A study of the influence of high-speed press bottom dead-center displacement and fluctuation on motor core products

2020 ◽  
Vol 42 (6) ◽  
Author(s):  
Chun-Kyu Lee ◽  
Seung-Soo Kim ◽  
Min Lee ◽  
Jae-Woong Yun
Keyword(s):  
High Speed ◽  
Bottom Dead Center

Dynamic precision analysis and experimental verification of high-speed precision punch press

2016 ◽  
Vol 230 (20) ◽  
pp. 3655-3662 ◽  
Author(s):  
Fengfeng Hu ◽  
Yu Sun ◽  
Binbin Peng
Keyword(s):  
Elastic Wave ◽  
Dynamic Model ◽  
High Speed ◽  
Impact Factors ◽  
Superposition Method ◽  
Bottom Dead Center ◽  
Dynamic Precision ◽  
Modal Superposition Method ◽  
The Impact ◽  
Punch Press

In order to investigate the impact factors and their affection on high-speed precision multilink punch press (MPP), the dynamic model with different joint clearance was established, and the influence of different clearance and speed on the dynamic positional repeatability of bottom dead center (BDC) was analyzed. The elastic dynamic model of high-speed MPP was established, the affection of the elastic deformation and elastic wave on the positional repeatability of the BDC were presented by using modal superposition method to solve dynamic equation. Meanwhile, experiments on the dynamic repeatability of the BDC of the punch during working were completed. At last, the comparison of the experimental results with the analyzed results was given, and based on which, it can be concluded that the clearance, elastic wave and deformation are the key factors of the dynamic repeatability precision of the BDC.

Bottom Dead Center Repeat Precision of High-Speed Press Measurement

2012 ◽  
Vol 249-250 ◽  
pp. 31-35 ◽  
Author(s):  
Xiang Zheng ◽  
Jun Ling Wang ◽  
Jing Lin Yao
Keyword(s):  
High Speed ◽  
Production Level ◽  
Technical Level ◽  
Evaluation Standard ◽  
Testing Apparatus ◽  
Bottom Dead Center ◽  
Important Index ◽  
The Press ◽  
Practical Guidance ◽  
Test Result

Bottom dead center repeat precision is the key evaluation standard of high-speed press, it’s an important index to judge production level and technical level. Use model RM-7201 testing apparatus to measure bottom dead center of high-speed press at different conditions, find out laws according to the test result. These findings may helpful in proving correctness of bottom dead center precision analysis and to control the B.D.C precision of the high-speed press. Provide practical guidance basis to improve the press structure and bottom dead center precision.

Influence of Crank Radius on the Curve Shapes for a Multi-Link High-Speed Precision Press

2011 ◽  
Vol 141 ◽  
pp. 313-318 ◽  
Author(s):  
Xin Jian Lu ◽  
Si Hong Zhu ◽  
Zun Mang Ke ◽  
Jian Qin ◽  
Shao Wei
Keyword(s):  
Simulation Model ◽  
Dynamic Simulation ◽  
High Speed ◽  
Lateral Force ◽  
Inertial Forces ◽  
Software Environment ◽  
Bottom Dead Center ◽  
The Press ◽  
Adams Software ◽  
Dynamic Simulation Model

The parameterized dynamic simulation model for a multi-link high precision press has been established in the ADAMS software environment based on the displacement equations. The press being developed is taken as an example to study the slider’s displacement curves, velocity curves and acceleration curves under different crank radius in practice as well as the working angle curves and torque curves. With the crank radius increasing, the started punching angle comes early and the slider’s velocity and acceleration at bottom dead center (B.D.C) decreases significantly which help to improve the accuracy of B.D.C and to lower the torque consumption during stamping. Meanwhile, the increasing of working angle helps to reduce the lateral force acting on the slider, such as the torque required to overcome the inertial forces increases rapidly, the torque needed to overcome the nominal force decreases and the peak of nominal force shifts to the lower left gradually. Results of the research mentioned above are helpful to develop the multi-link high-speed press.

