3D cell aggregate printing technology and its applications

2021 ◽  
Author(s):  
Seunggyu Jeon ◽  
Se-Hwan Lee ◽  
Saeed B. Ahmed ◽  
Jonghyeuk Han ◽  
Su-Jin Heo ◽  
...  

Abstract Various cell aggregate culture technologies have been developed and actively applied to tissue engineering and organ-on-a-chip. However, the conventional culture technologies are labor-intensive, and their outcomes are highly user dependent. In addition, the technologies cannot be used to produce three-dimensional (3D) complex tissues. In this regard, 3D cell aggregate printing technology has attracted increased attention from many researchers owing to its 3D processability. The technology allows the fabrication of 3D freeform constructs using multiple types of cell aggregates in an automated manner. Technological advancement has resulted in the development of a printing technology with a high resolution of approximately 20 μm in 3D space. A high-speed printing technology that can print a cell aggregate in milliseconds has also been introduced. The developed aggregate printing technologies are being actively applied to produce various types of engineered tissues. Although various types of high-performance printing technologies have been developed, there are still some technical obstacles in the fabrication of engineered tissues that mimic the structure and function of native tissues. This review highlights the central importance and current technical level of 3D cell aggregate printing technology, and their applications to tissue/disease models, artificial tissues, and drug-screening platforms. The paper also discusses the remaining hurdles and future directions of the printing processes.

1994 ◽  
Vol 6 (3) ◽  
pp. 225-235 ◽  
Author(s):  
Shinji Sakurai ◽  
Bruce Elliott ◽  
J. Robert Grove

Three-dimensional (3-D) high speed photography was used to record the overarm throwing actions of five open-age, four 18-year-old, six 16-year- old, and six 14-year-old high-performance baseball catchers. The direct linear transformation method was used for 3-D space reconstruction from 2-D images of the catchers throwing from home plate to second base recorded using two phase-locked cameras operating at a nominal rate of 200 Hz. Selected physical capacity measures were also recorded and correlated with ball release speed. In general, anthropometric and strength measures significantly increased through the 14-year-old to open-age classifications, while a range of correlation coefficients from .50 to .84 was recorded between these physical capacities and ball speed at release. While many aspects of the kinematic data at release were similar, the key factors of release angle and release speed varied for the different age groups.


Metals ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 1664
Author(s):  
Do Hoon Cho ◽  
Seong Min Seo ◽  
Jang Baeg Kim ◽  
Sri Harini Rajendran ◽  
Jae Pil Jung

With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging.


Author(s):  
Jifeng Wang ◽  
Qubo Li ◽  
Norbert Mu¨ller

A mechanical and optimal analyses procedure is developed to assess the stresses and deformations of Novel Wound Composite Axial-Impeller under loading conditions particular to centrifuge. This procedure is based on an analytical method and Finite Element Analysis (FEA, commercial software ANSYS) results. A low-cost, light-weight, high-performance, composite turbomachinery impeller from differently designed patterns will be evaluated. Such impellers can economically enable refrigeration plants using water as a refrigerant (R718). To create different complex patterns of impellers, MATLAB is used for creating the geometry of impellers, and CAD software UG is used to build three-dimensional impeller models. Available loading conditions are: radial body force due to high speed rotation about the cylindrical axis and fluid forces on each blade. Two-dimensional plane stress and three-dimensional stress finite element analysis are carried out using ANSYS to validate these analytical mechanical equations. The von Mises stress is investigated, and maximum stress and Tsai-Wu failure criteria are applied for composite material failure, and they generally show good agreement.


2011 ◽  
Vol 337 ◽  
pp. 46-49
Author(s):  
Li Hua Song ◽  
Jun Yuan Kang

In accordance with the latest development direction in the filed of strengthening the heat transfer technology of strengthening the heat transfer on division of strengthening heat transfer by international authoritative Professor A.E. Bergle), including 3D(three-dimensional) heat transfer of ultra-high performance improved in the fins of the design and analysis; 3D heat transfer strengthening of the plowing process mechanism the flexibility ,high speed and high precision of gathered tools and the realization of a 3D digital design and manufacturing . It also researches on the influential law of process parameters on the formation of the fin. It is shown that the whole fin-forming process can be classified into three stages:plowing,heaving and fins forming, and that the front angle,plowing depth and the plowing speed are the main factors influencing the fin forming. Moreover,within a certain range,the height of fin increases with the front angle and the plowing depth.


