Cross-Section Analysis by Electron Backscatter Diffraction of Textured BaTiO3Thick Films Prepared by Screen Printing

2012 ◽  
Vol 51 (9S1) ◽  
pp. 09LA02
Author(s):  
Yuichi Sakai ◽  
Tomoaki Futakuchi
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.


2020 ◽  
Vol 89 (2) ◽  
pp. 20901
Author(s):  
Aurélien Fouque ◽  
Alexandre Bonhomme ◽  
Georges Cailletaud ◽  
François Chaudot ◽  
Vladimir A. Esin ◽  
...  

A method is proposed to estimate the characteristics of the power flux supplied to an anode and a cathode in Ag-SnO2 submitted to an AC electric arc with a maximal value of the arc current intensity about 400–500 A and an arc duration about 4–5 ms. It is based on the one hand on the observation by optical microscopy and Electron BackScatter Diffraction (EBSD) of the area melted by the arc, thus making it possible to evaluate the depth and radius melted, and on the other hand on a thermal modelling allowing to estimate an equivalent voltage (proportionality coefficient between the intensity of the arc current and the received power) and the power flux surface density.


Materials ◽  
2018 ◽  
Vol 11 (8) ◽  
pp. 1434 ◽  
Author(s):  
Jan Maňák ◽  
David Vokoun

In the present study, in situ microbending experiments on magnesium single crystalline microcantilevers are presented. Microcantilevers with pentagonal cross-section were fabricated by focus ion beam. Two basic crystallographic orientations of the microcantilevers were investigated: {0001} and {10-10}, i.e., the c-axis perpendicular to and parallel with the cantilever top surface, respectively. After bending, the longitudinal sections of the microcantilevers were analyzed using electron backscatter diffraction to investigate the crystal lattice rotations and accumulated deformations. The stress levels in the loaded cantilevers are strongly dependent on the crystal orientation. Extension twins were found in the {10-10} cantilevers.


2011 ◽  
Vol 1324 ◽  
Author(s):  
H.R. Moutinho ◽  
R.G. Dhere ◽  
C.-S. Jiang ◽  
M.M. Al-Jassim

ABSTRACTElectron backscatter diffraction (EBSD) provides information on the crystallographic structure of a sample, while scanning Kelvin probe microscopy (SKPM) provides information on its electrical properties. The advantage of these techniques is their high spatial resolution, which cannot be attained with any other techniques. However, because these techniques analyze the top layers of the sample, surface or cross section features directly influence the results of the measurements, and sample preparation is a main step in the analysis.In this work we investigated different methods to prepare cross sections of CdTe/CdS solar cells for EBSD and SKPM analyses. We observed that procedures used to prepare surfaces for EBSD are not suitable to prepare cross sections, and we were able to develop a process using polishing and ion-beam milling. This process resulted in very good results and allowed us to reveal important aspects of the cross section of the CdTe films. For SKPM, polishing and a light ion-beam milling resulted in cross sections that provided good data. We were able to observe the depletion region on the CdTe film and the p-n junction as well as the interdiffusion layer between CdTe and CdS. However, preparing good-quality cross sections for SKPM is not a reproducible process, and artifacts are often observed.


2001 ◽  
Vol 7 (S2) ◽  
pp. 374-375
Author(s):  
S. R. Claves ◽  
W. Z. Misiolek ◽  
D. B. Williams

Electron backscatter diffraction (EBSD) is a powerful tool used for the characterization of deformed microstructures and has been successfully applied to determine the microtexture of specific regions of bulk samples. The work presented here is a continuation of previous analyses investigating the microstructural response of 6xxx aluminum extrudates to complex die designs. Specifically, the grain orientations across longitudinal welds produced from porthole dies is being studied.Previous work examined the cross section of a sample that was extruded using a specially designed die that would position the weld in the center of the part. This specimen, shown in Figure 1, is a simple, solid, rectangular shape produced under controlled conditions. The other sample being studied, seen in Figure 2, was part of an actual extrusion run, conducted with typical industrial parameters. This sample is part of a complex shape that uses a porthole die to produce hollow sections.


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