A 10-GHz 15-dB Four-Stage Distributed Amplifier in 0.18 μm CMOS Process

2006 ◽  
Author(s):  
K.K. Moez ◽  
M.I. Elmasry
Keyword(s):  
Cmos Process ◽  
Distributed Amplifier

A High Bandwidth (DC-40 GHz) Pseudo Differential Distributed Amplifier in 0.18-μm RF CMOS

2017 ◽  
Vol 26 (12) ◽  
pp. 1750191 ◽  
Author(s):  
Majid Babaeinik ◽  
Massoud Dousti ◽  
Mohammad Bagher Tavakoli
Keyword(s):  
Return Loss ◽  
Noise Figure ◽  
Cmos Process ◽  
Rf Cmos ◽  
Bandwidth Extension ◽  
Distributed Amplifier ◽  
High Bandwidth ◽  
Simulation Results ◽  
Minimum Noise ◽  
Minimum Noise Figure

This study presents a CMOS distributed amplifier (DA) with pseudo differential amplifying that achieves DC-40[Formula: see text]GHz bandwidth (BW) in 0.18-[Formula: see text]m RF CMOS process. The DA with three-stage amplifying cells was proposed to improve the DA performance. The inter-stage was composed of pseudo differential amplifying for bandwidth extension. By incorporating the pseudo differential amplifier configuration and capacitor-less circuit in the stages, the DA provides average gain and high bandwidth. The simulation results showed that the DA has a S[Formula: see text] of 6.4[Formula: see text]dB, 3-dB BW from DC up to 40[Formula: see text]GHz. It also has a minimum noise figure (NF) of 4.27[Formula: see text]dB, one dB compression point (P[Formula: see text] of [Formula: see text]3.5[Formula: see text]dBm, a high reverse isolation S[Formula: see text] of less than [Formula: see text]15[Formula: see text]dB, an input return loss S[Formula: see text] and output return loss S[Formula: see text] of less than [Formula: see text]16 and [Formula: see text]12[Formula: see text]dB, respectively. It consumes 115[Formula: see text]mW and occupies a total active area of 0.27[Formula: see text]mm2.

A 3-to-78GHz Differential Distributed Amplifier with Ultra- Balanced Active Balun and Gain Boosting Techniques in 65-nm CMOS Process

2021 ◽  
Author(s):  
Jincheng Zhang ◽  
Tianxiang Wu ◽  
Yong Chen ◽  
Junyan Ren ◽  
Shunli Ma
Keyword(s):  
Cmos Process ◽  
Distributed Amplifier ◽  
Active Balun

scholarly journals Design and Performance Investigation of a New Distributed Amplifier Architecture for 40 and 100 Gb/s Optical Receivers

2015 ◽  
Vol 14 (5) ◽  
pp. 5661-5686
Author(s):  
Essra E. Al-Bayati ◽  
R. S. Fyath
Keyword(s):  
Communication Systems ◽  
Noise Figure ◽  
Complementary Metal Oxide Semiconductor ◽  
Low Noise ◽  
Ultra Wideband ◽  
Oxide Semiconductor ◽  
Cmos Process ◽  
Optical Receivers ◽  
Distributed Amplifier ◽  
Design Scheme

The design of distributed amplifiers (DAs) is one of the challenging aspects in emerging ultra high bit rate optical communication systems. This is especially important when implementation in submicron silicon complementary metal oxide semiconductor (CMOS) process is considered. This work presents a novel design scheme for DAs suitable for frontend amplification in 40 and 100 Gb/s optical receivers. The goal is to achieve high flat gain and low noise figure (NF) over the ultra wideband operating bandwidth (BW). The design scheme combines shifted second tire (SST) matrix configuration with cascode amplification cell configuration and uses m-derived technique. Performance investigation of the proposed DA architecture is carried out and the results are compared with that of other DA architectures reported in the literature. The investigation covers the gain and NF spectra when the DAs are implemented in 180, 130, 90, 65 and 45 CMOS standards.The simulation results reveal that the proposed DA architecture offers the highest gain with highest degree of flatness and low NF when compared with other DA configurations. Gain-BW products of 42772 and 21137 GHz are achieved when the amplifier is designed for 40 and 100 Gb/s operation, respectively, using 45 nm CMOS standard. Thesimulation is performed using AWR Microwave Office (version 10).

