Failure analysis of coated galvanized steel panels

2017 ◽  
Vol 64 (4) ◽  
pp. 424-431
Author(s):  
Anwar Ul-Hamid ◽  
Huseyin Saricimen ◽  
Abdul Quddus ◽  
Luai M. Al-Hems
Keyword(s):  
Light Microscopy ◽  
Failure Analysis ◽  
Metal Sheet ◽  
Galvanized Steel ◽  
Bottom Surface ◽  
Atmospheric Conditions ◽  
Content Type ◽  
X Ray ◽  
Cause Of Failure ◽  
Steel Panels

Purpose The purpose of this paper was to determine the mode and cause of failure of polyester-coated galvanized corrugated steel sheets that exhibited degradation of the coating after seven months into service. Design/methodology/approach Visual inspection and light microscopy revealed the extent of damage exhibited by the panels. Standard metallographic techniques were used to prepare samples obtained from both unused and failed sections. Light microscopy, scanning electron microscopy combined with energy dispersive x-ray spectroscopy and x-ray diffraction techniques were used to study the surface morphology, microstructural features, elemental composition and structure of the samples. Findings The failure occurred in the form of delamination and blistering of coated layer. Presence of solar radiation, humidity and water retention resulted in loss of adhesion, leading to coating delamination and flaking especially at the top surface. The coating at the bottom surface of the panels showed evidence of blistering caused by water vapor differential that existed between the environment and the coating because of prolonged (four months) wet conditions that existed at the manufacturer’s site during storage. Practical implications It is recommended that the coated panels are stored in covered area where direct exposure to atmospheric conditions can be prevented. If open storage is unavoidable, then the use of tarpaulin or plastic sheet as covering and vapor-phase inhibitors was recommended. Originality/value This paper provides an account of failure analysis of metal sheet panels. It identifies the mode and cause of failure and also provides recommendations to avoid such occurrences in the future. The information contained in this paper is useful for plant engineers and project managers working in the metal sheet industry.

Infra-Red Reflectance Microscopy (IRRM) for Daisy Chain Flip Chip Device Failure Analysis

2004 ◽  
Author(s):  
Carlo Grilletto ◽  
Steve Hsiung ◽  
Andrew Komrowski ◽  
John Soopikian ◽  
Daniel J.D. Sullivan ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
State Of The Art ◽  
Failure Mechanisms ◽  
Simple Metal ◽  
X Ray ◽  
Infra Red ◽  
Cause Of Failure ◽  
Reflectance Microscopy ◽  
Ir Emission

Abstract This paper describes a method to "non-destructively" inspect the bump side of an assembled flip-chip test die. The method is used in conjunction with a simple metal-connecting "modified daisy chain" die and makes use of the fact that polished silicon is transparent to infra-red (IR) light. The paper describes the technique, scope of detection and examples of failure mechanisms successfully identified. It includes an example of a shorting anomaly that was not detectable with the state of the art X-ray equipment, but was detected by an IR emission microscope. The anomalies, in many cases, have shown to be the cause of failure. Once this has been accomplished, then a reasonable deprocessing plan can be instituted to proceed with the failure analysis.

Failure analysis of epoxy molded IC packages

2016 ◽  
Vol 33 (2) ◽  
pp. 94-101
Author(s):  
Kamil Janeczek ◽  
Aneta Arazna ◽  
Konrad Futera ◽  
Grazyna Koziol
Keyword(s):  
Failure Analysis ◽  
Sulphuric Acid ◽  
Electronic Devices ◽  
Mechanical Grinding ◽  
Content Type ◽  
Power Mosfets ◽  
X Ray ◽  
Non Destructive ◽  
Practical Implications ◽  
Graphic Software

