Study on high temperature resistant die bonding formed by Al/Ni nano-particles composite paste

2018 ◽  
Vol 2018 (1) ◽  
pp. 000442-000446
Author(s):  
Yasunori Tanaka ◽  
Tatsumasa Wakata ◽  
Norihiro Murakawa ◽  
Tomonori Iizuka ◽  
Kohei Tatsumi
Keyword(s):  
Thermal Stress ◽  
High Temperature ◽  
Bonding Temperature ◽  
Nano Particles ◽  
Bonding Layer ◽  
Ni Nanoparticles ◽  
Bonding Material ◽  
Chip Size ◽  
Bonding Technology ◽  
High Temperature Operation

Abstract In power modules using SiC devices, high temperature operation is expected. Therefore, a bonding technology having high temperature resistance of 250°C or more is required. In recent years, research on low temperature sintering bonding by Ag nanoparticles, Cu nanoparticles and sub-micron particles has been conducted as a new bonding technology corresponding to SiC power devices. Nanoparticles are sintered at a temperature much lower than the sintering temperature in ordinary powder metallurgy. We focus on Ni having high melting point and excellent corrosion resistance as a new bonding material and are conducting research on high temperature resistant interconnection technology using Ni nanoparticles. We have found that bonding is possible at a bonding temperature of 400°C or less and enable to interconnect SiC devices for high temperature operation. However, there are still following problems to be improved, as follows, especially for a large chip size : Voids formed in the bonding layer and cracks generaled stress caused by a difference in thermal expansion coefficient(CTE). In this paper, we propose a bonding material of composite paste in which Ni nanoparticles and Al particles are mixed. From the results of the research, it was found that the occurrence of cracks and gas void was suppressed by mixing Al particles. Also the thermal stress analysis by FEM, the addition of Al particles shows to reduce the thermal stress during thermal cycle test (TCT).

Crack Disappearance by High-Temperature Oxidation of Alumina Toughened by Ni Nano-Particles

2009 ◽  
Vol 68 ◽  
pp. 34-43 ◽  
Author(s):  
Ana L. Salas-Villaseñor ◽  
José Lemus-Ruiz ◽  
Makoto Nanko ◽  
Daisuke Maruoka
Keyword(s):  
Heat Treatment ◽  
High Temperature ◽  
Oxidation Reaction ◽  
High Temperature Oxidation ◽  
Annealing Temperature ◽  
Nano Particles ◽  
Ni Nanoparticles ◽  
Temperature Oxidation ◽  
Oxidation Period ◽  
Higher Temperature

Crack disappearance by high-temperature oxidation was studied in alumina (Al2O3) composites toughened by Ni nanoparticles. This process is performed in air at temperature ranging from 1000 to 1300°C for 1 to 48 h. The results showed that crack disappearance depends on both annealing temperature and time. Complete crack disappearance in this composite was confirmed at lower temperatures for long oxidation period, 1100oC for 48 h, and higher temperature for shorter time, 1300oC for 1 h in air. The crack disappearance mechanism was explained on the basis of the formation of NiAl2O4 spinel on sample surfaces produced by the oxidation reaction during the heat treatment.

Efficient Diffusion Bonding between BSCCO Superconducting Multifilamentary Tapes

2008 ◽  
Vol 580-582 ◽  
pp. 295-298
Author(s):  
Gui Sheng Zou ◽  
Yan Ju Wang ◽  
Ai Ping Wu ◽  
Hai Lin Bai ◽  
Nai Jun Hu ◽  
...  
Keyword(s):  
High Temperature ◽  
Diffusion Bonding ◽  
New Technology ◽  
Bonding Temperature ◽  
Interface Bonding ◽  
Bonding Pressure ◽  
Bonding Parameters ◽  
Efficient Diffusion ◽  
Bonding Technology ◽  
Multifilamentary Tapes

