scholarly journals 2.45 GHz Band Quadrature Microwave Frequency Discriminators with Integrated Correlators Based on Power Dividers and Rat-Race Hybrids

Electronics ◽  
2021 ◽  
Vol 10 (22) ◽  
pp. 2763
Author(s):  
Adam Rutkowski ◽  
Hubert Stadnik
Keyword(s):  
Printed Circuit Board ◽  
Microwave Frequency ◽  
Frequency Measurement ◽  
Wide Frequency Range ◽  
Circuit Board ◽  
Current Frequency ◽  
Power Dividers ◽  
Microwave Signals ◽  
Accuracy Of Measurement ◽  
Frequency Discriminators

Instantaneous frequency measurement devices are useful for conducting extremely fast measurements of the current frequency value of microwave signals, even if their duration is extremely short. This paper presents the principle of determination of temporary values of the microwave signal phase and frequency using interferometer techniques, based on passive microwave components. Additionally, the structures and results of measurements of two novel versions of integrated microwave correlators for microwave frequency discriminators, made on a single printed circuit board, are shown. Three Wilkinson-type, single-stage power dividers, and two rat-race hybrids create the developed correlators. The developed devices were designed to work over a wide frequency range, i.e., of 1.6–3.1 GHz, and can be used to monitor Wi-Fi devices as well as pulse and CW radar systems operating in the S band. They can also be applied in passive radars and active Doppler radars. The view of the printed circuits boards and results of measurements are presented. Recommendations for improving the accuracy of measurement are proposed.

scholarly journals A Review and Comparison of Solid, Multi-Strands and Litz Style PCB Winding

Electronics ◽  
2020 ◽  
Vol 9 (8) ◽  
pp. 1324
Author(s):  
Minh Huy Nguyen ◽  
Handy Fortin Blanchette
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Skin Resistance ◽  
Wide Frequency Range ◽  
Circuit Board ◽  
Frequency Range ◽  
Track Width ◽  
Printed Circuit ◽  
Pros And Cons ◽  
High Frequency Ac

At high frequency, AC resistance of a printed circuit board (PCB) winding becomes important and accounts for a large proportion of planar transformer losses. The winding is then influenced by both skin and proximity phenomenon, which makes the current distribution uneven resulting in an increased resistance. The study of improving AC resistance of a PCB winding has been tackled by many researchers. However, the lack of an overview and comparison among improvements has made it difficult to apply those methods to a specific winding. To overcome the above limitations, this paper investigates the pros and cons of three popular AC resistance optimizing methods: optimizing track width of a solid PCB winding, using multi-strands and using Litz style PCB winding. To verify the theoretical analysis, a total of 12 PCBs are simulated by finite element (FEM) and tested in the laboratory. Five criteria are analyzed, including skin resistance, proximity resistance, AC to DC ratio, total AC resistance and complexity are taken into consideration. The results of this study show that optimizing track width method has a significant improvement on AC resistance while the use of Litz PCB is effective for applications that need stable AC resistance in a wide frequency range. The use of parallel strands winding should be carefully considered as there is not significant benefit in both reducing the AC resistance and AC to DC ratio.

Coherent J-Band radiating arrays based on ×27 CMOS activemultiplier chips

2019 ◽  
Vol 11 (08) ◽  
pp. 747-754
Author(s):  
Roman Klimovich ◽  
Samuel Jameson ◽  
Eran Socher
Keyword(s):  
Printed Circuit Board ◽  
Complementary Metal Oxide Semiconductor ◽  
Cmos Technology ◽  
Circuit Board ◽  
Oxide Semiconductor ◽  
Power Dividers ◽  
Radiated Power ◽  
Ring Antenna ◽  
On Chip ◽  
Practical Factors

AbstractThis paper presents a hybrid design of 1 × 2 and 1 × 4 arrays operating in 0.277–0.292 THz on 65 nm Complementary metal–oxide–semiconductor (CMOS) technology. Each of the chips has an X-band input with 3 ×3 multiplier stages and connected at the output to an on-chip ring antenna. A wideband microstrip Wilkinson four-way and two-way power dividers have been developed on a multilayer printed circuit board to feed the array elements with proper radio frequency and direct current inputs. Demonstrating improvements in effective isotropically radiated power and in total radiated power compared to a single CMOS element, the hybrid integration approach proves effective in implementing coherent THz transmitter arrays. Theoretical and practical factors that reduce the radiated power compared with ideal arrays are also discussed.

scholarly journals Photonic-Assisted Scanning Receivers for Microwave Frequency Measurement

2019 ◽  
Vol 9 (2) ◽  
pp. 328 ◽  
Author(s):  
Shijie Song ◽  
Xiaoke Yi ◽  
Lu Gan ◽  
Wenjian Yang ◽  
Linh Nguyen ◽  
...  
Keyword(s):  
Spectral Response ◽  
Optical Filter ◽  
Microwave Frequency ◽  
Matrix Pencil ◽  
Frequency Measurement ◽  
Optical Signal ◽  
Filter Bandwidth ◽  
Measurement Resolution ◽  
The Matrix ◽  
Microwave Signals

We present a novel technique based on matrix pencil assisted deconvolution to improve the measurement resolution in scanning receiver systems for microwave frequency measurements. By modeling the scanning receiver output as the cross-correlation of the input modulated signal with the filter’s spectral response and applying the matrix pencil algorithm to convolve the detected optical signal at the receiver output, our technique offers precise estimations of both the frequency and power information of microwave signals with an improved measurement resolution. A multi-tone microwave signal measurement based on an optical filter is experimentally demonstrated, showing a significant measurement resolution reduction from 1 GHz to 0.4 GHz for two radio frequency (RF) tones, which is only about 30.2% of the optical filter bandwidth.