Heterogeneous Integration of Boost Power Supply and On-Chip Solar Cell using triple well CMOS Process

2018 ◽  
Vol 138 (1) ◽  
pp. 41-49
Author(s):  
Kazuma Igarashi ◽  
Yoshimasa Minami ◽  
Nobuhiko Nakano
Keyword(s):  
Solar Cell ◽  
Power Supply ◽  
Heterogeneous Integration ◽  
Cmos Process ◽  
On Chip

Dual Damascene Process for FatWires in Copper/FSG Technology

2003 ◽  
Vol 766 ◽  
Author(s):  
J. Gambino ◽  
T. Stamper ◽  
H. Trombley ◽  
S. Luce ◽  
F. Allen ◽  
...  
Keyword(s):  
Line Width ◽  
Lower Cost ◽  
Process Window ◽  
Cmos Process ◽  
Dual Damascene ◽  
Damascene Process ◽  
Interconnect Technology

AbstractA trench-first dual damascene process has been developed for fat wires (1.26 μm pitch, 1.1 μm thickness) in a 0.18 μm CMOS process with copper/fluorosilicate glass (FSG) interconnect technology. The process window for the patterning of vias in such deep trenches depends on the trench depth and on the line width of the trench, with the worse case being an intermediate line width (lines that are 3X the via diameter). Compared to a single damascene process, the dual damascene process has comparable yield and reliability, with lower via resistance and lower cost.

A 5-bit 4.2-GS/s Flash ADC in 0.13-µm CMOS Process

2009 ◽  
Vol E92-C (2) ◽  
pp. 258-268 ◽  
Author(s):  
Ying-Zu LIN ◽  
Soon-Jyh CHANG ◽  
Yen-Ting LIU
Keyword(s):  
Cmos Process ◽  
Flash Adc

CMOS-Process Compatible Embedded Sensors for Power Electronics Devices

2019 ◽  
Author(s):  
Stephen Batcup
Keyword(s):  
Power Electronics ◽  
Embedded Sensors ◽  
Cmos Process

A Fully Differential Variable Gain Amplifier for Portable Impedance Sensing Applications

2019 ◽  
Vol 7 ◽  
Author(s):  
Jorge Pérez Bailón ◽  
Jaime Ramírez-Angulo ◽  
Belén Calvo ◽  
Nicolás Medrano
Keyword(s):  
Power Consumption ◽  
Active Area ◽  
Variable Gain Amplifier ◽  
Cmos Process ◽  
Current Steering ◽  
Impedance Sensing ◽  
Variable Gain ◽  
Fully Differential ◽  
Sensing Applications ◽  
Constant Bandwidth

This paper presents a Variable Gain Amplifier (VGA) designed in a 0.18 μm CMOS process to operate in an impedance sensing interface. Based on a transconductance-transimpedance (TC-TI) approach with intermediate analog-controlled current steering, it exhibits a gain ranging from 5 dB to 38 dB with a constant bandwidth around 318 kHz, a power consumption of 15.5 μW at a 1.8 V supply and an active area of 0.021 mm2.

Burn-in Failure Analysis of 0.5μm 1MB SRAM: Barrier Glue Layer Cracks and Tungsten Plug “Worm Holes”

1996 ◽  
Author(s):  
E. Widener ◽  
S. Tatti ◽  
P. Schani ◽  
S. Crown ◽  
B. Dunnigan ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Product Quality ◽  
Cmos Process ◽  
Designed Experiments ◽  
Root Cause ◽  
Poly Silicon ◽  
New Process ◽  
Supply Current ◽  
Electrical Analysis ◽  
Current Characteristics

Abstract A new 0.5 um 1 Megabit SRAM which employed a double metal, triple poly CMOS process with Tungsten plug metal to poly /silicon contacts was introduced. During burn-in of this product, high currents, apparently due to electrical overstress, were experienced. Electrical analysis showed abnormal supply current characteristics at high voltages. Failure analysis identified the sites of the high currents of the bum-in rejects and discovered cracks in the glue layer prior to Tungsten deposition as the root cause of the failure. The glue layer cracks allowed a reaction with the poly/silicon, causing opens at the bottom of contacts. These floating nodes caused high currents and often latch-up during burn-in. Designed experiments in the wafer fab identified an improved glue layer process, which has been implemented. The new process shows improvement in burn in performance as well as outgoing product quality.

Analysis of 6T SRAM Cell in Different Technologies

2017 ◽  
Vol MCSP2017 (01) ◽  
pp. 7-10 ◽  
Author(s):  
Subhashree Rath ◽  
Siba Kumar Panda
Keyword(s):  
Low Power ◽  
Data Storage ◽  
Low Voltage ◽  
Random Access ◽  
Storage Device ◽  
Cmos Process ◽  
Process Technology ◽  
Digital Devices ◽  
Noise Margin ◽  
Sram Cell

Static random access memory (SRAM) is an important component of embedded cache memory of handheld digital devices. SRAM has become major data storage device due to its large storage density and less time to access. Exponential growth of low power digital devices has raised the demand of low voltage low power SRAM. This paper presents design and implementation of 6T SRAM cell in 180 nm, 90 nm and 45 nm standard CMOS process technology. The simulation has been done in Cadence Virtuoso environment. The performance analysis of SRAM cell has been evaluated in terms of delay, power and static noise margin (SNM).

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