Evaluating Thermal Cycling Fatigue Resistance for LED Chip-on-Board Applications
2012 ◽
Vol 2012
(DPC)
◽
pp. 000706-000737
Keyword(s):
LED chip-on-board applications typically involve assembling an LED die stack directly on to a high thermal conductivity substrate such as a Metal Core PCB. If solder is used for die-substrate attach for such chip-on-board applications, one needs to consider the CTE mismatch between the die stack and the MCPCB and its impact on thermal cycle-induced creep fatigue of the solder material. This paper presents a methodology to compare relative performance of different solder materials with varying thermo-mechanical properties, and compare the impact of CTE mismatch and temperature swings on transient thermal properties and relative reliability of the solder attach materials. Implications for LED chip-on-board applications are discussed.
2013 ◽
Vol 8
(3)
◽
pp. 155892501300800
◽
Keyword(s):
2018 ◽
Vol 06
(01n02)
◽
pp. 1850002
2014 ◽
Vol 556-562
◽
pp. 339-342
◽
2017 ◽
Vol 72
(2)
◽
pp. 189-192
◽
2012 ◽
Vol 472-475
◽
pp. 302-308
2010 ◽
Vol 658
◽
pp. 372-375
◽