Purpose The aim of this paper is to present non-destructive and destructive methods of failure analysis of epoxy moulded IC packages on the example of power MOSFETs in SOT-227 package. Design/methodology/approach A power MOSFET in SOT-227 package was examined twice using X-ray inspection, at first as the whole component to check if it is damaged and then after removing the upper part of package by mechanical grinding. The purpose of the second X-ray inspection was to prepare images for estimation of the total number and approximate location of voids in soft solder layers. Finally, power MOSFETs were subjected to decapsulation process using a concentrated sulphuric acid to verify existence of damage areas noticed during X-ray analysis and to observe other possible failures such as cracks in aluminium metallization or wires deformation. Findings X-ray analysis was revealed to be adequate technique to detect damage (e.g. meltings) in power MOSFETs in SOT-227 package, but only when tested components were analysed in the side view. This type of analysis combined with a graphic software is also suitable for voids estimation in soft solder layers. Moreover, it was found that a single acid (concentrated sulphuric acid) at elevated temperature can be successfully used for decapsulation of power MOSFETs in SOT-227 package without damage of aluminium metallization and aluminium wires. Such decapsulation process enables analysis of defects in wire, die and package materials. Research limitations/implications Further investigations are required to examine if the presented methods of failures analysis can be used for other types of components (e.g. high power resistors) in similar packages. Practical/implications The described methods of failure analysis can find application in electronic industry to select components which are free of damage and in effect which allow to produce high reliable devices. Apart from it, the presented method is applicable to evaluate reasons of improper work of tested electronic devices and to identify faked components. Originality/value This paper contains valuable information for research and technical staff involved in the assessment of electronic devices who needs practical methods of failure analysis of epoxy moulded IC packages.

Failure Analysis of Killer Defects and Yield Enhancement of Flat ROM Devices in Wafer Fabrication

2000 ◽  
Author(s):  
Y. N. Hua ◽  
Z. R. Guo ◽  
L. H. An ◽  
Shailesh Redkar
Keyword(s):  
Electron Microscope ◽  
Failure Analysis ◽  
Fault Isolation ◽  
Yield Enhancement ◽  
Wafer Fabrication ◽  
X Ray ◽  
Particle Contamination ◽  
Emission Microscopy ◽  
Microscopy Techniques ◽  
Scanning Electron

Abstract In this paper, some low yield cases in Flat ROM device (0.45 and 0.6 µm) were investigated. To find killer defects and particle contamination, KLA, bitmap and emission microscopy techniques were used in fault isolation. Reactive ion etching (RIE) and chemical delayering, 155 Wright Etch, BN+ Etch and scanning electron microscope (SEM) were used for identification and inspection of defects. In addition, energy-dispersive X-ray microanalysis (EDX) was used to determine the composition of the particle or contamination. During failure analysis, seven kinds of killer defects and three killer particles were found in Flat ROM devices. The possible root causes, mechanisms and elimination solutions of these killer defects/particles were also discussed.

Reballing/Rebumping Ultra-Fine Pitch Packages Less Than 0.5 mm Pitch for FA

2014 ◽  
Author(s):  
Bob Wettermann
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Joint Strength ◽  
Semiconductor Devices ◽  
X Ray ◽  
Fine Pitch ◽  
Manual Methods

Abstract As the pitch and package sizes of semiconductor devices have shrunk and their complexity has increased, the manual methods by which the packages can be re-bumped or reballed for failure analysis have not kept up with this miniaturization. There are some changes in the types of reballing preforms used in these manual methods along with solder excavation techniques required for packages with pitches as fine as 0.3mm. This paper will describe the shortcomings of the previous methods, explain the newer methods and materials and demonstrate their robustness through yield, mechanical solder joint strength and x-ray analysis.

Case Study—Failure Analysis of a Multiplexer

2016 ◽  
Author(s):  
Michael Woo ◽  
Marcos Campos ◽  
Luigi Aranda
Keyword(s):  
Failure Analysis ◽  
High Reliability ◽  
Component Failure ◽  
Root Cause ◽  
Knowing That ◽  
Cause Of Failure ◽  
The Cost

Abstract A component failure has the potential to significantly impact the cost, manufacturing schedule, and/or the perceived reliability of a system, especially if the root cause of the failure is not known. A failure analysis is often key to mitigating the effects of a componentlevel failure to a customer or a system; minimizing schedule slips, minimizing related accrued costs to the customer, and allowing for the completion of the system with confidence that the reliability of the product had not been compromised. This case study will show how a detailed and systemic failure analysis was able to determine the exact cause of failure of a multiplexer in a high-reliability system, which allowed the manufacturer to confidently proceed with production knowing that the failure was not a systemic issue, but rather that it was a random “one time” event.