To improve the joining efficiency of Bi-Sr-Ca-Cu-O ( BSCCO) superconducting tapes, a new diffusion bonding technology with a direct uniaxial pressing at high temperature was developed to join 61-filament tapes. It was observed that bonding parameters such as bonding pressure and holding time, significantly affected the critical current ratio (CCRo). A peak CCRo value of 89 % for the lap-joined tapes was achieved at 3 MPa for 2 h when bonding temperature was 800 °C. Compared with the conventional diffusion bonding technology, this new technology remarkably shortened the fabrication period and improved the superconductivity of the joints. The bonding interface and microstructures of the joints were evaluated and correlated to the CCRo. An uniaxial pressing at high temperature was beneficial to interface bonding, and there was an optimal pressure value for the CCRo.

scholarly journals A Study On The Metal Carbide Composite Diffusion Bonding For Mechanical Seal

2015 ◽  
Vol 60 (2) ◽  
pp. 1479-1483 ◽  
Author(s):  
D.-K. Kim ◽  
I.-J. Shon ◽  
J. Song ◽  
W.-J. Ryu ◽  
H.-Ch. Shin ◽  
...  
Keyword(s):  
High Temperature ◽  
Test Specimen ◽  
Sintering Temperature ◽  
Bonding Temperature ◽  
Bonding Layer ◽  
Mechanical Seal ◽  
Metal Carbide ◽  
Carbide Alloy ◽  
Structural Applications ◽  
Bonding Characteristics

Abstract Mechanical Seal use highly efficient alternative water having a great quantity of an aqueous solution and has an advantage no corrosion brine. Metal Carbide composites have been investigated as potential materials for high temperature structural applications and for application in the processing industry. The existing Mechanical seal material is a highly expensive carbide alloy, and it is difficult to take a price advantage. Therefore the study of replacing body area with inexpensive steel material excluding O-ring and contact area which demands high characteristics is needed. The development of WC-Ni base carbide alloy optimal bonding composition technique was accomplished in this study. To check out the influence of bonding temperature and time, bonding characteristics of sintering temperature was experimented. The bonding statuses of this test specimen were excellent. The hardness of specimen and bonding rate were measured using ultrasound equipment. In this work, Powder of WC (involved VC, Cr), Co and Mo2C mixed by attrition milling for 24hours. Nanostructured WC-27.6wt.%Ni-1.5wt.%Si-0.11wt.%VC-1.1wt.%B4C composite were fabricated at 1190°C by high temperature vacuum furnace. To check out the influence of bonding temperature and time, bonding characteristics of sintering temperature was experimented. Its relative density was about 99.7%. The mechanical properties (hardness and fracture toughness) were 87.2 HRA and 4.2 M·Pam1/2, respectively. The bonding status of this test specimen was excellent and the thickness of bonding layer was 20 ~30§ at 1050 and 1060°C bonding temperature.

High-Temperature Operation of Photonic-Crystal Lasers for On-Chip Optical Interconnection

2012 ◽  
Vol E95.C (7) ◽  
pp. 1244-1251 ◽  
Author(s):  
Koji TAKEDA ◽  
Tomonari SATO ◽  
Takaaki KAKITSUKA ◽  
Akihiko SHINYA ◽  
Kengo NOZAKI ◽  
...  
Keyword(s):  
High Temperature ◽  
Photonic Crystal ◽  
Optical Interconnection ◽  
On Chip ◽  
High Temperature Operation

KUBOTA UCX

Alloy Digest ◽  
2008 ◽  
Vol 57 (6) ◽  
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
Temperature Performance ◽  
High Temperature Operation ◽  
Oxidation And Corrosion ◽  
Very High

Abstract Kubota UCX was developed for very high temperature operation for ethylene pyrolysis service. The alloy also has excellent oxidation and corrosion resistance. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as casting and joining. Filing Code: Ni-663. Producer or source: Kubota Metal Corporation, Fahramet Division.

scholarly journals Identification of Existing Challenges and Future Trends for the Utilization of Ammonia-Water Absorption–Compression Heat Pumps at High Temperature Operation