Microfabrication research at the National Submicron Facility

1983 ◽  
Vol 41 ◽  
pp. 86-89
Author(s):  
E.D. Wolf
Keyword(s):  
Integrated Circuits ◽  
Particle Physics ◽  
High Speed ◽  
New Technology ◽  
High Energy ◽  
High Energy Particle ◽  
New Science ◽  
Wide Range ◽  
Intermediate Domain ◽  
Circuit Function

Most microelectronics devices and circuits operate faster, consume less power, execute more functions and cost less per circuit function when the feature-sizes internal to the devices and circuits are made smaller. This is part of the stimulus for the Very High-Speed Integrated Circuits (VHSIC) program. There is also a need for smaller, more sensitive sensors in a wide range of disciplines that includes electrochemistry, neurophysiology and ultra-high pressure solid state research. There is often fundamental new science (and sometimes new technology) to be revealed (and used) when a basic parameter such as size is extended to new dimensions, as is evident at the two extremes of smallness and largeness, high energy particle physics and cosmology, respectively. However, there is also a very important intermediate domain of size that spans from the diameter of a small cluster of atoms up to near one micrometer which may also have just as profound effects on society as “big” physics.

Vacuum System to Minimize the Specimen Contamination of High-Performance EM

1977 ◽  
Vol 35 ◽  
pp. 68-69
Author(s):  
N. Yoshimura ◽  
K. Shirota ◽  
T. Etoh
Keyword(s):  
Electron Microscope ◽  
High Speed ◽  
High Performance ◽  
High Vacuum ◽  
Vacuum System ◽  
Pump System ◽  
Pumping System ◽  
Diffusion Pump ◽  
Almost All ◽  
Cascade Type

One of the most important requirements for a high-performance EM, especially an analytical EM using a fine beam probe, is to prevent specimen contamination by providing a clean high vacuum in the vicinity of the specimen. However, in almost all commercial EMs, the pressure in the vicinity of the specimen under observation is usually more than ten times higher than the pressure measured at the punping line. The EM column inevitably requires the use of greased Viton O-rings for fine movement, and specimens and films need to be exchanged frequently and several attachments may also be exchanged. For these reasons, a high speed pumping system, as well as a clean vacuum system, is now required. A newly developed electron microscope, the JEM-100CX features clean high vacuum in the vicinity of the specimen, realized by the use of a CASCADE type diffusion pump system which has been essentially improved over its predeces- sorD employed on the JEM-100C.

The on-line use of histogram data for high-speed correction and alignment of electron microscope images

1984 ◽  
Vol 42 ◽  
pp. 556-557
Author(s):  
William Krakow
Keyword(s):  
Power Spectrum ◽  
High Speed ◽  
Direct Memory Access ◽  
Digital Television ◽  
Contrast Transfer Function ◽  
The Past ◽  
High Resolution Tem ◽  
On Line ◽  
Correction Of Astigmatism ◽  
The Fourier Transform

In the past few years on-line digital television frame store devices coupled to computers have been employed to attempt to measure the microscope parameters of defocus and astigmatism. The ultimate goal of such tasks is to fully adjust the operating parameters of the microscope and obtain an optimum image for viewing in terms of its information content. The initial approach to this problem, for high resolution TEM imaging, was to obtain the power spectrum from the Fourier transform of an image, find the contrast transfer function oscillation maxima, and subsequently correct the image. This technique requires a fast computer, a direct memory access device and even an array processor to accomplish these tasks on limited size arrays in a few seconds per image. It is not clear that the power spectrum could be used for more than defocus correction since the correction of astigmatism is a formidable problem of pattern recognition.

Structural changes in silicon-on-insulator material during post-implantation annealing

1986 ◽  
Vol 44 ◽  
pp. 736-737
Author(s):  
C. O. Jung ◽  
S. J. Krause ◽  
S.R. Wilson
Keyword(s):  
Integrated Circuits ◽  
Oxide Layer ◽  
High Speed ◽  
Structural Changes ◽  
Device Fabrication ◽  
Silicon On Insulator ◽  
High Quality ◽  
Radiation Hardened ◽  
Post Implantation ◽  
Very High

Silicon-on-insulator (SOI) structures have excellent potential for future use in radiation hardened and high speed integrated circuits. For device fabrication in SOI material a high quality superficial Si layer above a buried oxide layer is required. Recently, Celler et al. reported that post-implantation annealing of oxygen implanted SOI at very high temperatures would eliminate virtually all defects and precipiates in the superficial Si layer. In this work we are reporting on the effect of three different post implantation annealing cycles on the structure of oxygen implanted SOI samples which were implanted under the same conditions.

