scholarly journals Fully-Differential TPoS Resonators Based on Dual Interdigital Electrodes for Feedthrough Suppression

Micromachines ◽  
2020 ◽  
Vol 11 (2) ◽  
pp. 119 ◽  
Author(s):  
Yi Zhang ◽  
Jing-Fu Bao ◽  
Xin-Yi Li ◽  
Xin Zhou ◽  
Zhao-Hui Wu ◽  
...  
Keyword(s):  
Fundamental Principle ◽  
Electrical Measurements ◽  
Element Analysis ◽  
Micro Electro Mechanical Systems ◽  
Fully Differential ◽  
Mems Resonator ◽  
Interdigital Electrodes ◽  
Negative Effect ◽  
Phase Signal ◽  
On Chip

As one of the core components of MEMS (i.e., micro-electro-mechanical systems), thin-film piezoelectric-on-silicon (TPoS) resonators experienced a blooming development in the past decades due to unique features such as a remarkable capability of integration for attractive applications of system-on-chip integrated timing references. However, the parasitic capacitive feedthrough poses a great challenge to electrical detection of resonance in a microscale silicon-based mechanical resonator. Herein, a fully-differential configuration of a TPoS MEMS resonator based on a novel structural design of dual interdigital electrodes is proposed to eliminate the negative effect of feedthrough. The fundamental principle of feedthrough suppression was comprehensively investigated by using FEA (i.e., finite-element analysis) modeling and electrical measurements of fabricated devices. It was shown that with the help of fully-differential configuration, the key parameter of SBR (i.e., signal-to-background ratio) was significantly enhanced by greatly suppressing the in-phase signal. The S-parameter measurement results further verified the effectiveness of this novel feedthrough suppression strategy, and the insertion loss and SBR of proposed TPoS resonators were improved to 4.27 dB and 42.47 dB, respectively.

A two degrees of freedom comb capacitive-type accelerometer with low cross-axis sensitivity

2019 ◽  
Vol 13 (3) ◽  
pp. 5334-5346
Author(s):  
M. N. Nguyen ◽  
L. Q. Nguyen ◽  
H. M. Chu ◽  
H. N. Vu
Keyword(s):  
Degrees Of Freedom ◽  
Proof Mass ◽  
Vibration Modes ◽  
Electrode Structure ◽  
Element Analysis ◽  
Mechanical Coupling ◽  
Fully Differential ◽  
Mode Effects ◽  
The Finite Element Analysis ◽  
Cross Axis

In this paper, we report on a SOI-based comb capacitive-type accelerometer that senses acceleration in two lateral directions. The structure of the accelerometer was designed using a proof mass connected by four folded-beam springs, which are compliant to inertial displacement causing by attached acceleration in the two lateral directions. At the same time, the folded-beam springs enabled to suppress cross-talk causing by mechanical coupling from parasitic vibration modes. The differential capacitor sense structure was employed to eliminate common mode effects. The design of gap between comb fingers was also analyzed to find an optimally sensing comb electrode structure. The design of the accelerometer was carried out using the finite element analysis. The fabrication of the device was based on SOI-micromachining. The characteristics of the accelerometer have been investigated by a fully differential capacitive bridge interface using a sub-fF switched-capacitor integrator circuit. The sensitivities of the accelerometer in the two lateral directions were determined to be 6 and 5.5 fF/g, respectively. The cross-axis sensitivities of the accelerometer were less than 5%, which shows that the accelerometer can be used for measuring precisely acceleration in the two lateral directions. The accelerometer operates linearly in the range of investigated acceleration from 0 to 4g. The proposed accelerometer is expected for low-g applications.

scholarly journals A Stochastic Model to Describe the Scattering in the Response of Polysilicon MEMS

2021 ◽  
Vol 2 (1) ◽  
pp. 95
Author(s):  
Luca Dassi ◽  
Marco Merola ◽  
Eleonora Riva ◽  
Angelo Santalucia ◽  
Andrea Venturelli ◽  
...  
Keyword(s):  
Silicon Film ◽  
Micro Fabrication ◽  
Micro Electro Mechanical Systems ◽  
Local Fluctuations ◽  
Stochastic Framework ◽  
On Line ◽  
Chip Testing ◽  
On Chip ◽  
Time Required ◽  
Polycrystalline Silicon Film