2021 ◽  
Vol 11 (10) ◽  
pp. 4635
Author(s):  
Marcel Ulrich Ahrens ◽  
Maximilian Loth ◽  
Ignat Tolstorebrov ◽  
Armin Hafner ◽  
Stephan Kabelac ◽  
...  
Keyword(s):  
High Temperature ◽  
Water Absorption ◽  
Industrial Sector ◽  
Heat Pumps ◽  
Working Fluid ◽  
Large Temperature ◽  
Future Trends ◽  
Ammonia Water ◽  
Starting Point ◽  
High Temperature Operation

Decarbonization of the industrial sector is one of the most important keys to reducing global warming. Energy demands and associated emissions in the industrial sector are continuously increasing. The utilization of high temperature heat pumps (HTHPs) operating with natural fluids presents an environmentally friendly solution with great potential to increase energy efficiency and reduce emissions in industrial processes. Ammonia-water absorption–compression heat pumps (ACHPs) combine the technologies of an absorption and vapor compression heat pump using a zeotropic mixture of ammonia and water as working fluid. The given characteristics, such as the ability to achieve high sink temperatures with comparably large temperature lifts and high coefficient of performance (COP) make the ACHP interesting for utilization in various industrial high temperature applications. This work reviews the state of technology and identifies existing challenges based on conducted experimental investigations. In this context, 23 references with capacities ranging from 1.4 kW to 4500 kW are evaluated, achieving sink outlet temperatures from 45 °C to 115 °C and COPs from 1.4 to 11.3. Existing challenges are identified for the compressor concerning discharge temperature and lubrication, for the absorber and desorber design for operation and liquid–vapor mixing and distribution and the choice of solution pump. Recent developments and promising solutions are then highlighted and presented in a comprehensive overview. Finally, future trends for further studies are discussed. The purpose of this study is to serve as a starting point for further research by connecting theoretical approaches, possible solutions and experimental results as a resource for further developments of ammonia-water ACHP systems at high temperature operation.

High-Temperature Operation Method for Image Pickup Tube

2021 ◽  
pp. 1-1
Author(s):  
Yoichiro Neo ◽  
Masato Nakata ◽  
Yukino Kameda ◽  
Yoshinori Hatanaka ◽  
Hidenori Mimura
Keyword(s):  
High Temperature ◽  
Operation Method ◽  
High Temperature Operation

Investigation Into Thermal Stress Characteristics of Pipe-in-Pipe Under High Temperature Condition

2018 ◽  
Author(s):  
Si-Hwa Jeong ◽  
Min-Gu Won ◽  
Nam-Su Huh ◽  
Yun-Jae Kim ◽  
Young-Jin Oh ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Stress ◽  
High Temperature ◽  
Temperature Distribution ◽  
Heat Transfer Analysis ◽  
Piping System ◽  
Curved Pipe ◽  
High Temperature Condition ◽  
Single Pipe ◽  
Radiation Conditions

In this paper, the thermal stress characteristics of the pipe-in-pipe (PIP) system under high temperature condition are analyzed. The PIP is a type of pipe applied in sodium-cooled faster reactor (SFR) and has a different geometry from a single pipe. In particular, under the high temperature condition of the SFR, the high thermal stress is generated due to the temperature gradient occurring between the inner pipe and outer pipe. To investigate the thermal stress characteristics, three cases are considered according to geometry of the support. The fully constrained support and intermediate support are considered for case 1 and 2, respectively. For case 3, both supports are applied to the actual curved pipe. The finite element (FE) analyses are performed in two steps for each case. Firstly, the heat transfer analysis is carried out considering the thermal conduction, convection and radiation conditions. From the heat transfer analysis, the temperature distribution results in the piping system are obtained. Secondly, the structural analysis is performed considering the temperature distribution results and boundary conditions. Finally, the effects of the geometric characteristics on the thermal stress in the PIP system are analyzed.

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