Suppression of Short-Channel Effects in 4H-SiC Trench MOSFETs

2019 ◽  
Vol 963 ◽  
pp. 613-616
Author(s):  
Tomoyasu Ishii ◽  
Shinichiro Kuroki ◽  
Hiroshi Sezaki ◽  
Seiji Ishikawa ◽  
Tomonori Maeda ◽  
...  

Submicron 4H-SiC MOSFETs are attractive for high frequency operation of 4H-SiC integrated circuits. However, the short channel effects, such as threshold voltage lowering, would be induced at the short-channel devices. In this work, short channel effects were investigated with planar and trench 4H-SiC MOSFETs, and the suppression of the short channel effect with the trench structure was achieved.

2006 ◽  
Vol 912 ◽  
Author(s):  
Benjamin Dumont ◽  
Arnaud Pouydebasque ◽  
Bartek Pawlak ◽  
Benjamin Oudet ◽  
Dominique Delille ◽  
...  

AbstractThis work demonstrates the efficiency of a Germanium and Carbon co-implantation that suppresses the Boron Transient Enhanced Diffusion, enhances Boron activation and enables large improvement of Short Channel Effects in PMOS devices while maintaining drive current performances. We present here 65/45nm node devices on conventional bulk substrates featuring Germanium and Carbon engineered shallow junctions that enable to reduce the Drain Induced Barrier Lowering compared to devices implanted only with Boron. This improvement is attributed to the suppression of Boron channelling with Ge pre-amorphization (PAI), and to the reduction of Boron TED due to the trapping of interstitial defects by Carbon with Germanium PAI.


2007 ◽  
Vol 54 (10) ◽  
pp. 2589-2597 ◽  
Author(s):  
Gregg H. Jessen ◽  
Robert C. Fitch ◽  
James K. Gillespie ◽  
Glen Via ◽  
Antonio Crespo ◽  
...  

2000 ◽  
Vol 640 ◽  
Author(s):  
A. Konstantinov ◽  
A-M. Saroukhan ◽  
S. Karlsson ◽  
C. Harris ◽  
A. Litwin

ABSTRACTWe demonstrate that the performance of silicon carbide MESFETs is largely determined by short-channel effects. Parasitic bipolar transistor turn-on limits the operation voltage to a small fraction of the theoretically expected value for an ideal device. Tradeoffs are shown to exist between optimum gate length and on-state current on one hand, and the maximum blocking voltage on the other hand. Composite p-buffers with an elevated doping in the vicinity of the active layer considerably increase the operation voltage. Silicon carbide MESFETs utilizing composite buffers are reported.


Author(s):  
Yuk L. Tsang ◽  
Xiang D. Wang ◽  
Reyhan Ricklefs ◽  
Jason Goertz

Abstract In this paper, we report a transistor model that has successfully led to the identification of a non visual defect. This model was based on detailed electrical characterization of a MOS NFET exhibiting a threshold voltage (Vt) of just about 40mv lower than normal. This small Vt delta was based on standard graphical extrapolation method in the usual linear Id-Vg plots. We observed, using a semilog plot, two slopes in the Id-Vg curves with Vt delta magnified significantly in the subthreshold region. The two slopes were attributed to two transistors in parallel with different Vts. We further found that one of the parallel transistors had short channel effect due to a punch-through mechanism. It was proposed and ultimately confirmed the cause was due to a dopant defect using scanning capacitance microscopy (SCM) technique.


1999 ◽  
Vol 568 ◽  
Author(s):  
M.E. Rubin ◽  
S. Saha ◽  
J. Lutze ◽  
F. Nouri ◽  
G. Scott ◽  
...  

ABSTRACTExperiment shows that the reverse short channel effect (RSCE) in nMOS devices is critically impacted by the inclusion of nitrogen in the gate oxide. A higher concentration of nitrogen results in a lessened RSCE, i.e. more threshold voltage rolloff for smaller gate lengths. We propose that the additional nitrogen reduces the interstitial recombination rate at the interface, resulting in a smaller interstitial flux and therefore less transient enhanced diffusion (TED) of boron to that interface. To test this hypothesis, we simulate boron redistribution in one and two dimensional MOS capacitor structures, as well as full nMOS devices. We then present simulations calibrated to a 0.2 pim technology currently in production.


2000 ◽  
Vol 622 ◽  
Author(s):  
O. Breitschädel ◽  
L. Kley ◽  
H. Gräbeldinger ◽  
B. Kuhn ◽  
F. Scholz ◽  
...  

ABSTRACTWe report on our progress on the fabrication of AlGaN/GaN HEMTs with extremely short gate length. AlGaN/GaN HEMTs with different gate length from 6 νm down to 60nm were fabricated to investigate DC- and high frequency behavior as well as short channel effects. We have found that the transistors with gates in the 100 nm range can be improved in the device performance with respect to transconductance and high frequency but shows also short channel effects as the loss of saturation in the output characteristics and a strong dependency of the threshold voltage on the gate length.


2019 ◽  
Vol 16 (40) ◽  
pp. 23-27 ◽  
Author(s):  
Yusuke Kobayashi ◽  
Angada B. Sachid ◽  
Kazuo Tsutsui ◽  
Kuniyuki Kakushima ◽  
Parhat Ahmet ◽  
...  

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