A High Performance Full SiC Power Module Based On a Novel Stacked DBCs Hybrid Packaging Structure

2019 ◽  
Vol 2019 (1) ◽  
pp. 000557-000562
Author(s):  
Zhiwei Wang ◽  
Chi Zhang ◽  
Zhizhao Huang ◽  
Cai Chen ◽  
Fang Luo
Keyword(s):  
High Performance ◽  
Layer Structure ◽  
Three Dimensional ◽  
Dynamic Test ◽  
Test Results ◽  
Switching Loss ◽  
Power Module ◽  
Pulse Testing ◽  
Power Testing ◽  
Packaging Structure

Abstract This paper proposed a novel stacked DBCs hybrid package structure and designed a low inductive 1200V/120A SiC half-bridge power module based on the package structure. Using the multi-layer structure of DBC+DBC, the main loop parasitic inductance of the power module has been reduced to 1.8nH by optimizing the three-dimensional commutation loop and using the mutual inductance cancellation concept. The module was designed and fabricated, the low inductance characteristics of the module was verified by dual pulse testing and power testing. Dynamic test results show that the module can switch safely with a low overvoltage under zero ohm external drive resistance, and the switching loss is reduced by 57% compared to commercial modules.

Mechanical Design Optimization of a Package on Package

2009 ◽  
Author(s):  
Abhilash R. Menon ◽  
Nikhil Lakhkar ◽  
Saket Karajgikar ◽  
Dereje Agonafer
Keyword(s):  
High Performance ◽  
Heat Dissipation ◽  
Mechanical Design ◽  
Three Dimensional ◽  
Die Attach ◽  
Optimization Function ◽  
Solder Joint Fatigue ◽  
Number Of Cycles ◽  
Packaging Structure ◽  
Silicon Vias

In the past decade, compact components such as Chip Scale Packages and flip chips were the work horses of miniaturization. However, emerging applications are now demanding even higher packaging density. In order to fulfill this requirement, three dimensional packaging was evolved. Advantages of three dimensional packaging structure include minimal conductor length and eliminate speed limiting inter chip interconnects. In order to reduce signal delays and to increase heat dissipation, lot of solutions like through silicon vias, thermal vias, stacking were implemented. Stacked packages are finding applications ranging from high-end servers to mobility products. Most common applications of stacked packages include high performance memory, DRAM, logic-memory stack, system in a package etc. Stacked packages can be package-on-package or die stacked (with several dice inside the same casing) or both. The thermo-mechanical design of package on package is very complex and often requires elaborate models and analysis with considerable CPU time. In this paper we have considered a package with both die stacking and package on package. In the first part of this study we considered a variety of cases resembling the applications that stacked CSP can go into. In this study, we have considered various geometries to optimize the design mechanically in thermo-cycling loading. The optimization function for this study is to minimize the package height without compromising its reliability in terms of thermo-cycles. “Package on package” family of packages is expensive to operate and to fabricate hence a prior simulation of various geometry of interconnects is necessary to understand how the package is going to behave in terms of number of cycles. In this study we have considered different thicknesses of die, die attach, top substrate and bottom substrate to optimize solder joint fatigue life. In this study SAC405 is considered.

A High-Performance Embedded SiC Power Module Based on a DBC-Stacked Hybrid Packaging Structure

2020 ◽  
Vol 8 (1) ◽  
pp. 351-366
Author(s):  
Zhizhao Huang ◽  
Cai Chen ◽  
Yue Xie ◽  
Yiyang Yan ◽  
Yong Kang ◽  
...  
Keyword(s):  
High Performance ◽  
Power Module ◽  
Packaging Structure

Improved 3-D reconstruction using stereo computer graphics and multiple tilt EM images

1995 ◽  
Vol 53 ◽  
pp. 630-631
Author(s):  
Lee D. Peachey ◽  
Lou Fodor ◽  
John C. Haselgrove ◽  
Stanley M. Dunn ◽  
Junqing Huang
Keyword(s):  
Computer Graphics ◽  
High Performance ◽  
Transverse Section ◽  
Three Dimensional ◽  
Stereo Pair ◽  
3D Reconstructions ◽  
Video Cameras ◽  
Biological Objects ◽  
Microscope Images ◽  
High Performance Computer

Stereo pairs of electron microscope images provide valuable visual impressions of the three-dimensional nature of specimens, including biological objects. Beyond this one seeks quantitatively accurate models and measurements of the three dimensional positions and sizes of structures in the specimen. In our laboratory, we have sought to combine high resolution video cameras with high performance computer graphics systems to improve both the ease of building 3D reconstructions and the accuracy of 3D measurements, by using multiple tilt images of the same specimen tilted over a wider range of angles than can be viewed stereoscopically. Ultimately we also wish to automate the reconstruction and measurement process, and have initiated work in that direction.Figure 1 is a stereo pair of 400 kV images from a 1 micrometer thick transverse section of frog skeletal muscle stained with the Golgi stain. This stain selectively increases the density of the transverse tubular network in these muscle cells, and it is this network that we reconstruct in this example.

