Response of Hot-Extruded Al-Mn-Sc-Zr Alloy to Annealing with Constant Heating Rate

2013 ◽  
Vol 334-335 ◽  
pp. 161-166 ◽  
Author(s):  
Martin Vlach ◽  
Ivana Stulíková ◽  
Bohumil Smola ◽  
Hana Císařová ◽  
Tomáš Kekule ◽  
...  
Keyword(s):  
Electron Backscatter Diffraction ◽  
Hot Extrusion ◽  
Grain Structure ◽  
Constant Heating Rate ◽  
Phase Precipitation ◽  
Electron Backscatter ◽  
Constant Heating ◽  
Backscatter Diffraction ◽  
Scanning Electron ◽  
Zr Alloy

The effect of hot extrusion at 350°C on microstructure, thermal, electrical and mechanical properties of the AlMnScZr alloy was studied. The samples of the cast and of the hot-extruded alloys were annealed from 20°C up to 600°C. Transmission and scanning electron microscopy and electron backscatter diffraction examinations of specimens quenched from temperatures of significant resistivity changes were used to identify microstructural processes responsible for these changes. The cast as well as hot-extruded alloy is characterized by a dispersion of fine coherent Al3Sc and/or Al3(Sc,Zr) particles, and furthermore the fine (sub) grain structure was observed in the hot-extruded alloy. Microhardness HV1 and resistivity values reflect different microstructure of the alloys accordingly. The distinct resistivity changes of the alloys are mainly caused by precipitation of Mn-containing particles. The apparent activation energy for the Al6Mn-phase precipitation in the hot-extruded alloy was also determined. The obtained results agree with those observed in the alloys prepared by powder metallurgy studied in our previous work.

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

Shear Pressing for Grain Refinement of Al-Mg-Li Sheet

2007 ◽  
Vol 546-549 ◽  
pp. 885-888
Author(s):  
Yu Xuan Du ◽  
Xin Ming Zhang ◽  
Ling Ying Ye ◽  
Zhi Hui Luo
Keyword(s):  
Shear Deformation ◽  
Grain Refinement ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Grain Refining ◽  
Metallic Materials ◽  
Inclined Plane ◽  
Fine Grained ◽  
Electron Backscatter ◽  
Backscatter Diffraction

A novel shear-deformation technique, named ‘shear pressing’ (SP), was developed for fabrication of plate-shaped fine grained metallic materials. The principle of SP is that a material is subjected to shear deformation by utilizing pressing with inclined plane dies. A micrometer order grain structure was obtained in an Al-Mg-Li alloy at strain of ε = -2.3 by utilizing this technique. The grain refinement sequences during pressing were examined by electron backscatter diffraction. The enhancement of grain refinement to the Al-Mg-Li alloy was compared with plane strain compression (PSC) at similar strains. The effect of the shear strain on the accelerated grain refining during compressing has been discussed.

All You Need to Know About Electron Backscatter Diffraction: Orientation is Only the Tip of the Iceberg

1997 ◽  
Vol 3 (S2) ◽  
pp. 387-388 ◽  
Author(s):  
J. R. Michael
Keyword(s):  
Electron Backscatter Diffraction ◽  
Photographic Film ◽  
Phase Identification ◽  
Electron Backscattered Diffraction ◽  
Bulk Specimen ◽  
Electron Backscatter ◽  
Backscatter Diffraction ◽  
Over 40 Years ◽  
Orientation Determination ◽  
Scanning Electron

This tutorial will describe the technique of electron backscattered diffraction (EBSD) in the scanning electron microscope (SEM). To properly exploit EBSD in the SEM it is important to understand how these patterns are formed. This discussion will be followed by a description of the hardware required for the collection of electron backscatter patterns (EBSP). We will then discuss the methods used to extract the appropriate crystallographic information from the patterns for orientation determination and phase identification and how these operations can be automated. Following this, a number of applications of the technique for both orientation studies and phase identification will be discussed.EBSD in the SEM is a phenomenon that has been known for many years. EBSD in the SEM is a technique that permits the crystallography of sub-micron sized regions to be studied from a bulk specimen. These patterns were first observed over 40 years ago, before the development of the SEM and were recorded using a special chamber and photographic film.

