Mechanical Properties of Poly 3C-SiC Thin Films According to Carrier Gas (H2) Concentration

2008 ◽  
Vol 600-603 ◽  
pp. 867-870
Author(s):  
Gwiy Sang Chung ◽  
Ki Bong Han
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Surface Roughness ◽  
Atomic Force Microscope ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Carrier Gas ◽  
Nano Indentation ◽  
Atomic Force

This paper presents the mechanical properties of 3C-SiC thin film according to 0, 7, and 10 % carrier gas (H2) concentrations using Nano-Indentation. When carrier gas (H2) concentration was 10 %, it has been proved that the mechanical properties, Young’s Modulus and Hardness, of 3C-SiC are the best of them. In the case of 10 % carrier gas (H2) concentration, Young’s Modulus and Hardness were obtained as 367 GPa and 36 GPa, respectively. When the surface roughness according to carrier gas (H2) concentrations was investigated by AFM (atomic force microscope), when carrier gas (H2) concentration was 10 %, the roughness of 3C-SiC thin was 9.92 nm, which is also the best of them. Therefore, in order to apply poly 3C-SiC thin films to MEMS applications, carrier gas (H2) concentration’s rate should increase to obtain better mechanical properties and surface roughness.

Measurement of Young's Modulus and Poisson's Ratio of Thin Film by Combination of Bulge Test and Nano-Indentation

2008 ◽  
Vol 33-37 ◽  
pp. 969-974 ◽  
Author(s):  
Bong Bu Jung ◽  
Seong Hyun Ko ◽  
Hun Kee Lee ◽  
Hyun Chul Park
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Poisson’S Ratio ◽  
Young's Modulus ◽  
Applied Pressure ◽  
Indentation Test ◽  
Poisson's Ratio ◽  
Bulge Test ◽  
Nano Indentation

This paper will discuss two different techniques to measure mechanical properties of thin film, bulge test and nano-indentation test. In the bulge test, uniform pressure applies to one side of thin film. Measurement of the membrane deflection as a function of the applied pressure allows one to determine the mechanical properties such as the elastic modulus and the residual stress. Nano-indentation measurements are accomplished by pushing the indenter tip into a sample and then withdrawing it, recording the force required as a function of position. . In this study, modified King’s model can be used to estimate the mechanical properties of the thin film in order to avoid the effect of substrates. Both techniques can be used to determine Young’s modulus or Poisson’s ratio, but in both cases knowledge of the other variables is needed. However, the mathematical relationship between the modulus and Poisson's ratio is different for the two experimental techniques. Hence, achieving agreement between the techniques means that the modulus and Poisson’s ratio and Young’s modulus of thin films can be determined with no a priori knowledge of either.

scholarly journals Characterisation of the Material and Mechanical Properties of Atomic Force Microscope Cantilevers with a Plan-View Trapezoidal Geometry

2019 ◽  
Vol 9 (13) ◽  
pp. 2604 ◽  
Author(s):  
Ashley D. Slattery ◽  
Adam J. Blanch ◽  
Cameron J. Shearer ◽  
Andrew J. Stapleton ◽  
Renee V. Goreham ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Atomic Force Microscope ◽  
Young’S Modulus ◽  
Correction Factor ◽  
Young's Modulus ◽  
Spring Constant ◽  
Beam Equation ◽  
Euler Beam ◽  
Plan View ◽  
Atomic Force

