Microstructure and Hardness of AlMg3 Alloy Subjected to Ultrasonic Upsetting

2021 ◽  
Vol 326 ◽  
pp. 149-156
Author(s):  
Przemysław Snopiński
Keyword(s):  
Electron Backscatter Diffraction ◽  
Light And Electron Microscopy ◽  
Deformation Bands ◽  
Solution Treated Condition ◽  
Solution Treated ◽  
Treated Condition ◽  
Electron Backscatter ◽  
Before And After ◽  
Ultrasonic Assisted ◽  
Backscatter Diffraction

This study was conducted to study the effect ultrasonic vibrations on the evolution of the microstructure and hardness of the AlMg3 aluminum alloy in a solution treated condition. To understand the process physics in this article, after the deformation the microstructures of the samples before and after deformation were analyzed by the light and electron microscopy, including the electron backscatter diffraction (EBSD) analysis. The result evidently shows that the ultrasonic-assisted deformation has a meaningful influence on the grain refinement – the application of the USV enhances the formation of deformation bands and new sub-grains. This resulted in a certain hardness enhancement.

Workability of ZK60A Alloy Depending on Microstructure

2012 ◽  
Vol 217-219 ◽  
pp. 373-376 ◽  
Author(s):  
K.H. Jung ◽  
Yong Bae Kim ◽  
Byung Min Ahn ◽  
Sang Mok Lee ◽  
Jong Sup Lee ◽  
...  
Keyword(s):  
Magnesium Alloy ◽  
Uniaxial Compression ◽  
Microstructural Evolution ◽  
Elevated Temperatures ◽  
Electron Backscatter Diffraction ◽  
Strain Rates ◽  
Compression Tests ◽  
Electron Backscatter ◽  
Before And After ◽  
Backscatter Diffraction

In this study, the variation of workability of semi-continuously casted and extruded ZK60A magnesium alloy was investigated. To determine the deformation capability of two different billets, uniaxial compression tests were conducted at elevated temperatures and two different strain rates. In addition, the microstructural evolution was investigated using electron backscatter diffraction (EBSD) to compare the microstructure before and after the extrusion. The formability of ZK60A depending on the microstructure is discussed based on the experimental results obtained in this study, and is compared with earlier research in the literature.

Orientation and Microstructure Dependence of Electromigration Damage in Damascene Cu Interconnect Lines

2005 ◽  
Vol 495-497 ◽  
pp. 1443-1448 ◽  
Author(s):  
Kabir Kumar Mirpuri ◽  
Jerzy A. Szpunar
Keyword(s):  
Electron Backscatter Diffraction ◽  
Orientation Dependence ◽  
In Situ Monitoring ◽  
Cu Interconnects ◽  
Electron Backscatter ◽  
Before And After ◽  
Cu Interconnect ◽  
Interconnect Lines ◽  
Backscatter Diffraction

In the present paper we report the texture and microstructure dependence of electromigration damage in Cu interconnects. This was made possible by ncorporating a sophisticated set of instrumentation within the SEM which enabled in-situ monitoring of the electromigration defects. The electron backscatter diffraction (EBSD) maps were obtained before and after the completion of the electromigration tests. Thus, by comparing the maps before and after the failure it was possible to associate the texture and microstructure with both failure sites - voids and hillocks. Results from lines down to 130 nm are included and orientation dependence of the defects is discussed.

MST 431

Alloy Digest ◽  
1961 ◽  
Vol 10 (10) ◽  
Keyword(s):  
Aging Treatment ◽  
High Strength ◽  
Heat Treating ◽  
Temperature Performance ◽  
Solution Treated Condition ◽  
Solution Treated ◽  
Treated Condition ◽  
Alpha Beta ◽  
Reactive Metals ◽  
Principal Advantage

Abstract MST 431 is an alpha-beta type sheet alloy presently being supplied in the solution treated, solution treated and aged, and annealed conditions. Its principal advantage is good formability in the solution treated condition with subsequent high strength capability through an aging treatment. Properties indicate good strength and thermal stability for sheet applications up to 800 F for long times. This datasheet provides information on composition, physical properties, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Ti-30. Producer or source: Reactive Metals Corporation.

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

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