The current miniaturization trend in the market of inertial microsystems is leading to movable device parts with sizes comparable to the characteristic length-scale of the polycrystalline silicon film morphology. The relevant output of micro electro-mechanical systems (MEMS) is thus more and more affected by a scattering, induced by features resulting from the micro-fabrication process. We recently proposed an on-chip testing device, specifically designed to enhance the aforementioned scattering in compliance with fabrication constraints. We proved that the experimentally measured scattering cannot be described by allowing only for the morphology-affected mechanical properties of the silicon films, and etch defects must be properly accounted for too. In this work, we discuss a fully stochastic framework allowing for the local fluctuations of the stiffness and of the etch-affected geometry of the silicon film. The provided semi-analytical solution is shown to catch efficiently the measured scattering in the C-V plots collected through the test structure. This approach opens up the possibility to learn on-line specific features of the devices, and to reduce the time required for their calibration.

The Finite Element Analysis and Optimization of Wave-Framebased on ANSYS

2013 ◽  
Vol 391 ◽  
pp. 168-171
Author(s):  
Shou Jun Wang ◽  
Li Bo Yang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Factor Of Safety ◽  
Wave System ◽  
Element Analysis ◽  
The Finite Element Analysis ◽  
Negative Effect ◽  
Empirical Design

When it comes to the design of a wave-frame,empirical design is always adopted domestic,which is relatively conservative on stiffness and intensity and prefer a bigger factor of safety,thus these bring many uncertainties to the wave-frame.In order to reduce the negative effect to the wave system,the analysis of the wave-frame based on ANSYS is executed to have a knowledge of the weakness and the deformation of various parts.On the permise of ensuring the stiffness and intensity,with the method of grouping and using different profile steel,the purpose is to reduce the mass snd the negative effect brought by mass,and achieve the goal of optimization.

scholarly journals Reinforcing Effect of Carbon Nanotubes/Surfactant Dispersions in Portland Cement Pastes

2018 ◽  
Vol 2018 ◽  
pp. 1-9 ◽  
Author(s):  
Oscar A. Mendoza Reales ◽  
Caterin Ocampo ◽  
Yhan Paul Arias Jaramillo ◽  
Juan Carlos Ochoa Botero ◽  
Jorge Hernán Quintero ◽  
...  
Keyword(s):  
Carbon Nanotubes ◽  
Cement Matrix ◽  
Multiwalled Carbon ◽  
Element Analysis ◽  
Cement Pastes ◽  
Reinforcing Effect ◽  
Linear Elastic ◽  
Crack Propagation Process ◽  
Negative Effect ◽  
The Individual

Decoupling the individual effects of multiwalled carbon nanotubes (MWCNTs) and surfactants when used as reinforcement materials in cement-based composites is aimed in this study. Powder MWCNTs were dispersed in deionized water using different types of surfactants as chemical dispersing agents and an ultrasonic tip processor. Cement pastes with carbon nanotubes additions of 0.15% by mass of cement were produced in two steps: first, the MWCNT/surfactant dispersions were combined with the mixing water, and then, cement was added and mixed until a homogeneous paste was obtained. Mechanical properties of the pastes cured at 7 days were measured, and their fracture behavior was characterized using the linear elastic finite element analysis. It was found that the reinforcing effect of MWCNT was masked by the negative effect of surfactants in the cement matrix; nevertheless, nanotubes were capable of increasing both stress and strain capacity of the composite by controlling the crack propagation process at the tip of the crack.