A Frequency Swept Low-Cost Capacitive Fringing Field PCB Sensor

2017 ◽  
Vol 2017 (1) ◽  
pp. 000157-000162 ◽  
Author(s):  
Robert N. Dean
Keyword(s):  
Aqueous Solution ◽  
Printed Circuit Board ◽  
Weather Forecasting ◽  
Low Cost ◽  
Complex Impedance ◽  
Wide Frequency Range ◽  
Pollution Monitoring ◽  
Circuit Board ◽  
Single Frequency ◽  
Chemical Compositions

Abstract Reliable, low-cost sensors are important for many applications, including agriculture, pollution monitoring and weather forecasting. Commercial printed circuit board technology is being used to develop simple sensors for these applications, where the resistance or capacitance of the sensor is measured at a single frequency to determine useful information about an environmental parameter of interest. However, by measuring the complex impedance of the sensor over a wide frequency range, additional useful information can be obtained about the sensing environment. As a proof of principle, a suitable sensor was developed and evaluated in various aqueous solutions of interest using this technique. The measured sensor impedance was reduced to a capacitance versus frequency plot and a resistance versus frequency plot. Different aqueous solution chemistries resulted in characteristic signatures on these plots that could be useful in identifying the chemical compositions of the various solutions. Di-ionized water was used as a reference for chemical comparison. Various aqueous solution chemistries were then compared with DI water, resulting in corresponding signature differences of 10% to 50%.

Indoor channel characterization studies for V-band gigabit wireless communications using dielectric-loaded exponentially tapered slot antenna

2015 ◽  
Vol 8 (8) ◽  
pp. 1243-1251
Author(s):  
S. Ramesh ◽  
T. Rama Rao
Keyword(s):  
Wireless Communications ◽  
High Speed ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Frequency Measurement ◽  
High Gain ◽  
Circuit Board ◽  
Slot Antenna ◽  
Single Element ◽  
60 Ghz

Demands for very high-speed wireless communication access is rapidly growing with respect to the increasing data rates for the use of rich multimedia content in various applications of defense, enterprise, industrial, and public domains. To serve these gigabit fidelity (Gi-Fi) uses for various wireless applications, millimeter wave (MmW) wireless technology with huge bandwidth in licensed/unlicensed bands is triggering boundless avenues. In this research, the concept of substrate-integrated waveguide (SIW) and exponentially tapered slot (ETS) antenna are used together design a high-gain, efficient planar dielectric-loaded antenna for MmW-based Gi-Fi wireless communications using unlicensed 60 GHz band in the MmW family. The SIW is used to feed the antenna and a dielectric is utilized increasing the gain. The dielectric-loaded ETS antenna and compact SIW feed are fabricated on a single substrate, resulting in low cost and easy fabrication utilizing printed circuit board process. The measured gain of single-element antenna is 11.4 dB, with radiation efficiency of 96.84% at 60 GHz. Then indoor radio wave propagation studies are carried out using elliptically dielectric-loaded ETS antenna with radio frequency measurement equipment to measure and model propagation channels at 60 GHz. The attained simulations are compared with the experimental results.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

DIDACTIC MODEL OF LIFT

2018 ◽  
pp. 219-224
Author(s):  
Lubica Miková
Keyword(s):  
Printed Circuit Board ◽  
Base Plate ◽  
Educational Process ◽  
Circuit Board ◽  
Basic Knowledge ◽  
Practical Training ◽  
Target Setting ◽  
Lower Base ◽  
Complex Design ◽  
Starting Point

Urgency of the research. Mechatronics products become more sophisticated and complicated. Mechatronic engineers should be prepared for this complex design process. Practical experimental model helps improve educational process as preparing for practice. Target setting. Miniaturized model of the lift suitable for practical training on subjects focused to microcontrollers, sen-sors, actuators etc. Students have possibility to make practice on laboratory exercises, where they can verify theoretical knowledge obtained on lectures. The arrangement of the model has modular character, because of possibility to rearrange or adding of new function into model. The aim was to create minimized model of real lift with all functions and systems. Actual scientific researches and issues analysis. Many universities are oriented only to finished robotic kits and do not support creativity of students. Open access and open structure model missing in this field. There is a need for fast prototyping model, which allows the creation of new design of product. Uninvestigated parts of general matters defining. The question of the design of printed circuit board are uninvestigated, because they need more time than allows normal exercises. The research objective. The main aim of educational process is to educate engineers with basic knowledge, skills and handicraft. Practical models help as support devices for fulfil of this aim. All mechatronic students can practice a training on these practical models. They become as more skilled and well-oriented engineers.. The statement of basic materials. Construction consist of upper and lower base plate connected with four pillars used as linear guide for moving of lift cage. Lower base plate includes base microcontrollers boards, resistor network, power transis-tor array board, power supply terminals, relay modules, PWM module and signals terminals. Upper base plate consist of DC motor with gearing and screw mechanism for moving the lift cage. Conclusions. The model enables supports the creativity of the students. The starting point of the using of the model can be without any wired connections. Students should connect every part and try functionality of every function. The students receive the defined several problems and they have to analyze it and make any proposal for solution of defined problems.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

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