2013 ◽  
Vol 10 (82) ◽  
pp. 20121028 ◽  
Author(s):  
Egon Heiss ◽  
Nikolay Natchev ◽  
Michaela Gumpenberger ◽  
Anton Weissenbacher ◽  
Sam Van Wassenbergh

During the evolutionary transition from fish to tetrapods, a shift from uni- to bidirectional suction feeding systems followed a reduction in the gill apparatus. Such a shift can still be observed during metamorphosis of salamanders, although many adult salamanders retain their aquatic lifestyle and feed by high-performance suction. Unfortunately, little is known about the interplay between jaws and hyobranchial motions to generate bidirectional suction flows. Here, we study the cranial morphology, as well as kinematic and hydrodynamic aspects related to prey capture in the Chinese giant salamander ( Andrias davidianus ). Compared with fish and previously studied amphibians, A. davidianus uses an alternative suction mechanism that mainly relies on accelerating water by separating the ‘plates’ formed by the long and broad upper and lower jaw surfaces. Computational fluid dynamics simulations, based on three-dimensional morphology and kinematical data from high-speed videos, indicate that the viscerocranial elements mainly serve to accommodate the water that was given a sufficient anterior-to-posterior impulse beforehand by powerful jaw separation. We hypothesize that this modified way of generating suction is primitive for salamanders, and that this behaviour could have played an important role in the evolution of terrestrial life in vertebrates by releasing mechanical constraints on the hyobranchial system.


2014 ◽  
Vol 30 (2) ◽  
pp. 206-212 ◽  
Author(s):  
Grace Smith ◽  
Mark Lake ◽  
Adrian Lees

The metatarsophalangeal joint is an important contributor to lower limb energetics during sprint running. This study compared the kinematics, kinetics and energetics of the metatarsophalangeal joint during sprinting barefoot and wearing standardized sprint spikes. The aim of this investigation was to determine whether standard sprinting footwear alters the natural motion and function of the metatarsophalangeal joint exhibited during barefoot sprint running. Eight trained sprinters performed maximal sprints along a runway, four sprints in each condition. Three-dimensional high-speed (1000 Hz) kinematic and kinetic data were collected at the 20 m point. Joint angle, angular velocity, moment, power and energy were calculated for the metatarsophalangeal joint. Sprint spikes significantly increase sprinting velocity (0.3 m/s average increase), yet limit the range of motion about the metatarsophalangeal joint (17.9% average reduction) and reduce peak dorsiflexion velocity (25.5% average reduction), thus exhibiting a controlling affect over the natural behavior of the foot. However, sprint spikes improve metatarsophalangeal joint kinetics by significantly increasing the peak metatarsophalangeal joint moment (15% average increase) and total energy generated during the important push-off phase (0.5 J to 1.4 J). The results demonstrate substantial changes in metatarsophalangeal function and potential improvements in performance-related parameters due to footwear.


2020 ◽  
Vol 10 (3) ◽  
pp. 748
Author(s):  
Dipesh Kapoor ◽  
Cher Ming Tan ◽  
Vivek Sangwan

Advancements in the functionalities and operating frequencies of integrated circuits (IC) have led to the necessity of measuring their electromagnetic Interference (EMI). Three-dimensional integrated circuit (3D-IC) represents the current advancements for multi-functionalities, high speed, high performance, and low-power IC technology. While the thermal challenges of 3D-IC have been studied extensively, the influence of EMI among the stacked dies has not been investigated. With the decreasing spacing between the stacked dies, this EMI can become more severe. This work demonstrates the potential of EMI within a 3D-IC numerically, and determines the minimum distance between stack dies to reduce the impact of EMI from one another before they are fabricated. The limitations of using near field measurement for the EMI study in stacked dies 3D-IC are also illustrated.


2011 ◽  
Vol 199-200 ◽  
pp. 68-71
Author(s):  
Zhen Ping Liu ◽  
Shu Lian Liu ◽  
Shui Ying Zheng

As non-contact seal, labyrinth seal is widely used in rotor system of high speed. However, with the development of turbo-machinery toward high performance and huge capacity, gas excitation vibration within the labyrinth seal becomes the main reason threatening safe operating of machinery sets. Recently three dimensional computational fluid dynamic was applied to analyse inside flow in labyrinth seal. These researches, while greatly improve rotordynamic prediction of labyrinth seals, are mostly focused in steady calculation. In fact, rotor inside the seal is whirling in a nonlinear behaviour, which makes the flow unstable. In an effort to analyse the non-linear behaviour of flow in labyrinth seal, this paper utilizes an improved dynamic mesh technology to realize unsteady calculation. The Reynolds Averaged Navier Stokes equations is solved by a commercial CFD program, FLUENT. Steady calculations are firstly done to determine mesh density and turbulence model, then an unsteady analysis is used to study gas excitation force. The influence of initial condition to the unsteady analysis is discussed. This method allows modeling of rotor orbit around the eccentric position and gives prediction of nolinear gas excitation force.


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