An atomic-resolution microscope study of Al contracts on GaAs

1986 ◽  
Vol 44 ◽  
pp. 726-727
Author(s):  
Z. Liliental-Weber ◽  
C. Nelson ◽  
R. Ludeke ◽  
R. Gronsky ◽  
J. Washburn
Keyword(s):  
High Speed ◽  
Schottky Contacts ◽  
Detailed Knowledge ◽  
The Past ◽  
Semiconductor Interfaces ◽  
Deposited Metal ◽  
Microwave Applications ◽  
Free Interfaces ◽  
Potential Use

The properties of metal/semiconductor interfaces have received considerable attention over the past few years, and the Al/GaAs system is of special interest because of its potential use in high-speed logic integrated optics, and microwave applications. For such materials a detailed knowledge of the geometric and electronic structure of the interface is fundamental to an understanding of the electrical properties of the contact. It is well known that the properties of Schottky contacts are established within a few atomic layers of the deposited metal. Therefore surface contamination can play a significant role. A method for fabricating contamination-free interfaces is absolutely necessary for reproducible properties, and molecularbeam epitaxy (MBE) offers such advantages for in-situ metal deposition under UHV conditions

Scanning x-ray fluorescence microscopy and principal component analysis

1992 ◽  
Vol 50 (2) ◽  
pp. 1752-1753
Author(s):  
Brian Cross
Keyword(s):  
Principal Component Analysis ◽  
Fluorescence Microscopy ◽  
Spatial Resolution ◽  
High Speed ◽  
Image Acquisition ◽  
Principal Component ◽  
Fluorescence Microscope ◽  
Acquisition Rate ◽  
X Ray ◽  
Speed Up

A relatively new entry, in the field of microscopy, is the Scanning X-Ray Fluorescence Microscope (SXRFM). Using this type of instrument (e.g. Kevex Omicron X-ray Microprobe), one can obtain multiple elemental x-ray images, from the analysis of materials which show heterogeneity. The SXRFM obtains images by collimating an x-ray beam (e.g. 100 μm diameter), and then scanning the sample with a high-speed x-y stage. To speed up the image acquisition, data is acquired "on-the-fly" by slew-scanning the stage along the x-axis, like a TV or SEM scan. To reduce the overhead from "fly-back," the images can be acquired by bi-directional scanning of the x-axis. This results in very little overhead with the re-positioning of the sample stage. The image acquisition rate is dominated by the x-ray acquisition rate. Therefore, the total x-ray image acquisition rate, using the SXRFM, is very comparable to an SEM. Although the x-ray spatial resolution of the SXRFM is worse than an SEM (say 100 vs. 2 μm), there are several other advantages.

Image quality vs data obtainment in biological electron microscopy

1986 ◽  
Vol 44 ◽  
pp. 42-43
Author(s):  
J. E. Johnson
Keyword(s):  
Electron Microscopy ◽  
Endoplasmic Reticulum ◽  
Electron Beam ◽  
Image Quality ◽  
High Speed ◽  
Early Period ◽  
Early Years ◽  
Fluorescent Screen ◽  
Embedding Medium

In the early years of biological electron microscopy, scientists had their hands full attempting to describe the cellular microcosm that was suddenly before them on the fluorescent screen. Mitochondria, Golgi, endoplasmic reticulum, and other myriad organelles were being examined, micrographed, and documented in the literature. A major problem of that early period was the development of methods to cut sections thin enough to study under the electron beam. A microtome designed in 1943 moved the specimen toward a rotary “Cyclone” knife revolving at 12,500 RPM, or 1000 times as fast as an ordinary microtome. It was claimed that no embedding medium was necessary or that soft embedding media could be used. Collecting the sections thus cut sounded a little precarious: “The 0.1 micron sections cut with the high speed knife fly out at a tangent and are dispersed in the air. They may be collected... on... screens held near the knife“.

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