Electronic Package Failure Analysis Using TDR

2000 ◽  
Author(s):  
Dima A. Smolyansky
Keyword(s):  
Failure Analysis ◽  
Fault Location ◽  
Measurement Accuracy ◽  
Time Domain Reflectometry ◽  
Acoustic Imaging ◽  
X Ray ◽  
Analysis Techniques ◽  
Bga Packages ◽  
Impedance Profile ◽  
Nature Of Time

Abstract The visual nature of Time Domain Reflectometry (TDR) makes it a very natural technology that can assist with fault location in BGA packages, which typically have complex interweaving layouts that make standard failure analysis techniques, such as acoustic imaging and X-ray, less effective and more difficult to utilize. This article discusses the use of TDR for package failure analysis work. It analyzes in detail the TDR impedance deconvolution algorithm as applicable to electronic packaging fault location work, focusing on the opportunities that impedance deconvolution and the resulting true impedance profile opens up for such work. The article examines the TDR measurement accuracy and the comparative package failure analysis, and presents three main considerations for package failure analysis. It also touches upon the goal and the task of the failure analysts and TDR's specific signatures for the open and short connections.

Characteristic properties of AlTiN and TiN coated HSS materials

2015 ◽  
Vol 67 (2) ◽  
pp. 172-180 ◽  
Author(s):  
Mumin Sahin ◽  
Cenk Misirli ◽  
Dervis Özkan
Keyword(s):  
Surface Roughness ◽  
Tensile Strength ◽  
High Speed ◽  
Cutting Tools ◽  
High Speed Steel ◽  
Wear Properties ◽  
Content Type ◽  
X Ray ◽  
Number Of Cycles ◽  
Future Work

Purpose – The purpose of this paper is to examine mechanical and metallurgical properties of AlTiN- and TiN-coates high-speed steel (HSS) materials in detail. Design/methodology/approach – In this study, HSS steel parts have been processed through machining and have been coated with AlTiN and TiN on physical vapour deposition workbench at approximately 6,500°C for 4 hours. Tensile strength, fatigue strength, hardness tests for AlTiN- and TiN-coated HSS samples have been performed; moreover, energy dispersive X-ray spectroscopy and X-ray diffraction analysis and microstructure analysis have been made by scanning electron microscopy. The obtained results have been compared with uncoated HSS components. Findings – It was found that tensile strength of TiAlN- and TiN-coated HSS parts is higher than that of uncoated HSS parts. Highest tensile strength has been obtained from TiN-coated HSS parts. Number of cycles for failure of TiAlN- and TiN-coated HSS parts is higher than that for HSS parts. Particularly TiN-coated HSS parts have the most valuable fatigue results. However, surface roughness of fatigue samples may cause notch effect. For this reason, surface roughness of coated HSS parts is compared with that of uncoated ones. While the average surface roughness (Ra) of the uncoated samples was in the range of 0.40 μm, that of the AlTiN- and TiN-coated samples was in the range of 0.60 and 0.80 μm, respectively. Research limitations/implications – It would be interesting to search different coatings for cutting tools. It could be the good idea for future work to concentrate on wear properties of tool materials. Practical implications – The detailed mechanical and metallurgical results can be used to assess the AlTiN and TiN coating applications in HSS materials. Originality/value – This paper provides information on mechanical and metallurgical behaviour of AlTiN- and TiN-coated HSS materials and offers practical help for researchers and scientists working in the coating area.

Study in performance and morphology of polyamide 12 produced by selective laser sintering technology

2018 ◽  
Vol 24 (5) ◽  
pp. 813-820 ◽  
Author(s):  
Junjie Wu ◽  
Xiang Xu ◽  
Zhihao Zhao ◽  
Minjie Wang ◽  
Jie Zhang
Keyword(s):  
Selective Laser Sintering ◽  
Polarized Light ◽  
Chain Scission ◽  
High Energy ◽  
Laser Sintering ◽  
X Ray Diffraction ◽  
Scanning Calorimetry ◽  
Content Type ◽  
X Ray ◽  
Polyamide 12