INTEGRATED 3D MULTI-PHYSICAL SIMULATION OF A MICROFLUIDIC SYSTEM USING FINITE ELEMENT ANALYSIS

2015 ◽  
Vol 15 (06) ◽  
pp. 1540043 ◽  
Author(s):  
HAO SUN ◽  
ZHANDONG LI ◽  
JIANGUO TAO
Keyword(s):  
Finite Element ◽  
Physical Simulation ◽  
Microfluidic System ◽  
Von Mises Stress ◽  
Biomedical Science ◽  
Heating Zone ◽  
Element Analysis ◽  
Theoretical Understanding ◽  
Velocity Magnitude ◽  
On Chip

Microfluidics technology has emerged as an attractive approach in physics, chemistry and biomedical science by providing increased analytical accuracy, sensitivity and efficiency in minimized systems. Numerical simulation can improve theoretical understanding, reduce prototyping consumption, and speed up development. In this paper, we setup a 3D model of an integrated microfluidic system and study the multi-physical dynamics of the system via the finite element method (FEM). The fluid–structure interaction (FSI) of fluid and an immobilized single cell within the cell trapping component, and the on-chip thermodynamics have been analyzed. The velocity magnitude and streamline of flow field, the distribution of von Mises stress and Tresca stress on the FSI interface have been studied. In addition, the on-chip heat transfer performance and temperature distribution in the heating zone have been evaluated and analyzed respectively. The presented approach is capable of optimizing microfluidic design, and revealing the complicated mechanism of multi-physical fields. Therefore, it holds the potential for improving microfluidics application in fundamental research and clinical settings.

scholarly journals Microfluidic and Micromachined/MEMS Devices for Separation, Discrimination and Detection of Airborne Particles for Pollution Monitoring

Micromachines ◽  
2019 ◽  
Vol 10 (7) ◽  
pp. 483 ◽  
Author(s):  
Daniel Puiu Poenar
Keyword(s):  
Optical Scattering ◽  
Pollution Monitoring ◽  
Detection Methods ◽  
Mems Devices ◽  
Micro Electro Mechanical Systems ◽  
Lab On Chip ◽  
Inorganic Particles ◽  
Advantages And Disadvantages ◽  
Air Quality Assessment ◽  
On Chip

Most of the microfluidics-related literature describes devices handling liquids, with only a small part dealing with gas-based applications, and a much smaller number of papers are devoted to the separation and/or detection of airborne inorganic particles. This review is dedicated to this rather less known field which has become increasingly important in the last years due to the growing attention devoted to pollution monitoring and air quality assessment. After a brief introduction summarizing the main particulate matter (PM) classes and the need for their study, the paper reviews miniaturized devices and/or systems for separation, detection and quantitative assessment of PM concentration in air with portable and easy-to-use platforms. The PM separation methods are described first, followed by the key detection methods, namely optical (scattering) and electrical. The most important miniaturized reported realizations are analyzed, with special attention given to microfluidic and micromachined or micro-electro-mechanical systems (MEMS) chip-based implementations due to their inherent capability of being integrated in lab-on-chip (LOC) type of smart microsystems with increased functionalities that can be portable and are easy to use. The operating principles and (when available) key performance parameters of such devices are presented and compared, also highlighting their advantages and disadvantages. Finally, the most relevant conclusions are discussed in the last section.

The Effect of Residual Stresses on the Fracture Resistance of Ductile Steels

2002 ◽  
Author(s):  
Noel P. O’Dowd ◽  
Yuebao Lei
Keyword(s):  
Residual Stress ◽  
Stress Field ◽  
Residual Stresses ◽  
Crack Opening ◽  
Stress Distributions ◽  
Residual Stress Field ◽  
Element Analysis ◽  
Fatigue And Fracture ◽  
Negative Effect ◽  
Fracture Performance

Tensile residual stresses, such as those generated by welding, act as crack opening stresses and can have a negative effect on the fatigue and fracture performance of a component. In this work the effect of representative residual stress distributions on the fracture behaviour of a ferritic steel has been examined using finite element analysis. A Gurson-type void growth model is used to model the effect of ductile tearing ahead of a crack. For the cases examined it is seen that a tensile residual stress field may lead to a reduction in the toughness of the material (as represented by the J-resistance curve). The observed difference in toughness can be linked to the different constraint levels in the specimens due to the introduction of the residual stress field and can be rationalised through the use of a two parameter, J–Q approach.

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