Angular Precision of Automated Electron Backscatter Diffraction Measurements

2011 ◽  
Vol 702-703 ◽  
pp. 548-553 ◽  
Author(s):  
Stuart I. Wright ◽  
Jay A. Basinger ◽  
Matthew M. Nowell
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Hough Transform ◽  
Angular Resolution ◽  
Electron Backscatter Diffraction ◽  
Electron Backscatter ◽  
Individual Grains ◽  
Backscatter Diffraction ◽  
Work First ◽  
Scanning Electron

Electron backscatter diffraction (EBSD) has become the preferred technique for characterizing the crystallographic orientation of individual grains in polycrystalline microstructures due to its ability to rapidly measure orientations at specific points in the microstructure at resolutions of approximately 20-50nm depending on the capabilities of the scanning electron microscope (SEM) and on the material being characterized. Various authors have studied the angular resolution of the orientations measured using automated EBSD. These studies have stated values ranging from approximately 0.1° to 2° [1-6]. Various factors influence the angular resolution achievable. The two primary factors are the accuracy of the detection of the bands in the EBSD patterns and the accuracy of the pattern center (PC) calibration. The band detection is commonly done using the Hough transform. The effect of varying the Hough transform parameters in order to optimize speed has been explored in a previous work [6]. The present work builds upon the earlier work but with the focus towards achieving the best angular resolution possible regardless of speed. This work first details the methodology used to characterize the angular precision then reports on various approaches to optimizing parameters to improve precision.

scholarly journals Non-Modulated Martensite Microstructure With Internal Nanotwins In Ni-Mn-Ga Alloys

2015 ◽  
Vol 60 (3) ◽  
pp. 2267-2270 ◽  
Author(s):  
M.J. Szczerba
Keyword(s):  
Electron Backscatter Diffraction ◽  
Martensite Plate ◽  
The Self ◽  
The Third ◽  
Incoherent Interface ◽  
Electron Backscatter ◽  
Micro Level ◽  
Backscatter Diffraction ◽  
Martensite Microstructure ◽  
Scanning Electron

Abstract The self-accommodated non-modulated martensite of Ni-Mn-Ga single crystal was studied by transmission and scanning electron microscopy in the latter case using the electron backscatter diffraction technique. Three kinds of interfaces existing at different length scales were reported. The first, is the wavy and incoherent interface separating martensite variants observed on the micro-level with no-common crystallographic plane between them. The second is within a single martensite plate where the lattice rotates around one of the {110} pole to accommodate the interfacial curvature between martensite plates. Finally, at the nanoscale the third interface exists, a twin boundary separating internal nanotwins with the {112} type habit plane.

Formation of Nanoporous Gold Studied by Transmission Electron Backscatter Diffraction

2015 ◽  
Vol 21 (6) ◽  
pp. 1387-1397 ◽  
Author(s):  
Leo T.H. de Jeer ◽  
Diego Ribas Gomes ◽  
Jorrit E. Nijholt ◽  
Rik van Bremen ◽  
Václav Ocelík ◽  
...  
Keyword(s):  
Crystallographic Texture ◽  
Manufacturing Process ◽  
Electron Backscatter Diffraction ◽  
Nanoporous Materials ◽  
Nanoporous Gold ◽  
Grain Structure ◽  
Misorientation Distribution ◽  
Transmission Electron ◽  
Electron Backscatter ◽  
Backscatter Diffraction

AbstractTransmission electron backscatter diffraction (t-EBSD) was used to investigate the effect of dealloying on the microstructure of 140-nm thin gold foils. Statistical and local comparisons of the microstructure between the nonetched and nanoporous gold foils were made. Analyses of crystallographic texture, misorientation distribution, and grain structure clearly prove that during the dealloying manufacturing process of nanoporous materials the crystallographic texture is enhanced significantly with a clear decrease of internal strain, whereas maintaining the grain structure.

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