scholarly journals Process Variability—Technological Challenge and Design Issue for Nanoscale Devices

Micromachines ◽  
2018 ◽  
Vol 10 (1) ◽  
pp. 6 ◽  
Author(s):  
Jürgen Lorenz ◽  
Eberhard Bär ◽  
Sylvain Barraud ◽  
Andrew Brown ◽  
Peter Evanschitzky ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Process Variations ◽  
Electrical Performance ◽  
Process Equipment ◽  
Process Variability ◽  
Circuit Performance ◽  
Technological Challenge ◽  
Device Properties ◽  
The Impact ◽  
Full Simulation

Current advanced transistor architectures, such as FinFETs and (stacked) nanowires and nanosheets, employ truly three-dimensional architectures. Already for aggressively scaled bulk transistors, both statistical and systematic process variations have critically influenced device and circuit performance. Three-dimensional device architectures make the control and optimization of the device geometries even more important, both in view of the nominal electrical performance to be achieved and its variations. In turn, it is essential to accurately simulate the device geometry and its impact on the device properties, including the effect caused by non-idealized processes which are subject to various kinds of systematic variations induced by process equipment. In this paper, the hierarchical simulation system developed in the SUPERAID7 project to study the impact of variations from equipment to circuit level is presented. The software system consists of a combination of existing commercial and newly developed tools. As the paper focuses on technological challenges, especially issues resulting from the structuring processes needed to generate the three-dimensional device architectures are discussed. The feasibility of a full simulation of the impact of relevant systematic and stochastic variations on advanced devices and circuits is demonstrated.

A Table-Based Approach to Study the Impact of Process Variations on FinFET Circuit Performance

2010 ◽  
Vol 29 (4) ◽  
pp. 627-631 ◽  
Author(s):  
Rajesh A. Thakker ◽  
Chaitanya Sathe ◽  
Maryam Shojaei Baghini ◽  
Mahesh B. Patil
Keyword(s):  
Process Variations ◽  
Circuit Performance ◽  
The Impact

scholarly journals Gate Sizing Methodology with a Novel Accurate Metric to Improve Circuit Timing Performance under Process Variations

Technologies ◽  
2020 ◽  
Vol 8 (2) ◽  
pp. 25 ◽  
Author(s):  
Zahira Perez-Rivera ◽  
Esteban Tlelo-Cuautle ◽  
Victor Champac
Keyword(s):  
Standard Deviation ◽  
Integrated Circuits ◽  
Computing Time ◽  
Process Variations ◽  
Path Selection ◽  
Economic Losses ◽  
Gate Sizing ◽  
Circuit Performance ◽  
Average Percentage ◽  
The Impact

The impact of process variations on circuit performance has become more critical with the technological scaling, and the increasing level of integration of integrated circuits. The degradation of the performance of the circuit means economic losses. In this paper, we propose an efficient statistical gate-sizing methodology for improving circuit speed in the presence of independent intra-die process variations. A path selection method, a heuristic, two coarse selection metrics, and one fine selection metric are part of the new proposed methodology. The fine metric includes essential concepts like the derivative of the standard deviation of delay, a path segment analysis, the criticality, the slack-time, and area. The proposed new methodology is applied to ISCAS Benchmark circuits. The average percentage of optimization in the delay is 12%, the average percentage of optimization in the delay standard deviation is 27.8%, the average percentage in the area increase is less than 5%, and computing time is up to ten times less than using analytical methods like Lagrange Multipliers.

Overview of High Performance Packaging Materials

1990 ◽  
Vol 203 ◽  
Author(s):  
Barry C. Johnson
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Building Blocks ◽  
Electrical Performance ◽  
Electronic Systems ◽  
Circuit Performance ◽  
Signal Velocity ◽  
Semiconductor Chip ◽  
Thermal Cooling ◽  
The Impact

ABSTRACTHigh Performance Integrated Circuits form the basic building blocks of modern electronic systems that are designed to process ever larger numbers of electrical signals at greater signal velocity and fidelity. In such applications, each circuit must be packaged in order to provide it with necessary mechanical support, environmental protection, electrical interconnection and thermal cooling. The package, however, can also impose certain constraints on the chip. It can degrade electrical performance, add size and weight, introduce reliability problems and increase cost. Thus, packaging can be viewed as a complex balance between the provision of desired functions and the reduction of associated constraints.The ability to strike a proper balance has become increasingly difficult in recent years due to the relentless march of integrated circuits toward higher levels of complexity, size, speed, heat flux and customization. It is anticipated that the continuing evolution of high performance circuits and systems will soon be limited by the package designs and materials-of-construction, rather than by the devices on the semiconductor chip.The intent of this talk is to provide a brief overview of high performance packaging and the related materials issues. The approach is to (a) present the forecasted trends in relevant circuit performance characteristics, (b) discuss the impact of these characteristics on current chip and board level packaging methods, and (c) present new package and materials concepts that might furnish potential solutions to the developing circuit-package performance gap.

