scholarly journals Experimental investigations of thermal resistance of a heat sink with horizontal embedded heat pipes

2007 ◽  
Vol 34 (8) ◽  
pp. 958-970 ◽  
Author(s):  
Jung-Chang Wang ◽  
Hsiang-Sheng Huang ◽  
Sih-Li Chen
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Heat Pipes ◽  
Experimental Investigations

scholarly journals Experimental Investigations of Different Loudspeakers Applied as Synthetic Jet Actuators

Actuators ◽  
2021 ◽  
Vol 10 (9) ◽  
pp. 224
Author(s):  
Paweł Gil ◽  
Joanna Wilk
Keyword(s):  
Thermal Resistance ◽  
Resonance Frequency ◽  
Sound Pressure Level ◽  
Heat Sink ◽  
Sound Pressure ◽  
Pressure Level ◽  
Synthetic Jet ◽  
Experimental Investigations ◽  
Driving Frequency ◽  
Jet Velocity

The paper presents the preliminary results of the experimental investigation of four various loudspeakers used for driving the synthetic jet actuator. The parameters, characteristic synthetic jet velocity, pressure inside the cavity, device sound pressure level (SPL), and the heat sink thermal resistance, were presented for various input power and driving frequency. The resonance frequency was determined based on electrical impedance. The highest synthetic jet momentum velocity was achieved at diaphragm resonance frequency. The maximum sound pressure level was observed, also at resonant frequency. For the same real power delivered to the actuator and for its resonance frequency, the heat sink thermal resistance had the lowest value for the specific loudspeaker. In turn, the synthetic jet velocity reached maximum for this actuator. For all actuators tested, the sound pressure level was dependent on momentum velocity.

Experimental Investigation on Thermal Performance of Heat Sink With Two Pairs of Embedded Heat Pipes

2007 ◽  
Author(s):  
Hsiang-Sheng Huang ◽  
Jung-Chang Wang ◽  
Sih-Li Chen
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Heat Transfer Rate ◽  
Thermal Performance ◽  
Heat Sink ◽  
Transfer Rate ◽  
Heat Pipes ◽  
Total Heat ◽  
Heating Power ◽  
Total Heat Transfer

This article provides an experimental method to study the thermal performance of a heat sink with two pairs (outer and inner pair) of embedded heat pipes. The proposed method can determine the heat transfer rate of the heat pipes under various heating power of the heat source. A comprehensive thermal resistance network of the heat sink is also developed. The network estimates the thermal resistances of the heat sink by applying the thermal performance test result. The results show that the outer and inner pairs of heat pipes carries 21% and 27% of the total heat transfer rate respectively, while 52% of the heating power is dissipated from the base plate to the fins. The dominated thermal resistance of the heat sink is the base to heat pipes resistance which is strongly affected by the thermal performance of the heat pipes. The total thermal resistance of the heat sink shows the lowest value, 0.23°C/W, while the total heat transfer rate of the heat sink is 140W and the heat transfer rate of the outer and inner pairs of heat pipes is 30W and 38 W, respectively.

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

2015 ◽  
Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Computational Study ◽  
Heat Sinks ◽  
Channel Diameter ◽  
Internal Channel ◽  
Study Results ◽  
Parametric Effects

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

Experimental investigations of flat T-shaped copper and titanium heat pipes

2021 ◽  
pp. 117454
Author(s):  
Denis A. Nesterov ◽  
Valery A. Derevyanko ◽  
Sergey B. Suntsov
Keyword(s):  
Heat Pipes ◽  
Experimental Investigations

Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Krzysztof Posobkiewicz ◽  
Krzysztof Górecki
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Cooling System ◽  
Heat Sinks ◽  
Cooling Power ◽  
Cooling Systems ◽  
Content Type ◽  
Peltier Module ◽  
Peltier Modules ◽  
Forced Air

Purpose The purpose of this study is to investigate the validation of the usefulness of cooling systems containing Peltier modules for cooling power devices based on measurements of the influence of selected factors on the value of thermal resistance of such a cooling system. Design/methodology/approach A cooling system containing a heat-sink, a Peltier module and a fan was built by the authors and the measurements of temperatures and thermal resistance in various supply conditions of the Peltier module and the fan were carried out and discussed. Findings Conclusions from the research carried out answer the question if the use of Peltier modules in active cooling systems provides any benefits comparing with cooling systems containing just passive heat-sinks or conventional active heat-sinks constructed of a heat-sink and a fan. Research limitations/implications The research carried out is the preliminary stage to asses if a compact thermal model of the investigated cooling system can be formulated. Originality/value In the paper, the original results of measurements and calculations of parameters of a cooling system containing a Peltier module and an active heat-sink are presented and discussed. An influence of power dissipated in the components of the cooling system on its efficiency is investigated.

