Modeling Vibration Induced Fatigue Failure of Free Standing Wire Bonds
Abstract Wire bonds are used to connect device terminals to package terminals or substrate terminal that forms circuits that are needed to create desired higher level functions. If a wire bond breaks or becomes detached during operation, the desired function will be lost. Depending on the design, a loss in function could be catastrophic. Aluminum, gold, and copper wires are used to create wire bonds in electronic products. These materials have been selected for their ability to be formed as fine wires and their ability to provide low electrical resistance. In many electronics packages, wire bonds are encapsulated in a polymer molding compound that is used to protect the electronic device. However, in some electronic devices such as hermetically sealed cavity packages, wire bonds may be free-standing. Under vibration loading, free-standing wire bonds may be subject to failure due to mechanical fatigue. In this work, an analytic model is presented for predicting natural frequency of a free-standing wire bond and for assessing a wire bond time to failure under a harmonic loading condition. The model for natural frequency is calibrated by finite element analysis and validated through experimental testing. The life prediction model, a test plan, and preliminary test results are presented.