Analyzing the Impact of X-Ray Tomography on the Reliability of Integrated Circuits

2015 ◽  
Author(s):  
Halit Dogan ◽  
Md Mahbub Alam ◽  
Navid Asadizanjani ◽  
Sina Shahbazmohamadi ◽  
Domenic Forte ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
3D Imaging ◽  
Three Dimensional ◽  
Serial Sectioning ◽  
Promising Technique ◽  
Flash Memories ◽  
X Ray ◽  
3D Information ◽  
The Impact

Abstract X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies. We perform a 3D imaging using an advanced X-ray machine on Intel flash memories, Macronix flash memories, Xilinx Spartan 3 and Spartan 6 FPGAs. Electrical functionalities are then tested in a systematic procedure after each round of tomography to estimate the impact of X-ray on Flash erase time, read margin, and program operation, and the frequencies of ring oscillators in the FPGAs. A major finding is that erase times for flash memories of older technology are significantly degraded when exposed to tomography, eventually resulting in failure. However, the flash and Xilinx FPGAs of newer technologies seem less sensitive to tomography, as only minor degradations are observed. Further, we did not identify permanent failures for any chips in the time needed to perform tomography for counterfeit detection (approximately 2 hours).

scholarly journals Numerical simulation of the impact of an integrated renovation project on the Maowei Sea hydrodynamic environment

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Cui Wang ◽  
Ling Cai ◽  
Yaojian Wu ◽  
Yurong Ouyang
Keyword(s):  
Water Exchange ◽  
Land Reclamation ◽  
Three Dimensional ◽  
Exchange Capacity ◽  
Reclamation Project ◽  
Hydrodynamic Environment ◽  
Sea Area ◽  
Water Quality Models ◽  
The Impact ◽  
Main Factor

AbstractIntegrated renovation projects are important for marine ecological environment protection. Three-dimensional hydrodynamics and water quality models are developed for the Maowei Sea to assess the hydrodynamic environment base on the MIKE3 software with high resolution meshes. The results showed that the flow velocity changed minimally after the project, decreasing by approximately 0.12 m/s in the east of the Maowei Sea area and increasing by approximately 0.01 m/s in the northeast of the Shajing Port. The decrease in tidal prism (~ 2.66 × 106 m3) was attributed to land reclamation, and accounted for just 0.86% of the pre-project level. The water exchange half-life increased by approximately 1 day, implying a slightly reduced water exchange capacity. Siltation occurred mainly in the reclamation and dredging areas, amounting to back-silting of approximately 2 cm/year. Reclamation project is the main factor causing the decrease of tidal volume and weakening the hydrodynamics in Maowei Sea. Adaptive management is necessary for such a comprehensive regulation project. According to the result, we suggest that reclamation works should strictly prohibit and dredging schemes should optimize in the subsequent regulation works.

scholarly journals Mechanical Behavior of Hydroxyapatite-Chitosan Composite: Effect of Processing Parameters

Minerals ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 213
Author(s):  
Hamid Ait Said ◽  
Hassan Noukrati ◽  
Hicham Ben Youcef ◽  
Ayoub Bayoussef ◽  
Hassane Oudadesse ◽  
...  
Keyword(s):  
Molecular Weight ◽  
Compressive Strength ◽  
Mechanical Strength ◽  
Bone Repair ◽  
Mechanical Stability ◽  
Three Dimensional ◽  
Processing Parameters ◽  
Composite Effect ◽  
Solid Liquid ◽  
The Impact

Three-dimensional hydroxyapatite-chitosan (HA-CS) composites were formulated via solid-liquid technic and freeze-drying. The prepared composites had an apatitic nature, which was demonstrated by X-ray diffraction and Infrared spectroscopy analyses. The impact of the solid/liquid (S/L) ratio and the content and the molecular weight of the polymer on the composite mechanical strength was investigated. An increase in the S/L ratio from 0.5 to 1 resulted in an increase in the compressive strength for HA-CSL (CS low molecular weight: CSL) from 0.08 ± 0.02 to 1.95 ± 0.39 MPa and from 0.3 ± 0.06 to 2.40 ± 0.51 MPa for the HA-CSM (CS medium molecular weight: CSM). Moreover, the increase in the amount (1 to 5 wt%) and the molecular weight of the polymer increased the mechanical strength of the composite. The highest compressive strength value (up to 2.40 ± 0.51 MPa) was obtained for HA-CSM (5 wt% of CS) formulated at an S/L of 1. The dissolution tests of the HA-CS composites confirmed their cohesion and mechanical stability in an aqueous solution. Both polymer and apatite are assumed to work together, giving the synergism needed to make effective cylindrical composites, and could serve as a promising candidate for bone repair in the orthopedic field.

