Copper Plating on the Carbon Fibers by Double Pulse
The effects of positive and reverse working time, electroplating time, current density, duty cycle on the weight-gain rate were investigated. The optimized technical parameters were as follows: room temperature, 300 ms of positive working time, 30 ms of reverse working time, 40% of duty cycle, 8.20 ×10-5 A/mm2 of current density, 6 min of electroplating time. The quality of copper coating was checked with SEM. The adhesion between the coating and carbon fibers was tested by the method of psychro-thermal cycles. Additionally, comparison to pulse plating and direct current plating was made. The obtained results showed that a flat, detailed and well-crystalloid copper coating on the carbon fiber surface was obtained with the present conditions. The adhesion between the coating and carbon fibers was 450kPa.