Cantilever devices have found applications in numerous scientific fields and instruments, including the atomic force microscope (AFM), and as sensors to detect a wide range of chemical and biological species. The mechanical properties, in particular, the spring constant of these devices is crucial when quantifying adhesive forces, material properties of surfaces, and in determining deposited mass for sensing applications. A key component in the spring constant of a cantilever is the plan-view shape. In recent years, the trapezoidal plan-view shape has become available since it offers certain advantages to fast-scanning AFM and can improve sensor performance in fluid environments. Euler beam equations relating cantilever stiffness to the cantilever dimensions and Young’s modulus have been proven useful and are used extensively to model cantilever mechanical behaviour and calibrate the spring constant. In this work, we derive a simple correction factor to the Euler beam equation for a beam-shaped cantilever that is applicable to any cantilever with a trapezoidal plan-view shape. This correction factor is based upon previous analytical work and simplifies the application of the previous researchers formula. A correction factor to the spring constant of an AFM cantilever is also required to calculate the torque produced by the tip when it contacts the sample surface, which is also dependent on the plan-view shape. In this work, we also derive a simple expression for the torque for triangular plan-view shaped cantilevers and show that for the current generation of trapezoidal plan-view shaped AFM cantilevers, this will be a good approximation. We shall apply both these correction factors to determine Young’s modulus for a range of trapezoidal-shaped AFM cantilevers, which are specially designed for fast-scanning. These types of AFM probes are much smaller in size when compared to standard AFM probes. In the process of analysing the mechanical properties of these cantilevers, important insights are also gained into their spring constant calibration and dimensional factors that contribute to the variability in their spring constant.

Nanoindentation Measurements on Low-k Porous Silica Thin Films Spin Coated on Silicon Substrates

2003 ◽  
Vol 125 (4) ◽  
pp. 361-367 ◽  
Author(s):  
Xiaoqin Huang ◽  
Assimina A. Pelegri
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Microelectromechanical Systems ◽  
Young's Modulus ◽  
Porous Silica ◽  
Silicon Substrates ◽  
Silica Thin Films ◽  
Low K

MEMS (MicroElectroMechanical Systems) are composed of thin films and composite nanomaterials. Although the mechanical properties of their constituent materials play an important role in controlling their quality, reliability, and lifetime, they are often found to be different from their bulk counterparts. In this paper, low-k porous silica thin films spin coated on silicon substrates are studied. The roughness of spin-on coated porous silica films is analyzed with in-situ imaging and their mechanical properties are determined using nanoindentation. A Berkovich type nanoindenter, of a 142.3 deg total included angle, is used and continuous measurements of force and displacements are acquired. It is shown, that the measured results of hardness and Young’s modulus of these films depend on penetration depth. Furthermore, the film’s mechanical properties are influenced by the properties of the substrate, and the reproduction of the force versus displacement curves depends on the quality of the thin film. The hardness of the studied low-k spin coated silica thin film is measured as 0.35∼0.41 GPa and the Young’s modulus is determined as 2.74∼2.94 GPa.

Measurement of Mechanical Properties for Thin Film Using Visual Image Tracing Method

2007 ◽  
Vol 124-126 ◽  
pp. 1701-1704 ◽  
Author(s):  
Sang Joo Lee ◽  
Seung Woo Han ◽  
Jae Hyun Kim ◽  
Hak Joo Lee
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Measurement System ◽  
Strain Measurement ◽  
Poisson’S Ratio ◽  
Young's Modulus ◽  
Visual Image ◽  
Poisson's Ratio

It is quite difficult to accurately measure the mechanical properties of thin films. Currently, there are several methods (or application) available for measuring mechanical properties of thin films. Their properties, however, have been determined by indirect methods such as cantilever beam test and diaphragm bulge test. This paper reports the efforts to develop a direct strain measurement system for micro/nano scale thin film materials. The proposed solution is the Visual Image Tracing (VIT) strain measurement system coupled with a micro tensile testing unit, which consists of a piezoelectric actuator, load cell, microscope and CCD cameras. The advantage of this system is the ability to monitor the real time images of specimen during the test in order to determine its Young’s modulus and Poisson’s ratio at the same time. Stress-strain curve, Young’s modulus, yield strength and Poisson’s ratio of copper thin film measured using VIT system are presented.