THERMAL AND HYDRODYNAMIC PERFORMANCE OF A MICROCHANNEL HEAT SINK COOLED WITH CARBON NANOTUBES NANOFLUID

2016 ◽  
Vol 78 (10-2) ◽  
Author(s):  
Nik Ahmad Faiz Nik Mazlam ◽  
Normah Mohd-Ghazali ◽  
Thierry Mare ◽  
Patrice Estelle ◽  
Salma Halelfadl
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Operating Temperature ◽  
Heat Removal ◽  
Hydrodynamic Performance ◽  
Spherical Particles ◽  
Microchannel Heat Sink ◽  
Pumping Power ◽  
Rectangular Microchannel ◽  
Aspect Ratios

The microchannel heat sink (MCHS) has been established as an effective heat removal system in electronic chip packaging. With increasing power demand, research has advanced beyond the conventional coolants of air and water towards nanofluids with their enhanced heat transfer capabilities. This research had been carried out on the optimization of the thermal and hydrodynamic performance of a rectangular microchannel heat sink (MCHS) cooled with carbon nanotube (CNT) nanofluid, a coolant that has recently been discovered with improved thermal conductivity. Unlike the common nanofluids with spherical particles, nanotubes generally come in cylindrical structure characterized with different aspect ratios. A volume concentration of 0.1% of the CNT nanofluid is used here; the nanotubes have an average diameter and length of 9.2 nm and 1.5 mm respectively. The nanofluid has a density of 1800 kg/m3 with carbon purity 90% by weight having lignin as the surfactant. The approach used for the optimization process is based on the thermal resistance model and it is analyzed by using the non-dominated sorting multi-objective genetic algorithm. Optimized outcomes include the channel aspect ratio and the channel wall ratio at the optimal values of thermal resistance and pumping power. The optimized results show that, at high operating temperature of 40°C the use of CNT nanofluid reduces the total thermal resistance by 3% compared to at 20°C and consequently improve the thermal performance of the fluid. In terms of the hydrodynamic performance, the pumping power is also being reduced significantly by 35% at 40°C compared to the lower operating temperature.  

A Novel Electronics Cooling System Using Water Heat Pipes Under Freezing Conditions

2003 ◽  
Author(s):  
Osamu Suzuki ◽  
Atsuo Nishihara
Keyword(s):  
Prediction Model ◽  
Thermal Resistance ◽  
Ambient Temperature ◽  
Cooling System ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
System Model ◽  
Cooling Performance ◽  
Temperature Range ◽  
Metal Block

A novel electronics cooling system that uses water heat pipes under an ambient temperature range from −30°C to 40°C has been developed. The system consists of several water heat pipes, air-cooled fins, and a metal block. The heat pipes are separated into two groups according to the thermal resistance of their fins. One set of heat pipes, which have fins with higher thermal resistance, operates under an ambient temperature range from −30°C to 40°C. The other set, which have lower resistance, operates from 0°C to 40°C. A prediction model based on the frozen-startup limitation of a single heat pipe was first devised and experimentally verified. Then, a prediction model for the whole-system was formulated according to the former model. The whole-system model was used to design a prototype cooling system, and it was confirmed that the prototype has a suitable cooling performance for an environmentally friendly electronics cooling system.

scholarly journals Contact thermal resistance of capillary structures of heat pipes in heat-exchange systems of spacecrafts and helioenergetics

2009 ◽  
Vol 15 (1) ◽  
pp. 75-79
Author(s):  
A.G. Kostornov ◽  
◽  
A.A. Shapoval ◽  
G.A. Frolov ◽  
I.V. Shapoval ◽  
...  
Keyword(s):  
Heat Exchange ◽  
Thermal Resistance ◽  
Heat Pipes ◽  
Contact Thermal Resistance

scholarly journals Optimisation of a microelectronic assembly package using response surface methodology

2021 ◽  
Vol 39 (4) ◽  
pp. 1058-1065
Author(s):  
M. Ekpu
Keyword(s):  
Response Surface Methodology ◽  
Thermal Resistance ◽  
Response Surface ◽  
Heat Sink ◽  
Chip Thickness ◽  
Thermal Interface Material ◽  
Resistance Response ◽  
Temperature Solution ◽  
Design Software ◽  
Central Composite

This article addressed heat conduction in microelectronics applications. ANSYS finite element design software was used to design the model, while Design Expert software was used for the response surface methodology (RSM) analysis. The components analysed were heat-sink base (HSB) thickness, thermal interface material (TIM) thickness, and chip thickness. A design of experiment comprising of 15 central composite design (CCD) for the coded levels (low (-) and high (+)) of the factors were generated. Heat flow was applied to the chip while a convective coefficient was applied to the heat-sink. The temperature solution was used to calculate the thermal resistance response for the 15 CCD experimental runs. The results from the RSM study proposed an optimal (minimization analysis) combination of 3.5 mm, 0.04 mm, and 0.75 mm, for HSB thickness, TIM thickness, and chip thickness respectively. While the optimal mean thermal resistance of 0.31052 K/W was achieved from the proposed optimal parameters. Keywords: RSM; CCD; thermal resistance; temperature; microelectronics

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