or vacuum deposition of EMI/RFI shielding. [2] The success in these and other technologies depend upon the use of the proper adhesive but most importantly, the tuning of the adhesion force. Successful tuning depends upon many factors, including substrate surface energy, texture, and the bonding process. Daetec has created adhesives used in temporary bonding processes for nearly 20yrs, applying to multiple wafer types, OLED and TFT displays, printed electronics, solar, thinning down to 4um, and thermal resistance >600°C. [3] Our experience in creating solutions for these and other industry needs will be discussed as well as the criteria to temporarily support flexible and rigid substrates of all types, sizes, and shapes.

Surface Treatment and Layer Structure in 2H-GaN Grown on the (0001)Si surface of 6H-SiC by MBE

1997 ◽  
Vol 2 ◽  
Author(s):  
P. Ruterana ◽  
Philippe Vermaut ◽  
G. Nouet ◽  
A. Salvador ◽  
H. Morkoç
Keyword(s):  
Surface Treatment ◽  
Defect Density ◽  
Layer Structure ◽  
Substrate Surface ◽  
Misfit Dislocations ◽  
Island Growth ◽  
3 Dimensional ◽  
Order Of Magnitude ◽  
Dimensional Growth ◽  
Substrate Annealing

Heteroepitaxy of hexagonal symmetry materials is more complicated than in the more usual case of cubic systems. In the growth of layers on the (0001) surfaces, the misfit dislocations always exhibit a screw component that leads to rotation of the epilayer in a 3 dimensional growth mode. The size of the islands will depend on many factors among which the substrate surface treatment, prior to growth, may be a predominant one. In this work, a comparative study is carried out for samples grown on plasma treated samples, with and without additional substrate annealing prior to epitaxy. It is found that the defect density can be brought below 109 cm−2, which is better than one order of magnitude in comparison to the layers grown on sapphire substrates. On top of the annealed substrates, the island growth is not obvious. Whereas, misorientations as large as a few degrees can be measured inside the layers on top of non annealed substrates, justifying the occurrence of high densities of threading dislocations.

Replica Extraction Method on Nanostructured Gold Coatings and Orientation Determination Combining SEM and TEM Techniques

2014 ◽  
Vol 20 (6) ◽  
pp. 1654-1661 ◽  
Author(s):  
Christian Bocker ◽  
Michael Kracker ◽  
Christian Rüssel
Keyword(s):  
Electron Microscopy ◽  
Extraction Method ◽  
Electron Backscatter Diffraction ◽  
Substrate Surface ◽  
Complete Removal ◽  
Electron Microscopic ◽  
Transmission Electron ◽  
Nanostructured Gold ◽  
Diffraction Patterns ◽  
Convergent Beam

AbstractIn the field of electron microscopy the replica technique is known as an indirect method and also as an extraction method that is usually applied on metallurgical samples. This contribution describes a fast and simple transmission electron microscopic (TEM) sample preparation by complete removal of nanoparticles from a substrate surface that allows the study of growth mechanisms of nanostructured coatings. The comparison and combination of advanced diffraction techniques in the TEM and scanning electron microscopy (SEM) provide possibilities for operators with access to both facilities. The analysis of TEM-derived diffraction patterns (convergent beam electron diffraction) in the SEM/electron backscatter diffraction software simplifies the application, especially when the patterns are not aligned along a distinct zone axis. The study of the TEM sample directly by SEM and transmission Kikuchi diffraction allows cross-correlation with the TEM results.

Substrate surface treatment and YSZ buffer layers by IBAD method for coated conductors

2009 ◽  
Vol 469 (15-20) ◽  
pp. 1367-1370 ◽  
Author(s):  
F. Feng ◽  
R. Liu ◽  
H. Chen ◽  
K. Shi ◽  
Z. Wang ◽  
...  
Keyword(s):  
Surface Treatment ◽  
Substrate Surface ◽  
Coated Conductors ◽  
Buffer Layers

Substrate Temporary Bonding Supporting Post-Processing Applications

2015 ◽  
Vol 2015 (1) ◽  
pp. 1-7 ◽  
Author(s):  
Jared Pettit ◽  
Alman Law ◽  
Alex Brewer ◽  
John Moore
Keyword(s):  
Physical Vapor Deposition ◽  
Printed Electronics ◽  
Adhesion Force ◽  
Substrate Surface ◽  
Chemical Diffusion ◽  
Adhesive Force ◽  
Post Processing ◽  
Flexible Displays ◽  
Substrate Removal ◽  
Temporary Bonding

Post-processing applications are carried out on substrates while they are temporarily supported. This requires a simple adhesion process with easy removal without complex tooling or cleaning. Substrates include wafers, displays, or components, organic or inorganic, and may contain topography such as solder bumps. The applications may vary from backside processing of wafers, complete flexible circuit integration, or the stacking of packages. Simple processing may use green products as the detergent soluble DaeCoatTM 600-series, exhibiting thermal stability from 80°C to allow hot DIW debond, to over 200°C to support thermal processing. Temporary bonding may resist heat and chemicals for many steps or one major extreme. The DaeCoatTM 300-series of products are designed to resist thermal exposures >300°C for wafer operations with bumps or reach ≥400°C (DaeCoatTM 315) for flexible displays to allow casting of liquid polyimide (PI) [1]. The properties are consistent with the needs of electronics processes, providing outgas below 1% inert to fab chemicals, and most important, an adhesive force that is tuned to allow simple substrate removal (peeling, lifting, or chemical diffusion). Where discrete die or components require installing infrastructure to support stacking or fan-out designs, the thin and fragile substrate is securely held in place by simple dry bonding completed in seconds and later removed by similar peeling practices without observed residue. Such component practices enable encapsulation during bumping, permanent bonding, or physical vapor deposition (PVD) of electromagnetic and radio-frequency interference (EMI/RFI) shielding [2]. The success in these and other technologies depend upon the use of the proper adhesive but most importantly, the tuning of the adhesion force. Successful tuning depends upon many factors, including substrate surface energy, texture, and the bonding process. Daetec has created adhesives used in temporary bonding processes for nearly 20yrs, applying to multiple wafer types, OLED and TFT displays, printed electronics, solar, thinning down to 4um, and thermal resistance >600°C [3]. Our experience in creating solutions for these and other industry needs will be discussed as well as the criteria to temporarily support flexible and rigid substrates of all types, sizes, and shapes.

Advanced Technologies for Determination of Surface Cleanliness

2014 ◽  
Vol 11 (1) ◽  
pp. 16-19 ◽  
Author(s):  
Jan Kudlacek ◽  
Petr Chabera
Keyword(s):  
Surface Treatment ◽  
Substrate Surface ◽  
Modern Method ◽  
Surface Pretreatment ◽  
Advanced Technologies ◽  
Pre Treatment ◽  
High Utility ◽  
Correct Application

Abstract For high utility value of products is significant quality of surface treatment. Among the processes that most affect the quality of surface treatment are mainly surface pretreatment processes, namely processes of cleaning (degreasing). This article is devoted to quality control after surface pre-treatment. It mainly deals with the modern method for detecting surface contamination grease based on fluorescence methods. Impurities such as grease, oil and other have characteristic fluorescence after illumination by UV source. This principle can be used to determine the purity of the substrate surface, thereby ensuring the quality of the surface. Surface cleanliness is very important factor for the correct application of subsequent technological processes.

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