Shear Pressing for Grain Refinement of Al-Mg-Li Sheet

2007 ◽  
Vol 546-549 ◽  
pp. 885-888
Author(s):  
Yu Xuan Du ◽  
Xin Ming Zhang ◽  
Ling Ying Ye ◽  
Zhi Hui Luo
Keyword(s):  
Shear Deformation ◽  
Grain Refinement ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Grain Refining ◽  
Metallic Materials ◽  
Inclined Plane ◽  
Fine Grained ◽  
Electron Backscatter ◽  
Backscatter Diffraction

A novel shear-deformation technique, named ‘shear pressing’ (SP), was developed for fabrication of plate-shaped fine grained metallic materials. The principle of SP is that a material is subjected to shear deformation by utilizing pressing with inclined plane dies. A micrometer order grain structure was obtained in an Al-Mg-Li alloy at strain of ε = -2.3 by utilizing this technique. The grain refinement sequences during pressing were examined by electron backscatter diffraction. The enhancement of grain refinement to the Al-Mg-Li alloy was compared with plane strain compression (PSC) at similar strains. The effect of the shear strain on the accelerated grain refining during compressing has been discussed.

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

scholarly journals A New Experimental Method for Determining the Thickness of Thin Surface Layers of Intensive Plastic Deformation Using Electron Backscatter Diffraction Data

Symmetry ◽  
2020 ◽  
Vol 12 (4) ◽  
pp. 677
Author(s):  
Alexander Smirnov ◽  
Evgeniya Smirnova ◽  
Sergey Alexandrov
Keyword(s):  
Plastic Deformation ◽  
Electron Backscatter Diffraction ◽  
Thin Layers ◽  
New Method ◽  
Metallic Materials ◽  
Surface Layers ◽  
Kernel Average Misorientation ◽  
Electron Backscatter ◽  
Properties Of Materials ◽  
Backscatter Diffraction

It is, in general, essential to investigate correlations between the microstructure and properties of materials. Plastic deformation often localizes within thin layers. As a result, many material properties within such layers are very different from the properties in bulk. The present paper proposes a new method for determining the thickness of a thin surface layer of intensive plastic deformation in metallic materials. For various types of materials, such layers are often generated near frictional interfaces. The method is based on data obtained by Electron Backscatter Diffraction. The results obtained are compared with those obtained by an alternative method based on microhardness measurements. The new method allows for determining the layer thickness of several microns in specimens after grinding. In contrast, the measurement of microhardness does not reveal the presence of this layer. The grain-based and kernel-based types of algorithms are also adopted for determining the thickness of the layer. Data processed by the strain contouring and kernel average misorientation algorithms are given to illustrate this method. It is shown that these algorithms do not clearly detect the boundary between the layer of intensive plastic deformation and the bulk. As a result, these algorithms are unable to determine the thickness of the layer with high accuracy.

Formation of Nanoporous Gold Studied by Transmission Electron Backscatter Diffraction

2015 ◽  
Vol 21 (6) ◽  
pp. 1387-1397 ◽  
Author(s):  
Leo T.H. de Jeer ◽  
Diego Ribas Gomes ◽  
Jorrit E. Nijholt ◽  
Rik van Bremen ◽  
Václav Ocelík ◽  
...  
Keyword(s):  
Crystallographic Texture ◽  
Manufacturing Process ◽  
Electron Backscatter Diffraction ◽  
Nanoporous Materials ◽  
Nanoporous Gold ◽  
Grain Structure ◽  
Misorientation Distribution ◽  
Transmission Electron ◽  
Electron Backscatter ◽  
Backscatter Diffraction

AbstractTransmission electron backscatter diffraction (t-EBSD) was used to investigate the effect of dealloying on the microstructure of 140-nm thin gold foils. Statistical and local comparisons of the microstructure between the nonetched and nanoporous gold foils were made. Analyses of crystallographic texture, misorientation distribution, and grain structure clearly prove that during the dealloying manufacturing process of nanoporous materials the crystallographic texture is enhanced significantly with a clear decrease of internal strain, whereas maintaining the grain structure.

Grain Fragmentation in Equal Channel Angular Pressed Copper

2010 ◽  
Vol 654-656 ◽  
pp. 1570-1573 ◽  
Author(s):  
Cheng Fan Gu ◽  
László S. Tóth ◽  
Benoît Beausir ◽  
Tim Williams ◽  
Chris H.J. Davies
Keyword(s):  
Grain Size ◽  
Grain Refinement ◽  
Equal Channel Angular Pressing ◽  
Simulation Study ◽  
Electron Backscatter Diffraction ◽  
Fragmentation Model ◽  
Angular Pressing ◽  
Electron Backscatter ◽  
Grain Fragmentation ◽  
Backscatter Diffraction

A comparative experimental and simulation study of oxygen-free high conductivity copper produced by equal channel angular pressing (ECAP) one-pass has been carried out by using electron backscatter diffraction (EBSD) and a recently proposed grain refinement model. The grain size and misorientation distributions were extracted from the EBSD measurements. It was found that the microstructure in the ECAP deformed copper was much more refined on the TD plane. The grain size observed experimentally can be fairly well predicted by the grain fragmentation model.

