Wire Adhesion Testing
Abstract The results of this study are conclusive. The ASTM D-2229 Test Method is not a reliable test for measuring adhesion of wire cords to rubber compounds. However, by using the basic design and modifying it, an accurate measurement of bond strength on a macroscopic level can be obtained. This test is insensitive for all practical purposes to compound physical properties and changes in cord diameter and embedded length—for both stranded and rod-like cords. It is also possible with this test to calculate the amount of stress that is exerted on the surface of the wire cord to determine the relationship between failing stress and the material strength of the rubber compound. Properly used, this new test should give the compounder a better tool to study the adhesion of compounds to metal.