scholarly journals Silicone Elastomer Composites Fabricated with MgO and MgO-Multi-Wall Carbon Nanotubes with Improved Thermal Conductivity

Nanomaterials ◽  
2021 ◽  
Vol 11 (12) ◽  
pp. 3418
Author(s):  
Christopher Kagenda ◽  
Jae Wook Lee ◽  
Fida Hussain Memon ◽  
Faheem Ahmed ◽  
Anupama Samantasinghar ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Silicone Rubber ◽  
Multiwall Carbon Nanotubes ◽  
Silicone Elastomer ◽  
Thermal Interface Materials ◽  
Multi Wall Carbon Nanotubes ◽  
Elastomer Composites ◽  
Conductive Properties ◽  
Interface Materials

The effect of multiwall carbon nanotubes (MWCNTs) and magnesium oxide (MgO) on the thermal conductivity of MWCNTs and MgO-reinforced silicone rubber was studied. The increment of thermal conductivity was found to be linear with respect to increased loading of MgO. In order to improve the thermal transportation of phonons 0.3 wt % and 0.5 wt % of MWCNTs were added as filler to MgO-reinforced silicone rubber. The MWCNTs were functionalized by hydrogen peroxide (H2O2) to activate organic groups onto the surface of MWCNTs. These functional groups improved the compatibility and adhesion and act as bridging agents between MWCNTs and silicone elastomer, resulting in the formation of active conductive pathways between MgO and MWCNTs in the silicone elastomer. The surface functionalization was confirmed with XRD and FTIR spectroscopy. Raman spectroscopy confirms the pristine structure of MWCNTs after oxidation with H2O2. The thermal conductivity is improved to 1 W/m·K with the addition of 20 vol % with 0.5 wt % of MWCNTs, which is an ~8-fold increment in comparison to neat elastomer. Improved thermal conductive properties of MgO-MWCNTs elastomer composite will be a potential replacement for conventional thermal interface materials.

Bond Line Thickness of Thermal Interface Materials With Carbon Nanotubes

2005 ◽  
Author(s):  
Senthil A. G. Singaravelu ◽  
Xuejiao Hu ◽  
Kenneth E. Goodson
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Volume Fraction ◽  
Bond Line ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Line Thickness ◽  
Bond Line Thickness ◽  
The Impact ◽  
Interface Materials

Increasing power dissipation in today’s microprocessors demands thermal interface materials (TIMs) with lower thermal resistances. The TIM thermal resistance depends on the TIM thermal conductivity and the bond line thickness (BLT). Carbon Nanotubes (CNTs) have been proposed to improve the TIM thermal conductivity. However, the rheological properties of TIMs with CNT inclusions are not well understood. In this paper, the transient behavior of the BLT of the TIMs with CNT inclusions has been measured under controlled attachment pressures. The experimental results show that the impact of CNT inclusions on the BLT at low volume fractions (up to 2 vol%) is small; however, higher volume fraction of CNT inclusions (5 vol%) can cause huge increase in TIM thickness. Although thermal conductivities are higher for higher CNT fractions, a minimum TIM resistance exists at some optimum CNT fraction for a given attachment pressure.

Comparison between CNT Thermal Interface Materials with Graphene Thermal Interface Material in Term of Thermal Conductivity

2020 ◽  
Vol 1010 ◽  
pp. 160-165
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Nor Zaiazmin Yahaya ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Mixed Material ◽  
Interface Materials ◽  
Main Material

Thermal interface material (TIM) had been well conducted and developed by using several material as based material. A lot of combination and mixed material were used to increase thermal properties of TIM. Combination between materials for examples carbon nanotubes (CNT) and epoxy had had been used before but the significant of the studied are not exactly like predicted. In this studied, thermal interface material using graphene and CNT as main material were used to increase thermal conductivity and thermal contact resistance. These two types of TIM had been compare to each other in order to find wich material were able to increase the thermal conductivity better. The sample that contain 20 wt. %, 40 wt. % and 60 wt. % of graphene and CNT were used in this studied. The thermal conductivity of thermal interface material is both measured and it was found that TIM made of graphene had better thermal conductivity than CNT. The highest thermal conductivity is 23.2 W/ (mK) with 60 w. % graphene meanwhile at 60 w. % of CNT only produce 12.2 W/ (mK thermal conductivity).

scholarly journals A Meta-study on the Thermal Properties of Carbon Nanotubes in Thermal Interface Materials

2019 ◽  
Vol 6 ◽  
pp. 16-27
Author(s):  
Scott Clarkson ◽  
Asah H Khan ◽  
Dipendra Singh
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Integrated Circuit ◽  
Operation Time ◽  
Transfer Efficiency ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Thermal Paste ◽  
Thermal Transfer ◽  
Interface Materials