Using Nanoindentation and Nanoscratch to Determine Thin Film Mechanical Properties

2006 ◽  
Vol 326-328 ◽  
pp. 357-360 ◽  
Author(s):  
Rwei Ching Chang ◽  
Feng Yuan Chen ◽  
Chang En Sun
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Friction Factor ◽  
Young’S Modulus ◽  
Physical Vapor Deposition ◽  
Young's Modulus ◽  
Indentation Test ◽  
Lateral Force ◽  
Wafer Substrate

This work uses nanoindentation and nanoscratch to measure the mechanical properties of evaporation copper thin films. The thin film is deposited on a silicon wafer substrate by using the physical vapor deposition method provided by a resistive heating evaporator. The mechanical properties are then determined by indentation test and lateral force test produced by nanoindenter and nanoscratch. The results show that, as the copper thin film is 500nm in thickness and the indentation depth increases from 100nm to 400nm, the Young’s modulus increases from 151GPa to 160GPa while the hardness increases from 2.8GPa to 3.5GPa. Moreover, both the Young’s modulus and the hardness decrease as the thickness of the thin film increases. Besides, the nanoscratch results show that the friction factor also increases as the scratch depth increases, and a thinner film thickness makes a larger friction factor. The results represent the substrate has a significant effect on the mechanical properties of the thin films.

The Study on Deposition Process and Mechanical Properties of Deposited Cu Thin Films Using Molecular Dynamics

2013 ◽  
Vol 684 ◽  
pp. 37-41
Author(s):  
Jen Ching Huang ◽  
Yi Chia Liao ◽  
Huail Siang Liu ◽  
Fu Jen Cheng
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Molecular Dynamics ◽  
Young’S Modulus ◽  
Adhesion Force ◽  
Young's Modulus ◽  
Early Stage ◽  
Vacancy Concentration ◽  
Deposition Process

This paper studies the deposition process and mechanical properties of Cu thin films deposited on single crystal copper substrates with various surface roughnesses by molecular dynamics (MD). In the effect of vacancy concentration (Cv) of substrate, the Young's modulus of sample decreased as the Cv of substrate increased but the adhesion force will increase as the Cv of substrate increases. The effect of substrate roughness on the peak intensity of crystal orientation has little. And the greater Cv of substrate, the surface roughness of the deposited thin film also increased. In the effect of numbers of deposited atoms, the deposited thin film thickness increases, the surface will be relatively flat and the Young's modulus will also increase. By the XRD pattern, the principal growth directions of thin film are the (220) and (200) in the early stage of growth during deposition. However, with the thickness increasing, the (111) will be the preferred orientation.

Structural and mechanical properties of a-axis AlN thin films growth using reactive RF magnetron sputtering plasma

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Anis Suhaili Bakri ◽  
Nafarizal Nayan ◽  
Chin Fhong Soon ◽  
Mohd Khairul Ahmad ◽  
Ahmad Shuhaimi Abu Bakar ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Magnetron Sputtering ◽  
Young’S Modulus ◽  
Plasma Deposition ◽  
Young's Modulus ◽  
Rf Magnetron Sputtering ◽  
Content Type ◽  
Sputtering Deposition ◽  
Atomic Force

Purpose This paper aims to report the influence of sputtering plasma deposition time on the structural and mechanical properties of the a-axis oriented aluminium nitride (AlN) thin films. Design/methodology/approach The AlN films were prepared using RF magnetron sputtering plasma on a silicon substrate without any external heating with various deposition times. The films were characterized using X-ray diffraction (XRD), field-emission scanning electron microscope (FESEM), atomic force microscope (AFM) and nanoindentation techniques. Findings The XRD results show that the AlN thin films are highly oriented along the (100) AlN plane at various deposition times indicating the a-axis preferred orientation. All the AlN thin films exhibit hexagonal AlN with a wurtzite structure. The hardness and Young’s modulus of AlN thin films with various deposition times were measured using a nanoindenter. The measured hardness of the AlN films on Si was in the range of 14.1 to 14.7 GPa. The surface roughness and the grain size measured using the AFM revealed that both are dependent on the deposition times. Originality/value The novelty of this work lies with a comparison of hardness and Young’s modulus result obtained at different sputtering deposition temperature. This study also provides the relation of AlN thin films’ crystallinity with the hardness of the deposited films.

