Reliability Analysis for Integrated Circuit Amplifiers Used in Neural Measurement Systems

2013 ◽  
Author(s):  
Nico Hellwege ◽  
Nils Heidmann ◽  
Dagmar Peters-Drolshagen ◽  
Steffen Paul
Keyword(s):  
Reliability Analysis ◽  
Integrated Circuit ◽  
Measurement Systems

The Root of All “IVA”—A Quantitative Analysis of LSIM Bias/Detection Systems

2004 ◽  
Author(s):  
T. M. Levin
Keyword(s):  
Integrated Circuit ◽  
Transfer Functions ◽  
Constant Current ◽  
Measurement Systems ◽  
Detection Systems ◽  
Noise Characteristics ◽  
Laser Signal ◽  
Bias Detection ◽  
Improved Performance ◽  
Detection Schemes

Abstract The transfer functions of the bias/detection circuits used in various laser signal injection microscopy (LSIM) techniques, especially for those using constant current bias/detection schemes, are largely unknown. This article provides both qualitative and quantitative measures of various LSIM bias/detection schemes to develop a more complete understanding of the varying measurement systems. The authors have measured the characteristics of a variety of bias/detection circuits in ways that are similar to the characterization of a linear integrated circuit. They have concentrated on examining the frequency response, pulse response, and noise levels. It was found that the LSIM bias/detection systems have widely varying characteristics which, in turn will affect how they can be optimized. Furthermore, the relationship between the frequency and noise characteristics of the bias/detection systems and the input signal that is to be detected point to differing ways in which the systems can be modified for improved performance.

scholarly journals An integrated circuit to null standby using energy provided by MEMS sensors

ACTA IMEKO ◽  
2020 ◽  
Vol 9 (4) ◽  
pp. 144
Author(s):  
Roberto La Rosa ◽  
A. Y. S. Pandiyan ◽  
Carlo Trigona ◽  
Bruno Andò ◽  
Salvatore Baglio
Keyword(s):  
Integrated Circuit ◽  
Power Dissipation ◽  
Cost Effective ◽  
Total Power ◽  
Zero Energy ◽  
Battery Lifetime ◽  
Measurement Systems ◽  
Energy Harvesters ◽  
Main Target ◽  
Smart Measurement

The advent of smart measurement systems and innovative wireless sensor networks evinces the necessity to develop novel solutions for conditioning circuits to be used in autonomous or quasi autonomous measurement systems and sensing nodes. The main problem these systems still face is the question of how to supply the nodes in a cost-effective way, considering that, very often, a battery is required, and consequently, the maintenance labor and cost to replace or recharge it may be high. The main target is to increase battery lifetime by decreasing unnecessary energy consumption as much as possible. In this context, several solutions, including energy harvesters, have already been proposed. One of the main solutions is the reduction of power consumption by the measurement device while in standby, which, in most cases, represents a significant amount of the total power dissipation. To this end, authors have already addressed a zero-energy standby solution able to supply the power requested by the measurement equipment only when the appliance is turned on. In this paper, we present an integrated circuit solution suitable to be used with MEMS scale transducers. The validation and the characterisation of the system will be shown to demonstrate the suitability of the proposed method.

Network structure and reliability analysis of a new integrated circuit card payment system for hospital

2013 ◽  
Vol 18 (5) ◽  
pp. 630-633 ◽  
Author(s):  
Jing Zhang ◽  
Xi-tao Zheng ◽  
Ye-hua Yu ◽  
Yong-wei Zhang ◽  
Kun Yang ◽  
...  
Keyword(s):  
Reliability Analysis ◽  
Network Structure ◽  
Integrated Circuit ◽  
Payment System ◽  
Card Payment

Characteristics of Photodiode Arrays for Spectrochemical Measurements

1976 ◽  
Vol 30 (2) ◽  
pp. 113-123 ◽  
Author(s):  
Gary Horlick
Keyword(s):  
Integrated Circuit ◽  
Image Sensor ◽  
Image Sensors ◽  
Spectral Information ◽  
Measurement Capability ◽  
Measurement Systems ◽  
Operational Characteristics ◽  
Photodiode Array ◽  
Photodiode Arrays ◽  
Element Array

A rather large number of spectrochemical studies and analyses can be greatly facilitated by the simultaneous measurement of spectral information over a range of wavelengths. Of particular importance and interest to analytical spectroscopists is the development of simultaneous multielement analysis systems. The development and implementation of such analyses have been hampered by a lack of convenient and versatile multichannel spectrochemical measurement systems. New detector subsystems based on modern electronic image sensors are helping to overcome this obstacle. One type of electronic image sensor is the self-scanning linear array of silicon photodiodes. These arrays are available with densities of 1024 photodiodes per in and in lengths of up to 1 in. They are packaged in conventional dual-in-line integrated circuit packages complete with the necessary scanning circuitry. These sensors have simple and inexpensive control and measurement circuitry, and superior blooming and lag performance when compared to most other electronic image sensors. In addition, the signal integrating capability of the arrays is a flexible and powerful asset for many spectrochemical measurements. These and other operational characteristics of photodiode arrays are emphasized in this study. In addition, the measurement capability of a computer coupled photodiode array spectrometer based on a 1024 element array which is capable of simultaneously measuring over 50 nm (500 Å) of continuous spectral information anywhere from 200 to 1000 nm is illustrated.

The Precipitation of Si in AlCuSi Thin Films

1973 ◽  
Vol 31 ◽  
pp. 34-35 ◽  
Author(s):  
R. M. Anderson
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Heat Treatment ◽  
Solid Solution ◽  
Integrated Circuit ◽  
Copper Film ◽  
Solution Concentration ◽  
X Ray ◽  
Silicon Thin Films ◽  
Before And After

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.

Characterization of RF Sputtered ZnO Piezoelectric Films Using Transmission Electron Microscope

1975 ◽  
Vol 33 ◽  
pp. 86-87
Author(s):  
Kemining W. Yeh ◽  
Richard S. Muller ◽  
Wei-Kuo Wu ◽  
Jack Washburn
Keyword(s):  
Integrated Circuit ◽  
Acoustic Waves ◽  
New Technology ◽  
Surface Acoustic Waves ◽  
Electromechanical Properties ◽  
Leading Role ◽  
Saw Devices ◽  
Transmission Electron ◽  
High Degree

Considerable and continuing interest has been shown in the thin film transducer fabrication for surface acoustic waves (SAW) in the past few years. Due to the high degree of miniaturization, compatibility with silicon integrated circuit technology, simplicity and ease of design, this new technology has played an important role in the design of new devices for communications and signal processing. Among the commonly used piezoelectric thin films, ZnO generally yields superior electromechanical properties and is expected to play a leading role in the development of SAW devices.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

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