Computer Integrated Circuit (IC) microprocessors are becoming more powerful and densely packed while cooling mechanisms are seeing an equivalent improvement to compensate. A significant limit to cooling performance is thermal transfer between die and heatsink. In this meta study we evaluate carbon nanotube (CNT) thermal interface materials (TIMs) in order to determine how to maximise thermal transfer efficiency. We gathered information from over 15 articles focused on the thermodynamic parameters of CNT TIMs from databases such as Scopus, IEEE Xplore and ScienceDirect. Articles were filtered by key words including ‘carbon nanotubes’ and ‘thermal interface materials’ to identify scientific articles relevant to our research on TIMs. From our meta study we have found that enhancing CNTs will provide the best improvement in TIMs. The parameters analysed to determine TIM performance included thermal resistance, thermal conductivity and the effect of CNT concentration on computer operation time. Through our investigation we understood that increasing the concentration of CNT from 0 to 2 wt % increases the operation time from 75 seconds at 66°C to 200s at 63°C as well as increasing the thermal conductivity by 1.82 times for the AS5 thermal paste with 2 wt % CNT. Furthermore, CNT TIM pastes with less thickness have a lower thermal resistance of 0.4 K/W. However not all these parameters have been tested with computer chips. This means that in order to increase current heat transfer efficiency limit, we must integrate these parameters into experimental models. Keywords: Thermal Interface Material; Thermal Paste; Carbon Nanotubes; Thermal Transfer Efficiency; Integrated Circuit; Heat Sink; Heat Dissipation.

scholarly journals THERMAL CONDUCTANCE OF HELICALLY COILED CARBON NANOTUBES

2014 ◽  
Vol 5 (1) ◽  
Author(s):  
Zoran Popović ◽  
Milan Damnjanović ◽  
Ivanka Milošević
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Phonon Dispersion ◽  
Thermal Conductance ◽  
Phonon Transport ◽  
Dynamics Simulation ◽  
Vector Model ◽  
Thermal Interface Materials ◽  
Interface Materials ◽  
Phonon Dispersion Relations

Thermal conductivity is one of the most interesting physical properties of carbon nanotubes. This quantity has been extensively explored experimentally and theoretically using different approaches like: molecular dynamics simulation, Boltzmann-Peierls phonon transport equation, modified wave-vector model etc. Results of these investigations are of great interest and show that carbon- based materials, graphene and nanotubes in particular, show high values of thermal conductivity. Thus, carbon nanotubes are a good candidate for the future applications as thermal interface materials. In this paper we present the results of thermal conductance s of a model of helically coiled carbon nanotubes (HCCNTs), obtained from phonon dispersion relations. Calculation of s of HCCNTs is based on the Landauer theory where phonon relaxation rate is obtained by simple Klemens-like model.

Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

2003 ◽  
Author(s):  
Vadim Gektin ◽  
Sai Ankireddi ◽  
Jim Jones ◽  
Stan Pecavar ◽  
Paul Hundt
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Performance ◽  
Electronic Cooling ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Contact ◽  
Interface Materials ◽  
Bulk Thermal Conductivity

Thermal Interface Materials (TIMs) are used as thermally conducting media to carry away the heat dissipated by an energy source (e.g. active circuitry on a silicon die). Thermal properties of these interface materials, specified on vendor datasheets, are obtained under conditions that rarely, if at all, represent real life environment. As such, they do not accurately portray the material thermal performance during a field operation. Furthermore, a thermal engineer has no a priori knowledge of how large, in addition to the bulk thermal resistance, the interface contact resistances are, and, hence, how much each influences the cooling strategy. In view of these issues, there exists a need for these materials/interfaces to be characterized experimentally through a series of controlled tests before starting on a thermal design. In this study we present one such characterization for a candidate thermal interface material used in an electronic cooling application. In a controlled test environment, package junction-to-case, Rjc, resistance measurements were obtained for various bondline thicknesses (BLTs) of an interface material over a range of die sizes. These measurements were then curve-fitted to obtain numerical models for the measured thermal resistance for a given die size. Based on the BLT and the associated thermal resistance, the bulk thermal conductivity of the TIM and the interface contact resistance were determined, using the approach described in the paper. The results of this study permit sensitivity analyses of BLT and its effect on thermal performance for future applications, and provide the ability to extrapolate the results obtained for the given die size to a different die size. The suggested methodology presents a readily adaptable approach for the characterization of TIMs and interface/contact resistances in the industry.

scholarly journals Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1201 ◽  
Author(s):  
Le Lv ◽  
Wen Dai ◽  
Aijun Li ◽  
Cheng-Te Lin
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Electronic Devices ◽  
Point Of View ◽  
Future Research ◽  
Thermal Interface Materials ◽  
Research Directions ◽  
Thermal Interface ◽  
Future Research Directions ◽  
Interface Materials

With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performance graphene-based TIMs are also discussed.

scholarly journals Thermal Properties of the Graphene Composites: Application of Thermal Interface Materials

2018 ◽  
Vol 7 (4.33) ◽  
pp. 530
Author(s):  
Mazlan Mohamed ◽  
Mohd Nazri Omar ◽  
Mohamad Shaiful Ashrul Ishak ◽  
Rozyanty Rahman ◽  
Zaiazmin Y.N ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Matrix Material ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Uniform Thickness ◽  
Thermal Interface ◽  
Interface Materials ◽  
Main Material

Epoxy mixed with others filler for thermal interface material (TIM) had been well conducted and developed. There are problem occurs when previous material were used as matrix material likes epoxy that has non-uniform thickness of thermal interface material produce, time taken for solidification and others. Thermal pad or thermal interface material using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity and thermal contact resistance. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10 wt. %, 20 wt. % and 30 wt. % of graphene was used with different contain of graphene oxide (GO).  The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/ (mK) with 30 w. % graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene-epoxy is an excellent thermal interface material in increasing thermal conductivity.  

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