scholarly journals Fully Integrated on-Chip Switched DC–DC Converter for Battery-Powered Mixed-Signal SoCs

Symmetry ◽  
2017 ◽  
Vol 9 (1) ◽  
pp. 18 ◽  
Author(s):  
Heungjun Jeon ◽  
Kyung Kim ◽  
Yong-Bin Kim
Author(s):  
Fabio Aquilino ◽  
Francesco G. Della Corte ◽  
Letizia Fragomeni ◽  
Massimo Merenda ◽  
Fabio Zito

Electronics ◽  
2021 ◽  
Vol 10 (1) ◽  
pp. 68
Author(s):  
Woorham Bae ◽  
Sung-Yong Cho ◽  
Deog-Kyoon Jeong

This paper presents a fully integrated Peripheral Component Interconnect (PCI) Express (PCIe) Gen4 physical layer (PHY) transmitter. The prototype chip is fabricated in a 28 nm low-power CMOS process, and the active area of the proposed transmitter is 0.23 mm2. To enable voltage scaling across wide operating rates from 2.5 Gb/s to 16 Gb/s, two on-chip supply regulators are included in the transmitter. At the same time, the regulators maintain the output impedance of the transmitter to meet the return loss specification of the PCIe, by including replica segments of the output driver and reference resistance in the regulator loop. A three-tap finite-impulse-response (FIR) equalization is implemented and, therefore, the transmitter provides more than 9.5 dB equalization which is required in the PCIe specification. At 16 Gb/s, the prototype chip achieves energy efficiency of 1.93 pJ/bit including all the interface, bias, and built-in self-test circuits.


2021 ◽  
Vol 11 (2) ◽  
pp. 22
Author(s):  
Umberto Ferlito ◽  
Alfio Dario Grasso ◽  
Michele Vaiana ◽  
Giuseppe Bruno

Charge-Based Capacitance Measurement (CBCM) technique is a simple but effective technique for measuring capacitance values down to the attofarad level. However, when adopted for fully on-chip implementation, this technique suffers output offset caused by mismatches and process variations. This paper introduces a novel method that compensates the offset of a fully integrated differential CBCM electronic front-end. After a detailed theoretical analysis of the differential CBCM topology, we present and discuss a modified architecture that compensates mismatches and increases robustness against mismatches and process variations. The proposed circuit has been simulated using a standard 130-nm technology and shows a sensitivity of 1.3 mV/aF and a 20× reduction of the standard deviation of the differential output voltage as compared to the traditional solution.


Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 1018
Author(s):  
Giuseppe Fiorentino ◽  
Ben Jones ◽  
Sophie Roth ◽  
Edith Grac ◽  
Murali Jayapala ◽  
...  

A composite, capillary-driven microfluidic system suitable for transmitted light microscopy of cells (e.g., red and white human blood cells) is fabricated and demonstrated. The microfluidic system consists of a microchannels network fabricated in a photo-patternable adhesive polymer on a quartz substrate, which, by means of adhesive bonding, is then connected to a silicon microfluidic die (for processing of the biological sample) and quartz die (to form the imaging chamber). The entire bonding process makes use of a very low temperature budget (200 °C). In this demonstrator, the silicon die consists of microfluidic channels with transition structures to allow conveyance of fluid utilizing capillary forces from the polymer channels to the silicon channels and back to the polymer channels. Compared to existing devices, this fully integrated platform combines on the same substrate silicon microfluidic capabilities with optical system analysis, representing a portable and versatile lab-on-chip device.


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