Characterization of Nanostructured Electrodeposited NiCo Samples by use of Electron Backscatter Diffraction (EBSD)

2005 ◽  
Vol 880 ◽  
Author(s):  
Alice Bastos ◽  
Dierk Raabe ◽  
Stefan Zaefferer ◽  
Christopher Schuh
Keyword(s):  
Grain Size ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Growth Direction ◽  
Grain Structure ◽  
Local Texture ◽  
Average Grain Size ◽  
Electron Backscatter ◽  
Backscatter Diffraction

AbstractA Cobalt-20wt.% Nickel polycrystal produced by electrodeposition has been investigated in planar and cross sections using a high resolution scanning electron microscope. The local texture, grain size, amount of phase and grain boundaries, were characterized by Electron Backscatter Diffraction (EBSD). The average grain size perpendicular to the grain growth direction was 400 nm. Parallel to it, a pronounced bimodal grain structure was observed with grains reaching more than 10 μm and grains of approximately 800 nm diameter.

Response of Hot-Extruded Al-Mn-Sc-Zr Alloy to Annealing with Constant Heating Rate

2013 ◽  
Vol 334-335 ◽  
pp. 161-166 ◽  
Author(s):  
Martin Vlach ◽  
Ivana Stulíková ◽  
Bohumil Smola ◽  
Hana Císařová ◽  
Tomáš Kekule ◽  
...  
Keyword(s):  
Electron Backscatter Diffraction ◽  
Hot Extrusion ◽  
Grain Structure ◽  
Constant Heating Rate ◽  
Phase Precipitation ◽  
Electron Backscatter ◽  
Constant Heating ◽  
Backscatter Diffraction ◽  
Scanning Electron ◽  
Zr Alloy

The effect of hot extrusion at 350°C on microstructure, thermal, electrical and mechanical properties of the AlMnScZr alloy was studied. The samples of the cast and of the hot-extruded alloys were annealed from 20°C up to 600°C. Transmission and scanning electron microscopy and electron backscatter diffraction examinations of specimens quenched from temperatures of significant resistivity changes were used to identify microstructural processes responsible for these changes. The cast as well as hot-extruded alloy is characterized by a dispersion of fine coherent Al3Sc and/or Al3(Sc,Zr) particles, and furthermore the fine (sub) grain structure was observed in the hot-extruded alloy. Microhardness HV1 and resistivity values reflect different microstructure of the alloys accordingly. The distinct resistivity changes of the alloys are mainly caused by precipitation of Mn-containing particles. The apparent activation energy for the Al6Mn-phase precipitation in the hot-extruded alloy was also determined. The obtained results agree with those observed in the alloys prepared by powder metallurgy studied in our previous work.

Investigation of Aluminum Thin Films Using Electron Backscatter Diffraction and the New Technique of Orientation Imaging Microscopy

1995 ◽  
Vol 403 ◽  
Author(s):  
D. J. Dingley ◽  
D. P. Field
Keyword(s):  
Thin Films ◽  
Semiconductor Device ◽  
Electron Backscatter Diffraction ◽  
Orientation Imaging Microscopy ◽  
Grain Structure ◽  
Local Texture ◽  
Orientation Imaging ◽  
Electron Backscatter ◽  
Individual Grains ◽  
Backscatter Diffraction

AbstractAluminum thin films deposited onto silicon substrates coated with silicon dioxide or a layered structure of titanium and titanium nitride have been investigated using the combined techniques of electron backscatter diffraction and orientation imaging microscopy. By these methods the local texture and spatial distribution of texture components was established. It was observed that whereas the material exhibited an overall <111> texture with the in-plane direction <110> uniformly distributed, there were variations in the local texture and distribution of orientations with clustering of grains of similar orientation. Individual grains within the clusters were nearly perfect and varied in orientation by only a few degrees. The effective grain size differed greatly on whether the cluster size of similarly oriented grains or the diameter of individual grains within the cluster was considered to constitute the grain structure. No strong bias was found in favor of coincident site oriented grain pairs though in some cases the frequency of occurrence of low angle boundaries was less than is expected on a purely random basis. Additional experiments were carried out in order to establish the suitability of orientation imaging microscopy for microstructure characterization of interconnect lines in integrated semiconductor device technology.

Thermal Stability of Electrodeposited Ni and Ni-Co Layers; an EBSD-Study

2004 ◽  
Vol 467-470 ◽  
pp. 1345-1352 ◽  
Author(s):  
A.A. Rasmussen ◽  
Ali Gholinia ◽  
Patrick W. Trimby ◽  
Marcel A.J. Somers
Keyword(s):  
Heat Treatment ◽  
Thermal Stability ◽  
High Resolution ◽  
Electron Backscatter Diffraction ◽  
X Ray Diffraction ◽  
X Ray ◽  
Fine Grained ◽  
Electron Backscatter ◽  
Backscatter Diffraction ◽  
Thermal Stability Of

The influence of heat treatment on the microstructure and the microtexture of electrodeposited Ni and Ni-Co layers was investigated with Electron Backscatter Diffraction (EBSD) with high resolution. Samples were annealed for 1 hour at 523 K and 673 K, the temperature region wherein recrystallisation occurs. The results are discussed in relation to the resolution of EBSD for the very fine grained electrodeposits and previous X-ray diffraction investigations.

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