Design of a Robust Memristive Spiking Neuromorphic System with Unsupervised Learning in Hardware

2021 ◽  
Vol 17 (4) ◽  
pp. 1-26
Author(s):  
Md Musabbir Adnan ◽  
Sagarvarma Sayyaparaju ◽  
Samuel D. Brown ◽  
Mst Shamim Ara Shawkat ◽  
Catherine D. Schuman ◽  
...  
Keyword(s):  
Unsupervised Learning ◽  
Recognition Task ◽  
Single Layer ◽  
Process Variations ◽  
Spike Timing ◽  
System Level ◽  
Design Parameters ◽  
Digital Pulse ◽  
Neuromorphic System ◽  
The Impact

Spiking neural networks (SNN) offer a power efficient, biologically plausible learning paradigm by encoding information into spikes. The discovery of the memristor has accelerated the progress of spiking neuromorphic systems, as the intrinsic plasticity of the device makes it an ideal candidate to mimic a biological synapse. Despite providing a nanoscale form factor, non-volatility, and low-power operation, memristors suffer from device-level non-idealities, which impact system-level performance. To address these issues, this article presents a memristive crossbar-based neuromorphic system using unsupervised learning with twin-memristor synapses, fully digital pulse width modulated spike-timing-dependent plasticity, and homeostasis neurons. The implemented single-layer SNN was applied to a pattern-recognition task of classifying handwritten-digits. The performance of the system was analyzed by varying design parameters such as number of training epochs, neurons, and capacitors. Furthermore, the impact of memristor device non-idealities, such as device-switching mismatch, aging, failure, and process variations, were investigated and the resilience of the proposed system was demonstrated.

scholarly journals Impact of inter-reader contouring variability on textural radiomics of colorectal liver metastases

2020 ◽  
Vol 4 (1) ◽  
Author(s):  
Francesco Rizzetto ◽  
Francesca Calderoni ◽  
Cristina De Mattia ◽  
Arianna Defeudis ◽  
Valentina Giannini ◽  
...  
Keyword(s):  
Liver Metastases ◽  
Hausdorff Distance ◽  
Intraclass Correlation ◽  
Three Dimensional ◽  
Liver Lesion ◽  
Dice Coefficient ◽  
Rf Values ◽  
Enhanced Computed Tomography ◽  
Relative Change ◽  
The Impact

Abstract Background Radiomics is expected to improve the management of metastatic colorectal cancer (CRC). We aimed at evaluating the impact of liver lesion contouring as a source of variability on radiomic features (RFs). Methods After Ethics Committee approval, 70 liver metastases in 17 CRC patients were segmented on contrast-enhanced computed tomography scans by two residents and checked by experienced radiologists. RFs from grey level co-occurrence and run length matrices were extracted from three-dimensional (3D) regions of interest (ROIs) and the largest two-dimensional (2D) ROIs. Inter-reader variability was evaluated with Dice coefficient and Hausdorff distance, whilst its impact on RFs was assessed using mean relative change (MRC) and intraclass correlation coefficient (ICC). For the main lesion of each patient, one reader also segmented a circular ROI on the same image used for the 2D ROI. Results The best inter-reader contouring agreement was observed for 2D ROIs according to both Dice coefficient (median 0.85, interquartile range 0.78–0.89) and Hausdorff distance (0.21 mm, 0.14–0.31 mm). Comparing RF values, MRC ranged 0–752% for 2D and 0–1567% for 3D. For 24/32 RFs (75%), MRC was lower for 2D than for 3D. An ICC > 0.90 was observed for more RFs for 2D (53%) than for 3D (34%). Only 2/32 RFs (6%) showed a variability between 2D and circular ROIs higher than inter-reader variability. Conclusions A 2D contouring approach may help mitigate overall inter-reader variability, albeit stable RFs can be extracted from both 3D and 2D segmentations of CRC liver metastases.

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