Rationally Designed Three-Dimensional Porous Nico 2n@C Reticular Structure for High-Performance Li-Ion Batteries

2020 ◽  
Author(s):  
Peiyao Wang ◽  
Bangchuan Zhao ◽  
Jin Bai ◽  
Kunzhen Li ◽  
Hongyang Ma ◽  
...  
Keyword(s):  
High Performance ◽  
Three Dimensional ◽  
Li Ion Batteries ◽  
Reticular Structure ◽  
Li Ion

scholarly journals Polarization-sensitive photodetectors based on three-dimensional molybdenum disulfide (MoS2) field-effect transistors

Nanophotonics ◽  
2020 ◽  
Vol 9 (16) ◽  
pp. 4719-4728
Author(s):  
Tao Deng ◽  
Shasha Li ◽  
Yuning Li ◽  
Yang Zhang ◽  
Jingye Sun ◽  
...  
Keyword(s):  
Molybdenum Disulfide ◽  
Field Effect ◽  
High Performance ◽  
Field Effect Transistors ◽  
Three Dimensional ◽  
Polarized Light ◽  
Optical Field ◽  
Two Dimensional ◽  
Polarization Ratio ◽  
Two Dimensional Materials

AbstractThe molybdenum disulfide (MoS2)-based photodetectors are facing two challenges: the insensitivity to polarized light and the low photoresponsivity. Herein, three-dimensional (3D) field-effect transistors (FETs) based on monolayer MoS2 were fabricated by applying a self–rolled-up technique. The unique microtubular structure makes 3D MoS2 FETs become polarization sensitive. Moreover, the microtubular structure not only offers a natural resonant microcavity to enhance the optical field inside but also increases the light-MoS2 interaction area, resulting in a higher photoresponsivity. Photoresponsivities as high as 23.8 and 2.9 A/W at 395 and 660 nm, respectively, and a comparable polarization ratio of 1.64 were obtained. The fabrication technique of the 3D MoS2 FET could be transferred to other two-dimensional materials, which is very promising for high-performance polarization-sensitive optical and optoelectronic applications.

Interpenetrating Gels as Conducting/Adhering Matrices Enabling High-Performance Silicon Anodes

2021 ◽  
Author(s):  
Tingting Xia ◽  
Chengfei Xu ◽  
Pengfei Dai ◽  
Xiaoyun Li ◽  
Riming Lin ◽  
...  
Keyword(s):  
Energy Storage ◽  
High Performance ◽  
Electrode Materials ◽  
Three Dimensional ◽  
Electrochemical Energy Storage ◽  
Active Materials ◽  
Silicon Anodes ◽  
Weak Binding ◽  
Binding Forces

Three-dimensional (3D) conductive polymers are promising conductive matrices for electrode materials toward electrochemical energy storage. However, their fragile nature and weak binding forces with active materials could not guarantee long-term...

scholarly journals 3D Printing of High Viscosity Reinforced Silicone Elastomers

Polymers ◽  
2021 ◽  
Vol 13 (14) ◽  
pp. 2239
Author(s):  
Nicholas Rodriguez ◽  
Samantha Ruelas ◽  
Jean-Baptiste Forien ◽  
Nikola Dudukovic ◽  
Josh DeOtte ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
High Performance ◽  
New Technologies ◽  
Three Dimensional ◽  
High Viscosity ◽  
Layer By Layer ◽  
Silicone Elastomers ◽  
Uv Curable ◽  
Octet Truss ◽  
Tunable Mechanical Properties

Recent advances in additive manufacturing, specifically direct ink writing (DIW) and ink-jetting, have enabled the production of elastomeric silicone parts with deterministic control over the structure, shape, and mechanical properties. These new technologies offer rapid prototyping advantages and find applications in various fields, including biomedical devices, prosthetics, metamaterials, and soft robotics. Stereolithography (SLA) is a complementary approach with the ability to print with finer features and potentially higher throughput. However, all high-performance silicone elastomers are composites of polysiloxane networks reinforced with particulate filler, and consequently, silicone resins tend to have high viscosities (gel- or paste-like), which complicates or completely inhibits the layer-by-layer recoating process central to most SLA technologies. Herein, the design and build of a digital light projection SLA printer suitable for handling high-viscosity resins is demonstrated. Further, a series of UV-curable silicone resins with thiol-ene crosslinking and reinforced by a combination of fumed silica and MQ resins are also described. The resulting silicone elastomers are shown to have tunable mechanical properties, with 100–350% elongation and ultimate tensile strength from 1 to 2.5 MPa. Three-dimensional printed features of 0.4 mm were achieved, and complexity is demonstrated by octet-truss lattices that display negative stiffness.

scholarly journals Data-Driven Intelligent 3D Surface Measurement in Smart Manufacturing: Review and Outlook

Machines ◽  
2021 ◽  
Vol 9 (1) ◽  
pp. 13
Author(s):  
Yuhang Yang ◽  
Zhiqiao Dong ◽  
Yuquan Meng ◽  
Chenhui Shao
Keyword(s):  
High Resolution ◽  
High Performance ◽  
Sampling Design ◽  
Three Dimensional ◽  
Measurement Data ◽  
Data Driven ◽  
Surface Measurement ◽  
Smart Manufacturing ◽  
Future Research ◽  
3D Surface

High-fidelity characterization and effective monitoring of spatial and spatiotemporal processes are crucial for high-performance quality control of many manufacturing processes and systems in the era of smart manufacturing. Although the recent development in measurement technologies has made it possible to acquire high-resolution three-dimensional (3D) surface measurement data, it is generally expensive and time-consuming to use such technologies in real-world production settings. Data-driven approaches that stem from statistics and machine learning can potentially enable intelligent, cost-effective surface measurement and thus allow manufacturers to use high-resolution surface data for better decision-making without introducing substantial production cost induced by data acquisition. Among these methods, spatial and spatiotemporal interpolation techniques can draw inferences about unmeasured locations on a surface using the measurement of other locations, thus decreasing the measurement cost and time. However, interpolation methods are very sensitive to the availability of measurement data, and their performances largely depend on the measurement scheme or the sampling design, i.e., how to allocate measurement efforts. As such, sampling design is considered to be another important field that enables intelligent surface measurement. This paper reviews and summarizes the state-of-the-art research in interpolation and sampling design for surface measurement in varied manufacturing applications. Research gaps and future research directions are also identified and can serve as a fundamental guideline to industrial practitioners and researchers for future studies in these areas.

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