Purpose The purpose of this paper is to investigate the effect of selective laser sintering (SLS) method on morphology and performance of polyamide 12. Design/methodology/approach Crystallization behavior is critical to the properties of semi-crystalline polymers. The crystallization condition of SLS process is much different from others. The morphology of polyamide 12 produced by SLS technology was investigated using scanning electron microscopy, polarized light microscopy, differential scanning calorimetry, X-ray diffraction and wide-angle X-ray diffraction. Findings Too low fill laser power brought about bad fusion of powders, while too high energy input resulted in bad performance due to chain scission of macromolecules. There were three types of crystal in the raw powder material, denoted as overgrowth crystal, ring-banded spherulite and normal spherulite. Originality/value In this work, SLS samples with different sintering parameters, as well as compression molding sample for the purpose of comparison, were made to study the morphology and crystal structure of sintered PA12 in detail.

Anterior sacral meningocele contiguous with a pelvic hamartoma

1984 ◽  
Vol 61 (1) ◽  
pp. 188-190 ◽  
Author(s):  
Eugene Leibowitz ◽  
William Barton ◽  
Parvis Sadighi ◽  
Jeffrey S. Ross
Keyword(s):  
Computerized Tomography ◽  
Content Type ◽  
Transabdominal Approach ◽  
X Ray ◽  
Anterior Sacral Meningocele ◽  
Fine Print

✓ A patient with an anterior sacral meningocele combined with a hamartoma was diagnosed with x-ray films, myelography, and computerized tomography. She was successfully operated on by a transabdominal approach.

scholarly journals Nitro/Nitrosyl-Ruthenium Complexes Are Potent and Selective Anti-Trypanosoma cruzi Agents Causing Autophagy and Necrotic Parasite Death

2014 ◽  
Vol 58 (10) ◽  
pp. 6044-6055 ◽  
Author(s):  
Tanira M. Bastos ◽  
Marília I. F. Barbosa ◽  
Monize M. da Silva ◽  
José W. da C. Júnior ◽  
Cássio S. Meira ◽  
...  
Keyword(s):  
Trypanosoma Cruzi ◽  
Inhibitory Concentration ◽  
Content Type ◽  
X Ray ◽  
X Ray Crystallography ◽  
Ruthenium Nitrosyl ◽  
Index Analysis ◽  
Antiparasitic Drug ◽  
Drug Complex

ABSTRACTcis-[RuCl(NO2)(dppb)(5,5′-mebipy)] (complex 1),cis-[Ru(NO2)2(dppb)(5,5′-mebipy)] (complex 2),ct-[RuCl(NO)(dppb)(5,5′-mebipy)](PF6)2(complex 3), andcc-[RuCl(NO)(dppb)(5,5′-mebipy)](PF6)2(complex 4), where 5,5′-mebipy is 5,5′-dimethyl-2,2′-bipyridine and dppb is 1,4-bis(diphenylphosphino)butane, were synthesized and characterized. The structure of complex 2 was determined by X-ray crystallography. These complexes exhibited a higher anti-Trypanosoma cruziactivity than benznidazole, the current antiparasitic drug. Complex 3 was the most potent, displaying a 50% effective concentration (EC50) of 2.1 ± 0.6 μM against trypomastigotes and a 50% inhibitory concentration (IC50) of 1.3 ± 0.2 μM against amastigotes, while it displayed a 50% cytotoxic concentration (CC50) of 51.4 ± 0.2 μM in macrophages. It was observed that the nitrosyl complex 3, but not its analog lacking the nitrosyl group, releases nitric oxide into parasite cells. This release has a diminished effect on the trypanosomal protease cruzain but induces substantial parasite autophagy, which is followed by a series of irreversible morphological impairments to the parasites and finally results in cell death by necrosis. In infected mice, orally administered complex 3 (five times at a dose of 75 μmol/kg of body weight) reduced blood parasitemia and increased the survival rate of the mice. Combination index analysis of complex 3 indicated that itsin vitroactivity against trypomastigotes is synergic with benznidazole. In addition, drug combination enhanced efficacy in infected mice, suggesting that ruthenium-nitrosyl complexes are potential constituents for drug combinations.

Sign in / Sign up

Export Citation Format

Share Document