Evaluation of WB Coatings by Scanned Imaging Microscopy

2003 ◽  
Author(s):  
Jikai Du ◽  
Bernhard R. Tittmann
Keyword(s):  
Young’S Modulus ◽  
Young's Modulus ◽  
Attenuation Coefficients ◽  
High Attenuation ◽  
Nano Indentation ◽  
Atomic Force ◽  
Acoustic Evaluation ◽  
Acoustic Velocities ◽  
Thick Coatings ◽  
Scanning Acoustic Microscope

Organic thick coatings (epoxy, polyurethane, and acrylic-urethane) have been widely applied to high modulus substrates (e.g., steel) for anticorrosion protection. To improve performance, reinforced components (clay, bochmite, nanopaticles, etc.) are usually added to these coatings. However, the acoustic evaluation of these coatings is difficult due to their low acoustic velocities and high attenuation coefficients. In this paper, first, the scanning acoustic microscope (SAM) is used to image sub-surfaces, coating/substrate interfaces, and to measure acoustic velocities. Different phases can be observed on some coatings and defects can be found at some interfaces. Secondly, the atomic force microscope (AFM) is applied to image surfaces at high resolution (compared to SAM). These results agree with SAM images. Thirdly, a nano-indentation technique is utilized to measure the reduced Young’s modulus and absolute hardness of the coatings. The results show that epoxy has the highest Young’s modulus and acrylic-urethane has the lowest. Reinforced components can either increase or decrease Young’s modulus, and hardness depending on the coating material. Finally, results from the SAM, AFM and nano-indentation are compared and analyzed to optimize the evaluation.

Determination of Mechanical Properties of Thin Film on Silicon Wafer

2003 ◽  
Author(s):  
Enboa Wu ◽  
Albert J. D. Yang ◽  
Ching-An Shao ◽  
C. S. Yen
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Silicon Wafer ◽  
Coefficient Of Thermal Expansion ◽  
Young's Modulus ◽  
Poisson Ratio ◽  
Bulk State

Nondestructive determination of Young’s modulus, coefficient of thermal expansion, Poisson ratio, and thickness of a thin film has long been a difficult but important issue as the film of micrometer order thick might behave differently from that in the bulk state. In this paper, we have successfully demonstrated the capability of determining all these four parameters at one time. This novel method includes use of the digital phase-shifting reflection moire´ (DPRM) technique to record the slope of wafer warpage under temperature drop condition. In the experiment, 1-um thick aluminum was sputtered on a 6-in silicon wafer. The convolution relationship between the measured data and the mechanical properties was constructed numerically using the conventional 3D finite element code. The genetic algorithm (GA) was adopted as the searching tool for search of the optimal mechanical properties of the film. It was found that the determined data for Young’s modulus (E), Coefficient of Thermal Expansion (CTE), Poisson ratio (ν), and thickness (h) of the 1.00 um thick aluminum film were 104.2Gpa, 38.0 ppm/°C, 0.38, and 0.98 um, respectively, whereas that in the bulk state were measured to be E=71.4 Gpa, CTE=23.0 ppm/°C, and ν=0.34. The significantly larger values on the Young’s modulus and the coefficient of thermal expansion determined by this method might be attributed to the smaller dislocation density due to the thin dimension and formation of the 5-nm layer of Al2O3 formed on top of the 1-um thick sputtered film. The Young’s Modulus and the Poisson ratio of this nano-scale Al2O3 film were then determined. Their values are consistent with the physical intuition of the microstructure.

Sign in / Sign up

Export Citation Format

Share Document